The present invention relates to the field of wireless communication technologies, and in particular to a patch antenna composed of bonding wires and its application.
Millimeter waves (mmWave) represent the next radio technology, with a 10-times increase in frequency and a 10-times increase in signal bandwidth compared to the most advanced Wi-Fi and 4G technologies. The current 4G network operates in the 700 MHz to 2.6 GHz band, while millimeter waves will operate over a nearly 20 GHz underutilized spectrum in 28 GHz, 39 GHz and 60 GHz bands. The millimeter-wave wireless technology provides companies with a range of mobile data rates up to multiple Gbps in the development of new wireless products.
The millimeter wave technology can provide higher data rates and better spectral efficiencies, thus enhancing existing base stations and providing new applications. The successful deployment and acceptance will depend on its proven performance and reliability, which can only be achieved with complicated test equipment. Despite a large number of usage scenarios, this equipment must be able to provide extensive testing quickly and efficiently.
As an expected next wireless initiative for a few years to come, 5G will incorporate the millimeter-wave band employing “new radio (NR)” technology. The technology seamlessly combines authorizations, and shares licensed and unlicensed spectrums across radio technologies. 5G base stations will support and transparently interface with old technologies, therefore the millimeter wave technology will be widely applied.
Since the length and width of the patch antenna are of finite lengths, there is a phenomenon of fringing field, called fringing effect, in the field (radiating slots) near the metal edge of the antenna patch.
The present invention aims to provide a patch antenna composed of bonding wires, and its application to solve the problem brought up in the above background technology.
To achieve the above object, the present invention provides the following technical schemes:
A patch antenna composed of several sets of bonding wires, which are connected to each other, combined into different antenna lengths, and disposed in radiation slots on one side of the patch.
As a further scheme of the invention, the manner in which the bonding wires are combined into different antenna lengths includes a combination of different numbers of bonding wires (1), a combination of the bonding wires with different lengths, and a combination of the bonding wires with different heights.
The application of a patch antenna comprising bonding wires in the millimeter wave technology.
Compared with the prior art, the beneficial effects of the present invention are as follows:
The present invention adopts a mode in which bonding wires are directly combined into an antenna, and patch antennas with different combined bonding wires bear different frequencies. Therefore, in the production, the PCB structure can be designed first, and then the antenna frequency can be designed by product requirements, so that different wireless communications are satisfied, especially the use of millimeter wave radar antennas. Since the antenna is completely composed of bonding wires, when there is a signal input, current flows from bottom to top in the bonding wire, resulting in a higher axial ratio. Furthermore, since the wavelength of high frequencies is short, the antenna of the present invention may be made very small in size.
The technical scheme in the embodiment of the present invention will be clearly and completely described as follows with reference to the accompanying drawings. Apparently, the described embodiments are only a part of that of the invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without making creative efforts shall fall within the scope of protection of the present invention.
Refer to
A patch antenna with a length of L composed of several sets of bonding wires 1, specifically including the antenna comprising different numbers of bonding wires 1, the antenna comprising different lengths of bonding wires or the antenna with different heights of bonding wires. The patch antenna thus designed bears different frequencies. Therefore, in the production, the PCB structure can be designed first, and then the antenna frequency can be designed by product requirements, so that different wireless communications are satisfied, especially the use of millimeter wave radar antennas. In addition, since the antenna is completely composed of bonding wires, when there is a signal input, current flows from bottom to top in the bonding wires 1, resulting in a higher axial ratio.
For those skilled in the art, apparently the present invention is not limited to the details given in the above exemplary embodiments. The present invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments shall be considered as exemplary and unrestricted in any way. The scope of the invention is defined by the appended claims rather than the above description. Hence, all changes intended to come within the meaning and range of equivalent elements of the claims shall be included within the invention. Any marks on drawings to the Claims shall not be construed as limiting the Claims involved.
Furthermore, it shall be understood that although the Specification is described in terms of embodiments, not every embodiment includes only one independent technical scheme. The description style in the Specification is for clarity only. Those skilled in the art shall take the Specification as a whole. The technical schemes in various embodiments may also be combined as appropriate to form other embodiments that can be understood by those skilled in the art.
Number | Date | Country | Kind |
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201810975883.6 | Aug 2018 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2018/102930 | 8/29/2018 | WO | 00 |