This invention relates to wire electrical discharge machining.
Electrical Discharge Machining (EDM) is a machining process which is widely used in the manufacture of precision components. In EDM, a pulsed voltage is applied between a tool and a workpiece which are physically separated by a small gap of the order of 10-50 μm, in the presence of a dielectric fluid. Heat generated by controlled, rapid and repetitive electrical spark discharges occurring between the tool and the workpiece is utilized to melt, vapourise and remove workpiece material.
Wire EDM is a variant of the EDM process, in which the tool electrode is in the form of a flexible wire, typically about 300 μm or less in diameter, which translates along its axis. This process is well adapted for machining intricate geometries in hard materials with high precision. However, major shortcomings are:
(i) low material removal rate which renders the process rather slow and expensive, and
(ii) the presence of a crack-infested re-cast layer of work material on the machined surface due to poor material ejection efficiency which necessitates time-consuming post-EDM finishing operations such as polishing for critical high performance components to improve fatigue life, see for example U.S. Pat. No. 4,367,389 and US 2005/0102809.
A requirement to develop more environmentally friendly processing methods has seen the emergence of the dry or near-dry EDM process. This process uses a gas such as air or oxygen in the discharge gap in place of conventional oils or de-ionized water. However, use of this process is currently limited because of re-deposition of machining debris as well as low removal rates due to frequent shorting.
The wire saw process is widely used in the manufacture of wafers in the semiconductor industry. Initial developments in wire saw technology utilized a steel wire with the application of an abrasive slurry solution in the cutting zone. To overcome the technological limitations of this process, such as low cutting speeds and non-uniform wafer thickness due to wire wear, modern wire saw processes employ fixed abrasive wires. The wire is either fed from one spool to another and then reversed to continue the process, or used in a closed loop so as to continually feed in the same direction.
Electrical Discharge Diamond Grinding (also known as Abrasive Electrical Discharge Grinding) is a process which integrates EDM and conventional grinding. For further information, see P. Koshy, V. K. Jain, G. K. Lal., Mechanism of material removal in electrical discharge diamond grinding, International Journal of Machine Tools and Manufacture 36 (1996) 1173-1185, and J. Kozak, K. E. Oczos, Selected problems of abrasive hybrid machining, Journal of Materials Processing Technology 109 (2001) 360-366. The role of the electrical discharges which occur at the grinding zone is to thermally soften the work material in order to facilitate grinding and to dress/declog the grinding wheel in-process for improved wheel performance.
An object of the present invention is to address the above-mentioned problems inherent to wire EDM and improve the material removal rate and provide a better surface quality.
The present invention provides a method of wire electrical discharge machining comprising applying a pulsed voltage between a tool electrode and a workpiece which are physically separated by a working gap, the tool electrode being in the form of a wire with an electrically conductive core and an external surface embedded with an electrically non-conductive abrasive material.
In a conventional wire-EDM process, high removal rates and good surface quality are mutually exclusive, with each of these being obtained at the expense of the other. Since material removal in accordance with the present invention takes place by the combined mechanisms of melting/vapourization and abrasion, the removal rate is higher and the machined surface is of better quality because the recast material is largely removed by abrasion.
Embodiments of the invention will now be described by way of example with reference to the accompanying drawings of which:
a) and 6(b) shows schematic views of locating and guiding the abrasive wire in accordance with other embodiments of the invention.
Referring to the drawings, the invention can be carried out using a conventional wire electrical discharge machining apparatus of the kind shown in
The wire 20 translates along its axis lateral to the workpiece 28, as indicated by arrow 32 in
The gap gw between the wire core 22 and the workpiece 28, see
The EDM servo control parameters can be further adjusted with reference to feedback from the gap based on measured parameters which may include but are not limited to machining force and wire deflection. The additional feedback can be used to control the extent of material removal by mechanical abrasion for a given wire and workpiece material.
Wire implanted with electrically non-conductive abrasives, for example diamond as is typically used for wire saw cutting applications as described previously with reference to
As shown in
In some circumstances, the use of a wire with abrasives embedded around the entire circumference of the wire as shown in
The wire and the workpiece are oriented such that the machined surface, or specifically the instantaneous feed direction, is normal to the sector of the wire which is embedded with abrasives. This may be accomplished by various means, which include but are not limited to the addition of a rotary axis on the wire guides allowing them to be rotated to match the required feed direction, or the addition of a rotary axis on or below the XY work table which will enable the workpiece to be oriented such that the feed direction is normal to the abrasive wire sector or a combination thereof.
A wire with abrasives embedded around the circumference of the wire, either partially or fully as shown in
In use of the invention in conjunction with existing dry or near-dry WEDM methods, the non-conducting abrasives will act to electrically isolate the workpiece and wire core. Also, the abrasive action will further remove the recast layer and any re-deposited debris.
Other embodiments of the invention will now be readily apparent to a person skilled in the art from the foregoing description, the scope of the invention being defined in the appended claims.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/CA07/01136 | 6/26/2007 | WO | 00 | 6/2/2009 |
Number | Date | Country | |
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60817371 | Jun 2006 | US |