Patent Application
20230339074
The present disclosure relates to abrasive articles, and more particularly, abrasive articles including an electronic assembly.
Abrasive articles can include abrasive particles attached to a matrix material and be used to remove material from an object. Various types of abrasive articles can be formed, including but not limited to, coated abrasive articles, bonded abrasive articles, convoluted abrasive articles, abrasive brushes, and the like. Coated abrasive articles generally include one or more layers of abrasive material overlying a substrate. The abrasive particles can be affixed to the substrate using one or more adhesive layers. A bonded abrasive article can include a three dimensional matrix of bond material and abrasive particles contained within the matrix of bond material. Bonded abrasive articles may include some content of porosity within the body.
The manufacturing and use of abrasive articles can vary widely and the industry continues to demand improved abrasive articles.
Embodiments are illustrated by way of example and are not limited to the accompanying figures.
Skilled artisans appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale.
The following discussion will focus on specific implementations and embodiments of the teachings. The detailed description is provided to assist in describing certain embodiments and should not be interpreted as a limitation on the scope or applicability of the disclosure or teachings. It will be appreciated that other embodiments can be used based on the disclosure and teachings as provided herein.
The abrasive articles of the embodiments herein can have various structures, grades and architectures and can be used in a variety of material removal operations. In an embodiment, the abrasive articles can include a fixed abrasive article. In a particular embodiment, the abrasive article can include bonded abrasive articles, coated abrasive articles and the like.
According to one embodiment, the abrasive body precursor can be a liquid material, such as a liquid mixture. The liquid mixture can include some or all of the components configured to form the finally-formed abrasive article. For example, the liquid mixture can include the abrasive particles and a bond precursor material.
In still another embodiment, the abrasive body precursor can be a solid green body. Reference herein to a green body, is an object that is formed into a solid three-dimensional body, but will undergo a final treatment, such as curing or a heat treatment to further solidify and/or densify the body. In particular, a green body includes a precursor bond material that is solid, but will undergo further treatment to transform the precursor bond material into a finally-formed bond material in the finally-formed abrasive article.
As noted herein, the abrasive body precursor may include a bond precursor material. A bond precursor material can include one or more components that can undergo a process to transform from the bond precursor material into the finally-formed bond material. Some suitable bond precursor materials can include an organic or inorganic material. For example, the bond precursor material can include a resin, an epoxy, a polyamide, a metal, a metal alloy, a vitreous material (e.g., a frit), a ceramic, or any combination thereof.
The abrasive body precursor may also include abrasive particles. The abrasive particles may include one or more various types, including for example, a mix of different types of abrasive particles. The abrasive particles can include any type of abrasive particle used and known by those of skill in the art. For example, the abrasive particles can include an inorganic material, including but not limited to, an oxide, a carbide, a nitride, a boride, a carbon-based materials (e.g., diamond), an oxycarbides, an oxynitride, an oxyboride, a superabrasive material, or any combination thereof. The abrasive particles can include shaped abrasive particles, crushed abrasive particles, exploded abrasive particles, agglomerated particles, unagglomerated particles, monocrystalline particles, polycrystalline particles, or any combination thereof. The abrasive particles can include a material selected from the group of silicon dioxide, silicon carbide, alumina, zirconia, flint, garnet, emery, rare earth oxides, rare earth-containing materials, cerium oxide, sol-gel derived particles, gypsum, iron oxide, glass-containing particles, brown fused alumina (57A), seeded gel abrasive, sintered alumina with additives, shaped and sintered aluminum oxide, pink alumina, ruby alumina (e.g., 25A and 86A), electrofused monocrystalline alumina 32A, MA88, alumina zirconia abrasives (NZ, NV, ZF), extruded bauxite, cubic boron nitride, diamond, aluminum oxy-nitride, extruded alumina (e.g., SR1, TG, and TGII), or any combination thereof. In certain instances, the abrasive particles can be particularly hard, having for example, a Mohs hardness of at least 6, such as at least 6.5, at least 7, at least 8, at least 8.5, at least 9. The finally-formed abrasive article can include any of the types of abrasive particles included in the precursor abrasive body.
The abrasive particles can have an average particle size (D50) of at least 0.1 microns, such as at least 1 micron, at least 5 microns, at least 10 microns, at least 20 microns, at least 30 microns, at least 40 microns or at least 50 microns or at least 100 microns or at least 200 microns or at least 500 microns or at least 1000 microns. Still, in another non-limiting embodiment, the abrasive particles can have an average particle size (D50) of not greater than 5000 microns, such as not greater than 4000 microns or not greater than 3000 microns or not greater than 2000 microns or not greater than 1000 microns or not greater than 500 microns or not greater than 200 microns or not greater than 100 microns or not greater than 80 microns or not greater than 60 microns or not greater than 30 microns or not greater than 10 microns or not greater than 1 micron. It will be appreciated that the abrasive particles can have an average particle size within a range including any of the minimum and maximum values noted above. Moreover, it will be appreciated that the finally-formed abrasive article can have abrasive particles having an average particles size within a range including any of the minimum and maximum percentages noted above.
The abrasive particles can include blend of different particles, which may differ from each other based on one or more abrasive characteristics, such as hardness, average particle size, average grain (i.e., crystallite size), toughness, two-dimensional shape, three-dimensional shape, composition, or any combination thereof. The blends of abrasive particles can include a primary and a secondary abrasive particle. The primary and secondary abrasive particles can include any of the compositions of abrasive particles described herein.
The abrasive body precursor can include a content of abrasive particles suitable for use as an abrasive article. For example, the abrasive body precursor can include at least 0.5 vol % abrasive particles for a total volume of the abrasive body precursor. In still other embodiments, the abrasive body precursor can include at least 1 vol % abrasive particles, such as at least 5 vol % or at least 10 vol % or at least 15 vol % or at least 20 vol % or at least 30 vol % or at least 40 vol % or at least 50 vol % or at least 60 vol % or at least 70 vol % or at least 80 vol % abrasive particles for a total volume of the abrasive body precursor. In yet another non-limiting embodiment, the abrasive body precursor can have not greater than 90 vol % abrasive particles for the total volume of the abrasive body precursor, such as not greater than 80 vol % or not greater than 70 vol % or not greater than 60 vol % or not greater than 50 vol % or not greater than 40 vol % or not greater than 30 vol % or not greater than 20 vol % or not greater than 10 vol % or not greater than 5 vol % abrasive particles. It will be appreciated that the abrasive body precursor can have a content of abrasive particles within a range including any of the minimum and maximum percentages noted above. Moreover, it will be appreciated that the finally-formed abrasive article can have a content of abrasive particles within a range including any of the minimum and maximum percentages noted above.
The abrasive body precursor may further include one or more types of fillers as known by those of skill in the art. The filler can be distinct from the abrasive particles and may have a hardness less than a hardness of the abrasive particles. The filler may provide improved mechanical properties and facilitate formation of the abrasive article. In at least one embodiment, the filler can include various materials, such as fibers, woven materials, non-woven materials, particles, minerals, nuts, shells, oxides, alumina, carbide, nitrides, borides, organic materials, polymeric materials, naturally occurring materials, pore-formers (solid or hollow), and a combination thereof. In particular instances, the filler can include a material such as wollastonite, mullite, steel, iron, copper, brass, bronze, tin, aluminum, kyanite, alusite, garnet, quartz, fluoride, mica, nepheline syenite, sulfates (e.g., barium sulfate), carbonates (e.g., calcium carbonate), cryolite, glass, glass fibers, titanates (e.g., potassium titanate fibers), rock wool, clay, sepiolite, an iron sulfide (e.g., Fe2S3, FeS2, or a combination thereof), fluorspar (CaF2), potassium sulfate (K2SO4), graphite, potassium fluoroborate (KBF4), potassium aluminum fluoride (KAlF4), zinc sulfide (ZnS), zinc borate, borax, boric acid, fine alundum powders, P15A, bubbled alumina, cork, glass spheres, silver, Saran™ resin, paradichlorobenzene, oxalic acid, alkali halides, organic halides, and attapulgite. Some fillers can volatilize or be consumed during later processing. Some fillers may become part of the finally-formed abrasive article. It will be appreciated that the body can include one or more reinforcing articles (e.g., woven or non-woven materials) that are incorporated into the body and are part of the finally-formed abrasive article.
The abrasive body precursor may further include one or more additives, including for example, but not limited to stabilizers, binders, plasticizers, surfactants, friction-reducing materials, rheology modifying materials, and the like.
In certain abrasive articles, such as coated abrasive articles, the abrasive body precursor may include a substrate or backing, upon which one or more abrasive layers may be formed. According to one embodiment, the substrate can include an organic material, inorganic material, or any combination thereof. In certain instances, the substrate can include a woven material. However, the substrate may be made of a non-woven material. Particularly suitable substrate materials can include organic materials, including polymers such as polyester, polyurethane, polypropylene, and/or polyimides such as KAPTON from DuPont, and paper. Some suitable inorganic materials can include metals, metal alloys, and particularly, foils of copper, aluminum, steel, and a combination thereof. The backing can include one or more additives selected from the group of catalysts, coupling agents, curants, anti-static agents, suspending agents, anti-loading agents, lubricants, wetting agents, dyes, fillers, viscosity modifiers, dispersants, defoamers, and grinding agents.
In some abrasive articles, such as those utilizing a substrate, a polymer formulation may be used to form any of a variety of layers such as, for example, a frontfill, a pre-size, the make coat, the size coat, and/or a supersize coat. When used to form the frontfill, the polymer formulation generally includes a polymer resin, fibrillated fibers (preferably in the form of pulp), filler material, and other optional additives. Suitable formulations for some frontfill embodiments can include material such as a phenolic resin, wollastonite filler, defoamer, surfactant, a fibrillated fiber, and a balance of water. Suitable polymeric resin materials include curable resins selected from thermally curable resins including phenolic resins, urea/formaldehyde resins, phenolic/latex resins, as well as combinations of such resins. Other suitable polymeric resin materials may also include radiation curable resins, such as those resins curable using electron beam, UV radiation, or visible light, such as epoxy resins, acrylated oligomers of acrylated epoxy resins, polyester resins, acrylated urethanes and polyester acrylates and acrylated monomers including monoacrylated, multiacrylated monomers. The formulation can also comprise a nonreactive thermoplastic resin binder which can enhance the self-sharpening characteristics of the deposited abrasive particles by enhancing the erodability. Examples of such thermoplastic resin include polypropylene glycol, polyethylene glycol, and polyoxypropylene-polyoxyethene block copolymer, etc. Use of a frontfill on the substrate can improve the uniformity of the surface, for suitable application of the make coat and improved application and orientation of shaped abrasive particles in a predetermined orientation.
After forming the abrasive body precursor at step 101, the process continues at step 102 by combining at least one electrical assembly with the abrasive body precursor. According to an embodiment, the electrical assembly can include at least one electronic device. The electronic device can be configured to store and/or transmit information to one or more systems and/or individuals in the life of the abrasive article, including for example, those systems and/or individuals included in the manufacturing, sale, distribution, storage, use, maintenance and/or quality of the abrasive article.
The process of combining the electronic assembly with the abrasive body precursor can vary depending upon the nature of the abrasive body precursor. In one example, the process of combining the abrasive body precursor with the electronic assembly can include depositing the electronic assembly on or within the mixture of material defining the abrasive body precursor. In particular, the process of depositing the electronic assembly on or with the mixture can include incorporation of the electronic assembly into the mixture prior to formation of the finally-formed abrasive article. In such instances, the electronic assembly can be configured to survive one or more forming processes used to create the finally-formed abrasive article from the mixture. For example, the electronic assembly can be configured to survive and function after the mixture and electronic assembly are subjected to one or more processes including, for example, but not limited to, pressing, heating, drying, curing, cooling, molding, stamping, cutting, machining, dressing, and the like.
In one particular embodiment, the electronic assembly can be deposited on the mixture, such that at least a portion of the electronic assembly can be in contact with and overlying an exterior surface of the mixture. For example, the entire electronic assembly can be overlying the exterior surface of the mixture. Such a deposition process may facilitate forming an abrasive article having at least a portion of the electronic assembly at an exterior surface of the abrasive body.
In another embodiment, the electronic assembly can be deposited such that a portion of the electronic assembly can be contained within the mixture, such that at least a portion of the electronic assembly is positioned below the exterior surface of the mixture. For example, in one instance, a portion of the electronic assembly can be embedded within the mixture and another separate portion of the electronic assembly can be overlying the exterior surface of the mixture. Such a deposition process may facilitate formation of an electronic assembly in which a portion of the electronic assembly is embedded within the body of the abrasive article below an exterior surface of the body. In yet another embodiment, the entire electronic assembly can be embedded within the mixture. Such a deposition process may facilitate formation of an abrasive article, wherein the electronic assembly can be embedded entirely within the body of the abrasive article, such that no portion of the electronic assembly is protruding through the exterior surface of the body. It may be desirable to utilize a configuration in which the electronic assembly is partially or entirely embedded within the body of the abrasive article to reduce the likelihood of tampering with the electronic assembly and one or more electronic devices contained therein.
In still another embodiment, the process of depositing the electronic assembly on or within the mixture can further include applying the electronic assembly to one or more components and then applying the mixture to the component. For example, the electronic assembly can be placed on or within an article (e.g., a substrate, a backing, a reinforcing member, a partially-cured or completely cured abrasive portion, or the like) to be part of the finally-formed abrasive article and the mixture can be deposited onto the article. According to one embodiment, the electronic assembly may be adhered to the article and the mixture can be deposited over at least a portion or all of the electronic assembly. Further details regarding the placement of the electronic assembly are described herein.
Manufacturing information can be stored on the electronic assembly during or after one or more forming processes. The electronic assembly can include one or more electronic devices that can facilitate the measurement and/or storage of manufacturing data. Such manufacturing data may be helpful for manufacturers to know the manufacturing conditions used to form the abrasive article, and may further be useful in assessing the quality of the abrasive article. According to one embodiment, one or more read, write or erase operations can be conducted with each process. For example, a first process may be conducted in the manufacturing of the abrasive article and a first set of manufacturing information can be written to the electronic device. After completing the first process a read, write, or erase information can be performed. For example, manufacturing information can be read from the electronic device. Alternatively or additionally, a write operation may be conducted to write new manufacturing information to the electronic device. Alternatively or additionally, an erase operation may be conducted to remove all or a portion of the first set of manufacturing information. Thereafter, further processes can be conducted, and each process may include one or more read, write, or erase operations. In a particular embodiment, the electronic device can include partitioned portions. A partitioned portion may include a memory, and certain data may be stored in the memory. In some instances, one or more partitioned portions may be access-restricted to protect data from being read or edited by personnel who does not have the access. For example, manufacturing data may be stored in a partitioned portion for manufacturer use only so that others, such as users or distributors, may not make changes to the manufacturing data. In another instance, restriction of access to data stored in a partitioned portion may be changed to allow the data to be read or updated by personnel who is restricted from accessing the data previously.
In an alternative embodiment, the process of combining the at least one electronic assembly with the abrasive body precursor can include depositing the electronic assembly on a portion of a solidified green body. As disclosed herein, a green body can be an object that will undergo further processing. The process of depositing the electronic assembly on at least a portion of a green body can include attaching at least a portion of the electronic assembly to an exterior surface of the green body. In such instances, the electronic assembly is processed with the green body through one or more processes to form the finally-formed abrasive article. Various processes for depositing the electronic assembly on at least a portion of the green body can be used. For example, the electronic assembly can be bonded to a portion of the green body, such as the exterior surface of the green body. A bonding agent may be used, such as by an adhesive. In another embodiment, the electronic assembly can be fastened to at least a portion of the green body by one or more various types of fasteners. In still another embodiment, a portion of the electronic assembly can be pressed into a portion of the green body to facilitate attachment, such that a portion of the electronic assembly is embedded within the body of the green body.
In yet another embodiment, the abrasive body precursor can include an unfinished abrasive body that is a portion of a finally formed body. In an example, a portion of an abrasive body can be formed first, and in some instances, may undergo a further treatment during the process of forming a finally formed abrasive body. In another instance, the abrasive body precursor may include a portion of a finally formed body and a green body of another portion. In still another instance, the abrasive body precursor may include a portion of a finally formed body and a material or material precursor for forming another portion of the finally formed body. In a further embodiment, an electronic assembly can be disposed over a portion of the abrasive body precursor, a material for forming another portion of the finally formed body can be applied to the abrasive body precursor and the electronic assembly. The electronic assembly can be coupled to the abrasive body after further treatment for forming the finally formed abrasive body.
After combining the at least one electronic assembly with the abrasive body precursor at step 102, the process can continue at step 103 by forming the abrasive body precursor into an abrasive body. Various suitable processes for forming the abrasive body precursor into an abrasive body can include, but is not limited to, curing, heating, sintering, firing, cooling, molding, pressing, or any combination thereof. It will be appreciated that in such instances, the electronic assembly can survive and function after one or more forming processes used to form the finally-formed abrasive article. Such forming processes may be used on a mixture or a solidified green body.
According to one embodiment, the forming process can include heating of the body to a forming temperature. The forming temperature can affect a transformation of one or more components in the mixture to form the finally-formed abrasive article. For example, the forming temperature can be at least 25° C., such as at least 40° C. or at least 60° C. or at least 80° C. or at least 100° C. or at least 150° C. or at least 200° C. or at least 300° C. or at least 400° C. or at least 500° C. or at least 600° C. or at least 700° C. or at least 800° C. or at least 900° C. or at least 1000° C. or at least 1100° C. or at least 1200° C. or at least 1300° C. Still, in one non-limiting embodiment, the forming temperature can be not greater than 1500° C. or not greater than 1400° C. or not greater than 1300° C. or not greater than 1200° C. or not greater than 1100° C. or not greater than 1000° C. or not greater than 900° C. or not greater than 800° C. or no greater than 700° C. or not greater than 600° C. or not greater than 500° C. or not greater than 400° C. or not greater than 300° C. or not greater than 200° C. or not greater than 100° C. or not greater than 80° C. or not greater than 60° C. It will be appreciated that the forming temperature can be within a range including any of the minimum and maximum values noted above.
In another embodiment, the forming process can include curing the electronic assembly. For instance, the electronic assembly can include a material or a material precursor that can undergo a curing process. Curing the electronic assembly can include curing of the material or material precursor. In another instance, curing of the electronic assembly can be conducted by heating, irradiation, chemical reactions, or any other means known in the art. In another instance, the forming process can include heating to cure the electronic assembly, heating to cure the abrasive body precursor, or heating to cure both. Curing of the abrasive body precursor can include curing of a precursor material of the abrasive body precursor. In an aspect, curing the electronic assembly or the abrasive body can facilitate coupling of the electronic assembly to the abrasive body, and particularly, curing can facilitate directly coupling the electronic assembly to the finally formed abrasive body in a tamper-proof manner. As used herein, the term, tamper-proof, is intended to mean that the manner of coupling may not allow the electronic assembly to be removed or extracted from the abrasive article without damaging the abrasive article. In a particular example, curing the electronic assembly and curing the abrasive body precursor can take place in the same heating process. In another particular embodiment, heating the electronic assembly and abrasive body precursor can allow the electronic assembly and abrasive body precursor to co-cure. In yet another embodiment, curing the electronic assembly and curing the abrasive body precursor can occur at the same heating temperature. In yet another instance, the abrasive body can be finally formed by co-curing the abrasive body precursor and the electronic assembly.
In another embodiment, the forming process can include heating the electronic assembly and heating at least a portion of the abrasive body precursor. Heating can be conducted at a temperature at that the abrasive body precursor and/or the electronic assembly can cure. Particularly, heating can be performed at the temperature that can allow both the abrasive body precursor and the electronic assembly to cure. In an aspect, co-curing the electronic assembly and the abrasive body can be performed at a temperature that can facilitate improved coupling of the electronic assembly to the abrasive body and formation of the abrasive article. For instance, co-curing the electronic assembly and the abrasive body precursor can be performed at a temperature of at least 90° C., at least 95° C., at least 100° C., at least 105° C., at least 108° C., at least 110° C., at least 115° C., at least 120° C., at least 130° C., at least 140° C., at least 150° C., at least 155° C., at least 160° C., at least 165° C., at least 170° C., at least 175° C., at least 180° C., at least 190° C., at least 200° C., at least 210° C., at least 220° C., at least 230° C., at least 240, ° C., or at least 250° C. In another instance, co-curing the abrasive body precursor and the electronic assembly may be performed at a temperature of not greater than 250° C., not greater than 245° C., not greater than 240° C., not greater than 235° C., not greater than 230° C., not greater than 220° C., not greater than 215° C., not greater than 210° C., not greater than 200° C., not greater than 195° C., not greater than 185° C., not greater than 180° C., or not greater than 170° C., not greater than 165° C., not greater than 160° C., not greater than 155° C., not greater than 150° C., not greater than 145° C., not greater than 140° C., not greater than 135° C., not greater than 130° C., not greater than 125° C., or not greater than 120° C. Moreover, co-curing the abrasive body precursor and the electronic assembly can be performed at a temperature including any of the minimum and maximum values noted herein. For instance, co-curing may be performed at a temperature in a range including at least 90° C. and not greater than 250° C., such as in a range including at least 120° C. and not greater than 140° C., or in a range including at least 150° C. and not greater than 190° C.
In a further aspect, co-curing the abrasive body precursor and the electronic assembly can be performed for a certain period of time to facilitate improved coupling of the electronic assembly to the abrasive body and formation of the abrasive article. For instance, co-curing can be performed for at least 0.5 hours, at least 1 hour, at least 2 hours, at least 3 hours, at least 4 hours, at least 5 hours, at least 6 hours, at least 7 hours, at least 8 hours, at least 10 hours, at least 12 hours, at least 15 hours, at least 18 hours, at least 20 hours, at least 30 hours, at least 26 hours, at least 28 hours, at least 30 hours, at least 32 hours, at least 35 hours, or at least 36 hours. In another instance, co-curing may be performed for not greater than 38 hours, not greater than 36 hours, not greater than 32 hours, not greater than 30 hours, not greater than 28 hours, not greater than 25 hours, not greater than 21 hours, not greater than 18 hours, not greater than 16 hours, not greater than 14 hours, not greater than 12 hours, not greater than 10 hours, not greater than 8 hours, not greater than 7 hours, not greater than 6 hours, not greater than 5 hours, not greater than 4 hours, not greater than 3 hours, or not greater than 2 hours. Moreover, co-curing the abrasive body precursor and the electronic assembly can be performed for a period of time including any of the minimum and maximum values noted herein. For instance, co-curing may be performed for a period of time in a range including at least 0.5 hours and not greater than 38 hours, such as in a range including at least 4 hours and not greater than 10 hours, or in a range including at least 20 hours and not greater than 32 hours.
After reading this disclosure, a skilled artisan would understand that conditions for co-curing the abrasive body precursor and the electronic assembly can be determined, taking into consideration factors that can affect temperatures at that the abrasive body precursor and the electronic assembly cure, such as the nature of the precursor materials to be cured, to suit particular implementations.
After forming the abrasive body precursor at step 110, the process can continue at step 111 by forming the abrasive body precursor into a finally-formed abrasive body. Suitable forming processes can include those described in embodiments herein, including for example, but not limited to, curing, heating, sintering, firing, cooling, pressing, molding or any combination thereof. According to one embodiment, the process of forming the abrasive body precursor into a finally-formed abrasive body can include heating the abrasive body precursor to a forming temperature as described in embodiments herein.
After forming the abrasive body precursor into a finally-formed abrasive body at step 111, the process can continue at step 112 by attaching an electronic assembly to the abrasive body, wherein the electronic assembly comprises at least one electronic device. The process of attaching can include adhering, chemical bonding, sinter-bonding, brazing, puncturing, fastening, connecting, heating, pressing, curing, or any combination thereof. Moreover, it will be appreciated that the method of attaching may determine the placement, orientation and exposure of the electronic assembly. For example, at least a portion of the electronic assembly can be attached and exposed at an exterior surface of the body of the abrasive article. In one embodiment, at least a portion of the electronic assembly can be embedded within the body of the abrasive article and another portion of the electronic assembly can be exposed and protruding from the exterior surface of the body of the abrasive article.
In an embodiment, attaching an electronic assembly to the abrasive body can include disposing the electronic assembly over a surface of the abrasive body. In a particular embodiment, the electronic assembly can be disposed on an exterior surface of the abrasive body. An example of an exterior surface can include a major surface or a peripheral surface the abrasive body. In a particular instance, the electronic assembly may be disposed on an exterior surface that is not a grinding surface of the abrasive body to reduce the likelihood of being damaged during a material removal operation. In another particular instance, the exterior surface can include a major surface of the abrasive body, such as a major surface of a grinding wheel or a major surface of a cut-off wheel. In yet another particular instance, the exterior surface can be the surface of an inner circumferential wall of the abrasive body with a central opening.
In an embodiment, attaching an electronic assembly to the abrasive body can include heating the electronic assembly. Heating can be performed at a temperature that can facilitate improved bonding of the electronic assembly to the abrasive body. For instance, heating can be performed at a temperature such that a portion of the electronic assembly can reach its glass transition temperature and adhere to the abrasive body in the subsequent cooling step. In another embodiment, the attaching can include heating the abrasive body and the electronic assembly such that a portion of the abrasive body and a portion of the electronic assembly can reach their respective glass transition temperature and bonding of the abrasive body and the electronic assembly can be formed during subsequent cooling.
In another embodiment, attaching an electronic assembly to the abrasive body can include pressing the electronic assembly at an elevated temperature to facilitate improved coupling of the electronic assembly to the abrasive body. The elevated temperature can include a temperature higher than room temperature (i.e., 20° C. to 25° C.). In a particular example, the elevated temperature can include a glass transition temperature of a material forming a portion of the electronic assembly, a glass transition temperature of the bond material, or both. In another particular instance, pressing the electronic assembly can be performed at a temperature of at least 90° C., such as at least 100, at least 110° C., at least 120° C., at least 125° C., at least 130° C., at least 150° C., at least 150° C., or at least 160° C. Alternatively or additionally, pressing the electronic assembly may be performed at a temperature of not greater than 180° C., not greater than 175° C., not greater than 170° C., not greater than 165° C., not greater than 160° C., not greater than 155° C., not greater than 150° C., not greater than 145° C., not greater than 140° C., not greater than 130° C., or not greater than 125° C. Moreover, pressing the electronic assembly may be performed at a temperature in a range including any of the minimum and maximum values noted herein. For example, pressing the electronic assembly may be performed at a temperature in a range from at least 90° C. to not greater than 180° C.
In a further example, pressing the electronic assembly can be performed for a certain period of time to facilitate improved coupling of the electronic assembly to the bonded body and formation of the abrasive article, such as at least 10 seconds, at least 30 seconds, at least 1 minute, at least 2 minutes, at least 5 minutes, at least 10 minutes, at least 15 minutes, at least 20 minutes, at least 25 minutes, or at least 30 minutes. Alternatively or additionally, pressing the electronic assembly may be performed for not greater than 35 minutes, not greater than 30 minutes, not greater than 25 minutes, or not greater than 20 minutes. Moreover, pressing the electronic assembly may be performed for a time period in a range including any of the minimum and maximum values noted herein. For example, pressing the electronic assembly may be performed for at least 10 seconds to not greater than 35 minutes.
In a further example, pressing the electronic assembly can be performed at a certain pressure to facilitate attaching the electronic assembly to the bonded body and formation of the abrasive article, such as at least 0.3 bars, at least 1 bar, at least 3 bars, at least 5 bars, at least 10 bars, at least 15 bars, at least 20 bars, at least 25 bars, at least 30 bars, at least 35 bars, at least 40 bars, at least 45 bars or at least 50 bars, at least 60 bars, at least 65 bars, at least 70 bars, at least 75 bars, at least 80 bars, at least 85 bars, at least 90 bars, at least 100 bars, at least 120 bars, at least 130 bars, at least 135 bars, at least 140 bars, at least 150 bars, at least 160 bars, at least 170 bars, or at least 180 bars. Alternatively or additionally, the pressure may be at most 200 bars, at most 190 bars, at most 180 bars, at most 170 bars, at most 160 bars, at most 150 bars, at most 140 bars, at most 130 bars, at most 120 bars, at most 110 bars, at most 100 bars, at most 90 bars, at most 80 bars, at most 70 bars, at most 60 bars, or at most 50 bars. Moreover, pressing can be operated at the pressure in a range including any of the minimum and maximum values noted herein. For example, pressing can be performed at a pressure in a range including at least 10 bars and at most 200 bars.
In a particular example, attaching an electronic assembly to the abrasive body can include subjecting the electronic assembly and at least a portion of the abrasive body to an autoclaving operation. In a particular instance, autoclaving can be performed to attach a plurality of the electronic assemblies to the abrasive body. In an aspect, the autoclaving operation can include applying a pressure to the electronic assembly, such as a pressure of at least 2 bars, at least 5 bars, at least 8 bars, at least 10 bars, at least 12 bars, at least 13 bars, at least 15 bars or at least 16 bars. Alternatively or additionally, the pressure may be at most 16 bars, at most 13 bars, at most 11 bars, at most 10 bars, at most 9 bars, at most 7 bars, at most 5 bars, at most 3 bars or at most 2 bars. Moreover, autoclaving can be operated at the pressure including any of the minimum and maximum values noted herein. For instance, autoclaving pressure can be in a range including at least 0.3 bars and at most 16 bars.
The autoclaving operation can also include heating the electronic assembly at a temperature of at least 90° C., such as at least at least 100, at least 110° C., at least 120° C., at least 125° C., at least 130° C., at least 150° C., at least 150° C., or at least 160° C. Alternatively or additionally, the heating temperature for performing autoclaving may be not greater than 160° C., not greater than 155° C., not greater than 150° C., not greater than 145° C., not greater than 140° C., not greater than 130° C., not greater than 125° C., or not greater than 120° C. Moreover, autoclaving can be operated at a temperature including any of the minimum and maximum values noted herein. Autoclaving can be operated for a certain period of time to facilitate coupling the electronic assembly to the abrasive body, such as for at least 10 minutes to not greater than 30 minutes.
In another embodiment, attaching an electronic assembly to the abrasive body can include applying a bonding material over at least a portion of the abrasive assembly, at least a portion of an exterior surface of the abrasive body, or both. The bonding material can include a polymer, an inorganic material, a cement material, or any combination thereof. A particular example of the bonding material can include a cement material. The cement material can be hydraulic or non-hydraulic. A further example of a cement material can include an oxide, a silicate, such as calcium-based silicate, aluminium-based silicate, magnesium-based silicate, or any combination thereof. Another exemplary of the bonding material can include an adhesive, and in some particular instance, the adhesive can include epoxy. In a further embodiment, attaching an electronic assembly to the abrasive body can include curing the bonding material to form the abrasive article including the abrasive body coupled to the electronic assembly. In some instances, curing may be performed at a temperature of at least 15° C., and additionally or alternatively, curing may be performed at a temperature of not greater than 40° C., such as not greater than 35° C. or not greater than 30° C. or not greater than 25° C. Particularly, curing the cement material may be performed at a temperature from 20° C. to 40° C., such as at room temperature.
In an embodiment, the electronic assembly can be coupled to and in direct contact with at least a portion of the abrasive body. In some particular instances, the electronic assembly can bond to a portion of the abrasive body. For instance, the electronic assembly can bond to a component of the abrasive body, such as the bond material, the abrasive particles, an additive, or any combination thereof. In particular embodiments, the electronic assembly can be coupled to the abrasive body in a tamper-proof manner.
As illustrated in
In accordance with an embodiment, the bond material 206 can be an inorganic material, organic material, or any combination thereof. For example, suitable inorganic materials can include a metal, a metal alloy, a vitreous material, a monocrystalline material, a polycrystalline material, a glass, a ceramic, or any combination thereof. Suitable examples of organic materials can include, but is not limited to, thermoplastic materials, thermosets, elastomers, or any combination thereof. In a particular embodiment, the bond material 206 can include a resin, epoxy, or any combination thereof.
In accordance with an embodiment, the bond material 206 may have a particular forming temperature that is the same as the forming temperatures used to form the abrasive body as described in embodiments herein. For example, the bond material 206 may have a forming temperature of at least 25° C., such as at least 40° C. or at least 60° C. or at least 80° C. or at least 100° C. or at least 150° C. or at least 200° C. or at least 300° C. or at least 400° C. or at least 500° C. or at least 600° C. or at least 700° C. or at least 800° C. or at least 900° C. or at least 1000° C. or at least 1100° C. or at least 1200° C. or at least 1300° C. Still, in one non-limiting embodiment, the forming temperature can be not greater than 1500° C. or not greater than 1400° C. or not greater than 1300° C. or not greater than 1200° C. or not greater than 1100° C. or not greater than 1000° C. or not greater than 900° C. or not greater than 800° C. or no greater than 700° C. or not greater than 600° C. or not greater than 500° C. or not greater than 400° C. or not greater than 300° C. or not greater than 200° C. or not greater than 100° C. or not greater than 80° C. or not greater than 60° C. It will be appreciated that the forming temperature of the bond material 206 can be within a range including any of the minimum and maximum values noted above.
As noted herein, the body 201 can include porosity 208 contained within the body. For example, the body 201 may include closed prosody, open porosity, or any combination thereof. Closed pores are generally discrete and separate pores contained within the bond material 206. In contrast, open porosity can define interconnected channels extending through the body 201. In one particular embodiment, the abrasive body may have a content of porosity 208 within a range of at least 0.5 vol % to not greater than 95 vol % for a total volume of the body 201.
According to one embodiment, the abrasive article 200 can include an electronic assembly 220 attached to an exterior surface of the body 201, such as the first major surface 202. In one embodiment, the electronic assembly 220 can include at least one electronic device 222 that may be contained within a package 221. The package 221 may be suitable for attaching the electronic assembly 220 to the body 201, and may provide some suitable protection of the one or more electronic devices contained therein. In particular examples, the electronic device 222 can be encapsulated within the package 221.
According to one embodiment, the electronic device 222 can be configured to be written-to with information, store information, or provide information to other objects during a read operation. Such information may be relevant to the manufacturing of the abrasive article, operation of the abrasive article or conditions encountered by the electronic assembly 220. Reference herein to the electronic device will be understood to be reference to at least one electronic device, which can include one or more electronic devices. In at least one embodiment, the electronic device 222 can include at least one device selected from the group including an integrated circuit and chip, data transponder, a radio frequency based tag or sensor with or without chip, an electronic tag, electronic memory, a sensor, an analog to digital converter, a transmitter, a receiver, a transceiver, a modulator circuit, a multiplexer, an antenna, a near-field communication device, a power source, a display (e.g., LCD or OLED screen), optical devices (e.g., LEDs), global positioning system (GPS) or device, or any combination thereof. In some instances, the electronic device may optionally include a substrate, a power source, or both. In one particular embodiment, the electronic device 222 can include a tag, such as a passive radio frequency identification (RFID) tag. In another embodiment, the electronic device 222 can include an active radio frequency identification (RFID) tag. An active RFID tag can include a power supply, such as a batter or inductive capacitive (LC) tank circuit. In a further embodiment, the electronic device 222 can be wired or wireless.
According to one aspect, the electronic device 222 can include a sensor. The sensor may be selectively operated by any system and/or individual within the supply chain. For example, the sensor can be configured to sense one or more processing conditions during the formation of the abrasive article. In another embodiment, the sensor may be configured to sense a condition during use of the abrasive article. In yet another embodiment, the sensor can be configured to sense a condition in the environment of the abrasive article. The sensor can include an acoustic sensor (e.g., ultrasound sensor), force sensor, vibration sensor, temperature sensor, moisture sensor, pressure sensor, gas sensor, timer, accelerometer, gyroscope, or any combination thereof. The sensor can be configured to alert any system and/or individual associated with the abrasive article, such as a manufacturer and/or customer to a particular condition sensed by the sensor. The sensor may be configured to generate an alarm signal to one or more systems and/or individuals in the supply chain, including but not limited to, manufacturers, distributors, customers, users, or any combination thereof.
In another embodiment, the electronic device 222 may include a near-field communication device. A near field communication device can be any device capable of transmitting information via electromagnetic radiation within a certain defined radius of the device, typically less than 20 meters. The near-field communication device can be coupled to one or more electronic devices, including for example a sensor. In one particular embodiment, a sensor can be coupled to the near-field communication device and configured to relay information to one or systems and/or individuals in the supply chain via the near-field communication device.
In an alternative embodiment, the electronic device 222 can include a transceiver. A transceiver can be a device that can receive information and/or transmit information. Unlike passive RFID tags or passive near-field communication devices, which are generally read-only devices that store information for a read operation, a transceiver can actively transmit information without having to conduct an active read operation. Moreover, the transceiver may be capable of transmitting information over various select frequencies, which may improve the communication capabilities of the electronic assembly with a variety of systems and/or individuals in the supply chain.
In another embodiment, the electronic assembly 220 can include a flexible electronic device. For instance, the electronic device can have a certain bend radius, such as not greater than 13 times the thickness of the electronic device, not greater than 12 times the thickness of the electronic device, not greater than 10 times the thickness of the electronic device, not greater than 9 times the thickness of the electronic device, not greater than 8 times the thickness of the electronic device, not greater than 7 times the thickness of the electronic device, not greater than 6 times the thickness of the electronic device, not greater than 5 times the thickness of the electronic device. Alternatively or additionally, the electronic device can have a bend radius at least half the thickness of the electronic device, or at least the thickness the electronic device. It is to be understood the flexible electronic device can have a bend radius within a range including any of the minimum and maximum values noted herein. As used herein, bend radius is measured to the inside curvature and is the minimum radius that the electronic device can be bent without being damaged. In an embodiment, bend radius may be affected by the structure of the flexible electronics. For example, a single-layered flexible electronic device may have a bending radius not greater than 5 times its thickness, while a flexible electronic device having a plurality of layers may have bending radius not greater than 12 times its thickness.
In an aspect, the flexible electronic device can include a substrate, wherein the substrate can include a flexible material. In another aspect, the flexible electronic device can include a flexible substrate. For instance, the substrate can include an organic material, such as a polymer. In another example, the substrate can include a flexible conductive material, such as conductive polyester. In a particular example, the substrate can consist essentially of an organic material, and in more particular examples, the substrate can consist essentially of a polymer. A particular example of a polymer can include a plastic material. A more particular example of the substrate can include polyester (e.g., PET), polyimide, polyether ether ketone (PEEK), polyimide-fluoropolymer, or the like. Another example of the substrate can include a Pyralux® material. In some even more particular examples, the substrate can consist essentially of at least one of the materials noted herein. In another embodiment, the substrate can include a flexible thin silicon layer or monocrystalline silicon.
In a further example, the substrate can include at least one layer. In a further aspect, the flexible electronic device can include a printed circuit. In another aspect, the electronic device can include a plurality of layers. In a particular aspect, the flexible electronic device can include a substrate that consists essentially of one layer. In a more particular aspect, the flexible electronic device can be a singled-layered electronic device.
In a particular embodiment, the flexible electronic device can have a thickness of not greater than 1 mm, such as not greater than 0.80 mm, not greater than 0.60 mm, not greater than 0.50 mm, not greater than 0.40 mm, not greater than 0.30 mm, not greater than 0.20 mm, not greater than 0.15 mm, or not greater than 0.12 mm, or not greater than 0.10 mm. Alternatively or additionally, the flexible electronic device can have a thickness of at least 0.06 mm, such as at least 0.08 mm, at least 0.10 mm, at least 0.12 mm, at least 0.15 mm, or at least 0.20 mm. Moreover, the flexible electronic device can have a thickness including any of the minimum and maximum values noted herein.
In an embodiment, the electronic assembly 220 can include a flexible printed circuit. In an example, the flexible printed circuit can be contained within the package 221, as illustrated in
In an embodiment, a flexible electronic device described in embodiments herein may be particularly suited for abrasive articles including coated abrasives, non-woven abrasives, thin wheels, or the like. In some situations, coupling a single-layered flexible electronics to a coated or non-woven abrasive may not cause detectable or noticeable changes to thickness, flexibility, or other performance of the abrasive. In certain situations, utilizing a flexible electronics can help to prevent issues, such as imbalance of wheels, that can be caused by uneven weight distribution due to coupling of an electronic assembly to the wheels.
In an embodiment, the electronic device can have a certain communication range while the electronic assembly is coupled to the abrasive body. As used herein, the communication range can be determined using the near field or far field method as applicable and according to ISO/IEC 18000 (125 Khz-5.8 Ghz), or related standards such as ISO/IEC 15693, ISO/IEC 14443, EPC Global Gen2, or ISO/IEC 24753. The applicable standard is selected based on the radio frequency of the electronic device. An abrasive article can be placed in a 3-axis turntable, and a transmitting or receiving antenna can be arranged such that communication ranges in different orientations can be tested.
In an embodiment, the electronic device can have a communication range of at least 1.0 meter, at least 1.5 meters, at least 2.0 meters, at least 2.5 meters, at least 3.0 meters, at least 3.5 meters, at least 4.0 meters, at least 4.5 meters, at least 5.0 meters, at least 5.5 meters, at least 6.0 meters, at least 6.5 meters, at least 7.0 meters, at least 7.5 meters, at least 8.0 meters, at least 8.5 meters, at least 9.0 meters, at least 9.5 meters, at least 10 meters, at least 11 meters, at least 12 meters, at least 13 meters, at least 14 meters, at least 15 meters, at least 16 meters, at least 17 meters, at least 18 meters, at least 19 meters, or at least 20 meters. Additionally or alternatively, the electronic device may have a communication range of not greater than 20 meters, not greater than 19 meters, not greater than 18 meters, not greater than 17 meters, not greater than 16 meters, not greater than 15 meters, not greater than 14 meters, not greater than 13 meters, not greater than 12 meters, not greater than 11 meters, not greater than 10 meters, not greater than 9.0 meters, not greater than 8.5 meters, not greater than 8.0 meters, not greater than 7.5 meters, not greater than 7.0 meters, not greater than 6.5 meters, not greater than 6.0 meters, not greater than 5.5 meters, not greater than 5.0 meters, not greater than 4.5 meters, not greater than 4.0 meters, not greater than 3.5 meters, not greater than 3.0 meters, not greater than 2.5 meters, or not greater than 2.0 meters. Moreover, the communication range of the electronic device can be in a range including any of the minimum and maximum values noted herein.
In another embodiment, the abrasive article can include certain electronic devices, such as an active RFID, that have higher communication ranges. In some instances, the communication range can be at least 100 meters, at least 200 meters, at least 400 meters, at least 500 meters, or at least 700 meters. In another instance, the communication range may be not greater than 1000 meters, such as not greater than 800 meters, or not greater than 700 meters. It is to be understood that the communication range can be in a range including any of the minimum and maximum values noted herein.
In another embodiment, the abrasive article can include an electronic device having a communication range of not greater than 35 mm, not greater than 30 mm, or not greater than 25 mm. Additionally or alternatively, the electronic device can have a communication range of at least 10 mm, at least 15 mm, at least 20 mm, or at least 25 mm. Moreover, the communication range of the electronic device can be in a range including any of the minimum and maximum values noted herein. After reading the present disclosure, a skilled artisan would understand that the communication range can be affected by factors, such as the nature of the electronic device, the configuration and materials of the electronic assembly, the manner of coupling, the composition and type of the abrasive article, or any combination thereof. A skilled artisan would also understand that the choice for any or all factors can be made and combined for forming an abrasive article that can suit particular applications.
According to one embodiment, the package 221 can include a thermal barrier material. For example a thermal barrier material can include material from the group of materials including, but not limited to, thermoplastic polymers (e.g., polycarbonates, polyacrylates, polyamides, polyimides, polysulphones, polyketones, polybenzimidizoles, polyesters), blends of thermoplastic polymers, thermoset polymers (e.g., epoxies, cyanoesters, phenol formaldehyde, polyurethanes, polyamides, polyimides, cross-linkable unsaturated polyesters) blends of thermoset polymers, ceramics, cermets, metals, metal alloys, glass, or any combination thereof. In accordance with one particular embodiment, the package 221 can include a thermal barrier material suitable for surviving one or more processes, including the forming temperature used to form the finally form abrasive article.
In accordance with another embodiment, thermal barrier material of the package 221 can have a particular thermal conductivity which may be suitable for protecting the one or more electronic devices contained therein. For example the thermal barrier package may have a thermal conductivity of at least 0.33 W/m/K, such as at least about 0.40 W/m/K, such as at least 0.50 W/m/K or at least 1 W/m/K or at least 2 W/m/K or at least 5 W/m/K or at least 10 W/m/K or at least 20 W/m/K or at least 50 W/m/K or at least 80 W/m/K or at least 100 W/m/K or at least 120 W/m/K or at least 150 W/m/K or at least 180 W/m/K. In still another non-limiting embodiment, the thermal barrier material can have a thermal conductivity that is not greater than 200 W/m/K, such as not greater than 180 W/m/K or not greater than 150 W/m/K or not greater than 120 W/m/K or not greater than 100 W/m/K or not greater than 80 W/m/K or not greater than 60 W/m/K or not greater than 40 W/m/K or not and 20 W/m/K or not greater than 10 W/m/K. It will be appreciated that the thermal barrier material can have a thermal conductivity within a range including any of the minimum and maximum values noted above, including for example within a range of at least 0.33 W/m/K to not greater than 200 W/m/K.
According to one embodiment, the package 221 can include a thermal barrier material that encapsulates some volume of space between the thermal barrier material and the electronic device contained therein. In one embodiment, the volume of space may include a particular gaseous material that may be suitable for survival of the electronic device through one or more manufacturing processes and/or improved performance of the electronic assembly. Some suitable examples of the gaseous materials can include noble gases, nitrogen, air, oxygen, or any combination thereof.
In another embodiment, the volume of space may have a particular pressure that may facilitate survival of the electronic device during one or more manufacturing processes and/or improved performance of the electronic assembly. For example, in one embodiment, the pressure within the electronic assembly can be less than atmospheric pressure. In still another embodiment, the pressure within the electronic assembly can be greater than atmospheric pressure. In still another embodiment, at least a portion of the volume of space can be filled with a liquid material, which may facilitate survival of the electronic device during one or more manufacturing operations and/or improved performance of the electronic assembly. The gaseous material or liquid material may have particularly suitable thermal conductivity to limit thermal damage to the electronic device.
In yet another aspect the package 221 can include one or more materials having a particular water vapor transmission rate to reduce or eliminate water and water vapor being transferred from the exterior of the package 222 the interior. Such a package may be suitable to reduce or eliminate damage to the one or more electronic devices 222 contained within the electronic assembly 220. In accordance with an embodiment, the package 221 can include a material having a water vapor transmission rate. In an embodiment, the barrier layer can prevent or reduce water vapor transmission into the bonded abrasive body, compared to a conventional abrasive tool. In a non-limiting embodiment, the package 221 and/or one or more materials comprising the package 221, can have a water vapor transmission rate (WVTR), as measured according to ASTM F1249-01 (Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor), of not greater than about 2.0 g/m2-day (i.e., grams per square meter, per 24 hours), such as not greater than about 1.5 g/m2-day, such as not greater than about 1 g/m2-day or not greater than about 0.1 g/m2-day or not greater than about 0.015 g/m2-day or not greater than about 0.010 g/m2-day or not greater than about 0.005 g/m2-day or not greater than about 0.001 g/m2-day or even not greater than about 0.0005 g/m2-day. In another non-limiting embodiment, the WVTR of the one or more materials of the package 2221, and thus the package 221, can be greater than 0 g/m2-day, such as at least 0.00001 g/m2-day. It will be appreciated that the WVTR can be within a range including any of the minimum and maximum values noted herein. For instance, the WVTR may be within a range including greater than 0 g/m2-day and not greater than 2.0 g/m2-day, such as within a range including at least 0.00001 g/m2-day and not greater than 2.0 g/m2-day.
In another aspect, the electronic device 222 may be configured to transmit information via one or more electromagnetic radiation wavelengths. Accordingly, the package to 221 can be substantially transparent or transmissive to the frequencies or wavelengths of electromagnetic radiation used by the electronic device 222 to receive and/or transmit information. For example, the package 221 can include one or more materials that are transparent to electromagnetic radiation in the radio frequency spectrum, such as electromagnetic radiation having a frequency of 3 kHz to 300 GHz and an approximate wavelength within a range of 1 mm to 100 km. Some suitable examples of such materials can include non-metallic materials, such as glasses, ceramic, thermoplastics, elastomers, thermosets, and the like.
As noted in embodiments herein, the electronic device 222 can be configured to communicate with one or more systems and/or individuals. In particular instances, the electronic device 222 can be configured to communicate with a mobile device. A mobile device will be understood as an electronic device intended for personal use and configured to be carried on or used by an individual.
In accordance with one embodiment, the electronic device 222 can include a read-only device. In an alternative embodiment, the electronic device 222 can be a read-write device. It will be understood that a read-only device is a device that can store information, which can be read by a system and/or individual in an active read operation. An active read operation includes any action by a system and/or individual to access the information stored on the electronic device 222. A read-only device cannot be written to in an active write operation to store information. By contrast a read-write device can be an electronic device wherein information can be read from the device in an active read operation or information can be stored to the electronic device by one or more systems and/or individuals in an active writing operation. Some suitable examples of information that can be stored on the electronic device 222 can include manufacturing information and/or customer information. According to one embodiment, manufacturing information can include, but is not limited to, processing information, manufacturing date, shipment information, or any combination thereof. In accordance with another embodiment, customer information can include, but is not limited to, registration information, product identification information, product cost information, manufacturing date, shipment date, environmental information, use information, or any combination thereof. The customer registration information may include certain information such as an account number of the customer. Environmental information may include details regarding the age or general information about the conditions encountered by the abrasive article (e.g., water vapor, temperature, etc.) during shipment, storage or use. Use information can include details regarding the conditions for use of the wheel, including for example, but not limited to the appropriate wheel speed, force, power of the machine to be used, burst speed, and the like.
In a further embodiment, the package 221 can include a protective layer that can help the electronic device survive one or more forming process, environmental conditions, or grinding operations, or facilitate bonding of the electronic assembly to the abrasive body. For instance, the protective layer may facilitate improved resistance against moisture or humidity of the electronic assembly. In another instance, the protective layer can facilitate improved mechanical integrity, resistance against certain pressure or chemical corrosion, or improved electrical insulation, or improved thermal resistance in some instances. In an aspect, the protective layer can overlie at least a portion of the electronic device. In an aspect, the protective layer can be in contact with the electronic device. In a further aspect, the protective layer may be spaced apart from the abrasive body. In another embodiment, the protective layer can be in contact with at least a portion of the abrasive body. In still another embodiment, the protective layer can encapsulate the electronic device.
Referring to
In an embodiment, a protective layer can include an organic material, an inorganic material, or any combination thereof. In some instances, a protective layer can include parylene, silicone, acrylic, an epoxy based resin, ceramics, metal, such as an alloy (e.g., stainless steel), polycarbonate (PC), polyvinyl chloride (PVC), polyimide, polyvinyl butyral (PVB), polyurethane (PU), polytetrafluoroethylene (PTFE), a high performance polymer, such as polyester, polyurethane, polypropylene, polyimides, polysulfone (PSU), polyethersulfone (PES), polyetherimide (PEI), poly(phenylene sulfide) (PPS), polyetheretherketone (PEEK), polyether ketones (PEK), aromatic polymers, poly(p-phenylene), ethylene propylene rubber and/or cross-linked polyethylene, or a fluoropolymer such as PTFE. In some instances, the protective layer can include the same metal as an antenna contained in the electronic assembly. In some examples, the protective layer can be in the form of a coating, such as a polymer coating, e.g., epoxy-based resin coating, a ceramic coating, or a ceramic coated layer. In another instance, the protective layer may be in the form of a tape, such as a Teflon® tape, a PET tape, or a polyimide film with an adhesive on one side, such as Kapton® tape.
In some instances, the protective layer can include at least one opening to allow a sensing element to be exposed for the sensing element to perform its function, such as sensing environmental conditions the abrasive article is exposed to, e.g., temperature or humidity.
In a further embodiment, the protective layer can include a hydrophobic layer to help to protect the electronic device from potential damage caused by certain fluid, such as coolant or slurries used in some operations. An exemplary hydrophobic layer can include a material including manganese oxide polystyrene (MnO2/PS) nano-composite, zinc oxide polystyrene (ZnO/PS) nano-composite, calcium carbonate (e.g., precipitated calcium carbonate), carbon nano-tubes, silica nano-coating, fluorinated silanes, fluoropolymer, or any combination thereof. In an exemplary forming process, a hydrophobic layer can be formed by preparing and applying a gel-based or aerosol based solutions including any of the materials noted herein to the electronic device or over a protection layer.
In a further embodiment, the protective layer can include an autoclavable material that can help the electronic assembly survive an autoclave operation and facilitate bonding of the electronic assembly to the abrasive body. In some instances, the autoclavable material can also facilitate improved environmental resistance and electrical integrity of the electronic assembly. An exemplary material can include poly vinyl butyral (PVB), polycarbonate (PC), acoustic PVB, thermal control PVB, ethylene vinyl acetate (EVA), thermoplastic polyurethane (TPU), ionomer, a thermoplastic material, polybutylene terephthalate (PBT), polyethylenevinylacetate (PET), polyethylene naphthalate (PEN), polyvinyl chloride (PVC), polyvinyl fluorides (PVf), polyacrylate (PA), polymethyl methacrylate (PMMA), polyurethane (PUR), or combinations thereof.
In an embodiment, the package can include any of the protection layer, thermal barrier, pressure barrier, as noted in embodiments herein, or any combination thereof. Any of the component layer of the package can be formed by extrusion, printing, spraying on, coating or the like. The package including a plurality of layers can be formed by adhesion, lamination, coating, printing, or the like. In particular embodiments, treatment, such as heating, curing, pressing, or any combination thereof, can be performed to form a component layer or the package. For instance, a precursor material may be used and cured to form a protection layer.
In an embodiment, the electronic assembly can be coupled to the abrasive body. In some instances, the coupling to the abrasive body can be direct or indirect. In particular instances, the electronic assembly can be coupled to the abrasive body in a tamper-proof manner. In accordance with another embodiment, as illustrated in
Embodiments herein include various ways to attach the electronic assembly 220 can be coupled to the body 201 of the abrasive article. For example, the electronic assembly 220 can be bonded directly to an exterior surface of the abrasive body 201, such as the first major surface 202. It will be appreciated that the electronic assembly 220 can be bonded directly to other surfaces of the body 201, including for example, a portion of the second major surface 203.
In a particular example, the bonding agent can form a layer 253 on the surface of the inner circumferential wall 251, and more particularly the layer 253 can cover substantially the entire surface of the inner circumferential wall. As illustrated, the electronic assembly 220 can be fully embedded in the layer 253. In an embodiment, a portion of the electronic assembly 220 can be embedded in the layer 253, and a portion of the electronic assembly 220 can be exposed to the environment. Exposing a portion of the electronic assembly may be helpful for the electronic device to perform its function, such as detecting operation or storage conditions of the abrasive article. In a further embodiment, a portion of the electronic assembly 220 can be above the surface of the layer 253. In an embodiment, the abrasive article can include a bonded abrasive article, such as a grinding wheel. In a more particular instance, the abrasive body of the abrasive article 200 can include a vitreous material, a ceramic material, a glass, a metal, an oxide, or any combination thereof.
In an embodiment, a non-abrasive portion can be disposed over at least a portion of the exterior surface 302 and at least a portion of the electronic assembly 301. For instance, the non-abrasive portion can form an outer surface of the finally formed abrasive article, covering at least a portion of the electronic assembly and at least a portion of the abrasive body. In another instance, the non-abrasive portion can cover the exposed exterior surface 302 and the exposed exterior surface of the electronic assembly 310 entirely. In a further instance, the non-abrasive portion may be in direct contact with at least a portion of the electronic assembly 310 and at least a portion of the exterior surface 302. An example of the non-abrasive portion can include a material including a fabric, a fiber, a film, a woven material, a non-woven material, a glass, a fiberglass, a ceramic, a polymer, a resin, a polymer, a fluorinated polymer, an epoxy resin, a polyester resin, a polyurethane, a polyester, a rubber, a polyimide, a polybenzimidazole, an aromatic polyamide, a modified phenolic resin, paper, or any combination thereof.
In an exemplary forming process, the non-abrasive portion may be applied overlying at least a portion of the electronic assembly and at least a portion of the abrasive body, the combination of which can undergo a further treatment for forming the finally formed abrasive body. The further treatment can include any treatment noted in the embodiments herein, such as heating, pressing, curing, or any commination thereof. In a particular example of the forming process, a non-abrasive portion may be placed directly on the electronic assembly, wherein the electronic assembly is disposed on a portion of an exterior surface in an interior circumferential region of the abrasive body. The non-abrasive portion may cover the entire interior circumferential region. The non-abrasive portion can be pressed against the electronic assembly and the body at an elevated temperature to form the finally formed abrasive body, wherein the non-abrasive portion can be attached to the electronic assembly and the bonded abrasive body, and the electronic assembly can bond to the abrasive body.
In some instances, the electronic assembly can be disposed on the surface of the abrasive body precursor, and the non-abrasive portion can be disposed covering the electronic assembly and at least a portion of the surface of the abrasive body precursor. Heat can be applied to allow curing of the electronic assembly, the abrasive body precursor, or both to realize bonding between the electronic assembly and the abrasive body and attachment of the non-abrasive portion to the abrasive body. In an example, the non-abrasive portion can be directly attached to at least a portion of the exterior surface of the bonded abrasive body, a portion of the electronic assembly, or both.
In a particular embodiment, the non-abrasive portion can include a reinforcement component, a layer of fabric, a layer including a woven or non-woven material, a layer including fiber, blotter paper, or the like, or any combination thereof. In another particular embodiment, the abrasive body can be a bonded body of a grinding wheel, a thin wheel, such as a cut-off wheel, a combination wheel, or an ultra thin wheel. In more particular embodiments, the bonded body can include an organic bond material, and in even more particular embodiments, the bond material can consist essentially of an organic material. In a particular example of a thin wheel, the bonded body can include in the body, at least one abrasive portion and at least one non-abrasive portion that can be the same as or different from the non-abrasive portion attached to the surface of the bonded body. An example of the non-abrasive portion in the abrasive body can include a reinforcement component.
In accordance with an embodiment, the embedded portion 333 may have a particular size relative to the total volume of the electronic assembly that facilitates suitable engagement with the body 301. For example the embedded portion 333 can be at least 1% of the total volume of the electronic assembly, such as at least 5% or at least 10% or at least 15% or at least 20% or at least 30% or at least 40% or at least 50% or at least 60% or at least 70% or at least 80% or even at least 90% of the total volume of electronic assembly 330. Still, in another non-limiting embodiment, the embedded portion 333 can have a particular size such as not greater than 95% of the total volume of electronic assembly, such as not greater than 90%, or not greater than 80% or not greater than 70% or not greater than 60% or not greater than 50% or not greater than 40% or not greater than 30% or not greater than 20% or not greater than 10% or not greater than 5% of the total volume of the electronic assembly. It will be appreciated that the embedded portion 333 can have a size relative to the volume of electronic assembly 330 that is within a range including any of the minimum and maximum percentages noted above. Furthermore, will be appreciated that alternative size and shaped embedded portions may be utilized to facilitate suitable attachment of electronic assembly 330 in the body 301.
As further illustrated in the embodiment of
In accordance with another embodiment, a certain amount of the electronic assembly 330 can be contained within the interior volume of the body 301 below the exterior surface 302 of the body 301. For example, at least 1% of the total volume of electronic assembly 330 can be contained within the interior volume of the abrasive body 301, such as at least 5% or at least 10% or at least 15% or at least 20% or at least 30% or at least 40% or at least 50% or at least 60% or at least 70% or at least 80% or at least 90%. Still, and another non-limiting embodiment, not greater than 99% of the electronic assembly can be contained within the interior volume of the body 301 below the exterior surface 302, such as not greater than 95% or not greater than 90% or not greater than 80% or not greater than 70% or not greater than 60% or not greater than 50% or not greater than 40% or not greater than 30% or not greater than 20% or not greater than 10% or not greater than 5%. It will be appreciated that the total volume of electronic assembly 330 contained within an interior volume of the abrasive body 301 can be within the range between any of the minimum and maximum percentages noted above. It will be appreciated that utilization of a certain volume of electronic summary 330 contained within the interior volume of the body 301 may be suitable to limit tampering with the electronic device 332 and or electronic assembly 330.
In accordance with an embodiment, the electronic assembly 360 can be embedded at a particular depth that is suitable for protecting the electronic assembly 360 while maintaining suitable capabilities to allow information to be sent to and/or received by the electronic device 362. For example, the electronic assembly 360 can be embedded at a depth (DEA) of less than 50% of the total thickness of the abrasive body (TB). In other instances, the embedded depth (DEA) of electronic assembly 360 can be less, such as not greater than 45% or not greater than 40% or not greater than 35% or not greater than 30% or not greater than 25% or not greater than 20% or not greater than 15% or not greater than 10% or not greater than 5% or not greater than 3% of the total thickness of the abrasive body (TB). Still in one non-limiting embodiment, the electronic assembly 360 can be embedded at a depth (DEA) of at least 1% of the total thickness of the abrasive body (TB), such as at least 2% or at least 3% or at least 5% or at least 8% or at least 10% or at least 12% or at least 13% or at least 15% or at least 20% or at least 25% or at least 30% or even at least 40% of the total thickness of the abrasive body (TB). It will be appreciated that the embedded depth (DEA) of the electronic assembly 360 can be within a range including any of the minimum and maximum percentages noted above.
In one alternative embodiment, the body can be made of more than one abrasive portion.
According to one particular embodiment, the outer abrasive portion 373 can include a first type of bond material that can be different from the bond material used to form the inner abrasive portion 374. For example, the outer abrasive portion 373 can include a vitrified material and the inner abrasive portion 374 can include an organic material, such as a resin or epoxy material. In such instances, the outer abrasive portion 373 may first be formed into the vitrified bonded abrasive component. After the outer abrasive portion 373, the electronic assembly 370 including the package 371 and electronic device 372 may be attached to the inner circumferential wall of the outer abrasive portion 373. Thereafter, the inner abrasive portion 374 may be formed on the interior of the outer abrasive portion 373 and overlying and/or encompassing the electronic assembly 370.
According to one embodiment, the electronic assembly can be completely encased or encompassed in the material of the inner abrasive portion 374. In another embodiment, the electronic assembly 370 may be partially surrounded by or encased within the material of the inner abrasive portion 374. As illustrated, the electronic assembly 370 can be disposed at an interface of the inner abrasive portion 374 and the outer abrasive portion 373. Such a configuration may facilitate formation of a two component abrasive article. Furthermore, such an arrangement may facilitate recycling of the inner abrasive portion 374 and the electronic assembly after a certain amount or content of the outer abrasive portion 373 is used or spent in a material removal operation. While not illustrated, it will be appreciated that the electronic assembly 370 may be disposed at another location in the inner abrasive portion, including for example, disposed entirely within the inner abrasive portion 374.
For one embodiment, the first abrasive portion 384 can be generally in the form of a layer and the second abrasive portion 385 may also be in the form of a layer. Regarding the forming process, the electronic assembly 380 may first be coupled to the reinforcing member 383. Thereafter, the first abrasive layer 384 and second abrasive layer 385 may be formed around the reinforcing member 383 and the electronic assembly 380. In another embodiment, the second abrasive layer 385 may be first formed, thereafter the reinforcing member 383 and electronic assembly 380 coupled thereto, may be placed on top of the partially-formed or fully-formed second abrasive layer 385. After coupling the second abrasive layer 385 and the reinforcing member 383 including the electronic assembly 380, the first abrasive layer 384 may be formed overlying the reinforcing member 383 and the electronic assembly 380 to form the finally-formed abrasive article. It will be appreciated that other abrasive articles may utilize one or more reinforcing layers and one or more abrasive layers.
In one aspect, the electronic assembly 390 can be releasably coupled to the surface 396 of the cavity 395. For example, the electronic assembly 390 can be bonded to the surface 396 of the cavity 395 by an adhesive that can facilitate removal of the electronic assembly 390 after use of the abrasive article. For one particular embodiment, the adhesive can be changed by one or more external stimuli, such that it facilitates removal of the electronic assembly 390 from the surface 396. An example can include the application of heat to change and/or volatilize a portion of the adhesive to facilitate removal of the electronic assembly 390 from the surface 396. In such instances, the electronic assembly may be recycled for use with another, different abrasive article. According to an alternative embodiment, the electronic assembly 390 can be attached to the surface 396 using one or more fasteners that facilitate removal and recycling of the electronic assembly 390. Other releasable connections as known to those of skill in the art may be utilized. Furthermore, such a releasable connection can be used with any of the other electronic assemblies described in the embodiments herein, particularly those embodiments wherein the electronic assembly is coupled to a surface of a body.
In an embodiment, the abrasive body precursor 375 can be a bonded abrasive body including a bond material including an organic material, an inorganic material, or any combination thereof. In some particular instances, the bond material can include a vitreous material, a ceramic material, glass, metal, an oxide, or any combination thereof, and in more particular examples, the bond material of the abrasive body precursor can consist essentially of vitreous material, a ceramic material, a glass, metal, an oxide, or a combination thereof. In another embodiment, the bond material included in the inner abrasive portion 377 can be the same as the bond material included in the outer abrasive portion 376. More particularly, the inner abrasive portion 377 can include the substantially same composition as the outer abrasive portion 376.
As demonstrated in
In a further embodiment, a treatment can be applied to the material 399, the electronic assembly 378, and optionally, at least a portion of abrasive body precursor 375 to form the finally formed abrasive article. For example, heating, radiation, a chemical reaction, or any combination thereof can be applied to or take place to allow the material 399 to cure. In some instances, heating may be performed at a temperature to facilitate curing of the material 399. An exemplary temperature for curing the material 399 can be up to 160° C. In another example, heating may facilitate bonding of the electronic assembly 378 to the material 399, to the inner abrasive portion 377, the outer abrasive portion 376, or any combination thereof. In still another example, heating may facilitate bonding of the material 399 to the inner abrasive portion 377, the outer abrasive portion 376, or both.
The finally formed abrasive body 389 can include an inner abrasive portion including a first portion (e.g., formed by the material 399) and a second portion and the electronic assembly embedded in the inner abrasive portion, wherein the first portion and the second portion can include a different composition, including a difference in, such as materials or contents of the materials used to form the first and second portions, or the same composition. In an example, a first portion of the inner abrasive portion can include an organic material, and the second portion may include an organic material, inorganic material, or a combination thereof. In a particular instance, the first portion of the inner abrasive portion can include a bond material that can consist essentially of an organic material, and the second abrasive portion can include a vitreous material, glass, crystalline material, a metal, an oxide, or any combination thereof. In an embodiment, the thickness of the inner abrasive portion can be substantially the same as the outer abrasive portion. In a further embodiment, the electronic assembly 378 can bond to the material of the first portion. In another embodiment, the electronic assembly 378 can be in direct contact with the first portion, the second portion of the inner abrasive portion, or both. In still another embodiment, the electronic assembly 378 can be in direct contact with the outer abrasive portion 376, such as in direct contact with the inner circumferential wall of the outer abrasive portion 377.
According to one embodiment, the substrate 401 can include an organic material, inorganic material, and a combination thereof. In certain instances, the substrate 401 can include a woven material. However, the substrate 401 may be made of a non-woven material. Particularly suitable substrate materials can include organic materials, including polymers, and particularly, polyester, polyurethane, polypropylene, polyimides such as KAPTON from DuPont, paper or any combination thereof. Some suitable inorganic materials can include metals, metal alloys, and particularly, foils of copper, aluminum, steel, and a combination thereof.
The make coat 402 can be applied to the surface of the substrate 401 in a single process, or alternatively, the particulate material 404 can be combined with a make coat 402 material and the combination of the make coat 402 and particulate material 404 can be applied as a mixture to the surface of the substrate 401. In certain instances, controlled deposition or placement of the particulate material 404 in the make coat 402 may be better suited by separating the processes of applying the make coat 402 from the deposition of the particulate material 404 in the make coat 402. Still, it is contemplated that such processes may be combined. Suitable materials of the make coat 402 can include organic materials, particularly polymeric materials, including for example, polyesters, epoxy resins, polyurethanes, polyamides, polyacrylates, polymethacrylates, polyvinylchlorides, polyethylene, polysiloxane, silicones, cellulose acetates, nitrocellulose, natural rubber, starch, shellac, and mixtures thereof. In one embodiment, the make coat 402 can include a polyester resin. The coated substrate can then be heated in order to cure the resin and the particulate material 404 to the substrate 401. In general, the coated substrate 401 can be heated to a temperature of between about 100° C. to less than about 250° C. during this curing process.
The particulate material 404 can include different types of abrasive particles according to embodiments herein. The different types of abrasive particles can include different types of shaped abrasive particles, different types of secondary particles or any combination thereof. The different types of particles can be different from each other in composition, two-dimensional shape, three-dimensional shape, grain size, particle size, hardness, friability, agglomeration, or any combination thereof.
After sufficiently forming the make coat 402 with the particulate material 404 contained therein, the size coat 403 can be formed to overlie and bond the particulate material 404 to the make coat 402 and the substrate 401. The size coat 403 can include an organic material, and may be made essentially of a polymeric material, and notably, can use polyesters, epoxy resins, polyurethanes, polyamides, polyacrylates, polymethacrylates, poly vinyl chlorides, polyethylene, polysiloxane, silicones, cellulose acetates, nitrocellulose, natural rubber, starch, shellac, and mixtures thereof.
As further illustrated in
According to one particular embodiment, the electronic assembly 420 can be overlying and/or coupled to the substrate 401. In a particular embodiment, at least a portion of the electronic device 422 can be in contact with the substrate 401. Furthermore, as illustrated in
In an embodiment, an abrasive article can include a substrate and an abrasive coating overlying the substrate. The substrate can be any substrate disclosed in embodiments herein. For instance, the abrasive article can include a non-woven abrasive article, wherein the substrate can include a fibrous web. The abrasive coating can include any composition that is known to a skilled artisan for forming the non-woven abrasive article. In another instance, the abrasive article can include a coated abrasive article including a substrate similar to the backing 401, and the abrasive coating can include the make coat 402 and abrasive particles 404, and optionally the size coat 403. In some instances, the abrasive coating can include a top coat overlying the size coat 403. In an embodiment, the abrasive coating can include an exterior surface that can be a grinding surface. For instance, the grinding surface can be the upper surface of the size coat 403, as illustrated in
In an embodiment, an electronic assembly can be coupled to the abrasive coating in a manner such that at least a portion of the electronic assembly is in direct contact with a portion of the abrasive coating. For instance, as illustrated in
In an embodiment, the electronic assembly can be at least partially embedded in the abrasive coating. For instance, the electronic assembly can be disposed such that at least a portion of the electronic assembly can be beneath the grinding surface of the abrasive coating. In a particular embodiment, the electronic assembly can be fully embedded within the abrasive coating. For example, the electronic assembly can be fully enveloped in the abrasive coating. In another instance, the entire electronic assembly can be beneath the grinding surface of the abrasive coating.
In a further embodiment, the electronic assembly can be disposed over the substrate, such as between the substrate and the abrasive coating. In an example, the electronic assembly can be on the substrate. Alternatively, the electronic assembly can be spaced apart from the substrate. In some instances, the electronic assembly may be partially embedded in the substrate.
In another embodiment, the electronic assembly can have a certain thickness that can facilitate placement and coupling of the electronic assembly to the abrasive coating. In an instance, the electronic assembly can have a thickness of at least 1 micron, such as at least 2 microns, at least 3 microns, or at least 4 microns. In another instance, the electronic assembly can be thicker, having a thickness of at least 0.5 mm, at least 0.7 mm, at least 0.8 mm, at least 1 mm, or at least 2 mm. Alternatively or additionally, the electronic assembly may have a thickness of not greater than 5 mm, such as not greater than 4 mm, not greater than 3 mm, not greater than 2 mm, or not greater than 1 mm. In some instances, the electronic assembly can be thinner, such as having a thickness of not greater than 10 microns, not greater than 9 microns, not greater than 7 microns, not greater than 5 microns, or not greater than 4 microns. Moreover, the thickness of the electronic assembly can be in a range including any of the minimum and maximum values noted herein. For example, the electronic assembly may have a thickness in a range including at least 1 micron and not greater than 5 mm, or in a range including at least 1 microns and not greater than 10 microns, or in a range including at least 1 mm and not greater than 5 mm. After reading the instant disclosure, a skilled artisan would understand that the thickness of the electronic assembly can be selected to suit a forming process of the abrasive article, such as placement and coupling of the electronic assembly or surviving a condition used to form the abrasive article, or to improve use of the abrasive article having the electronic assembly.
In another embodiment, the electronic assembly can have a certain thickness relative to the average thickness of the abrasive coating that can facilitate formation of the abrasive article. For instance, the thickness of the electronic assembly may be not greater than 99% of the average thickness of the abrasive coating, such as not greater than 98%, not greater than 96%, not greater than 94%, not greater than 92%, not greater than 90%, not greater than 88%, not greater than 86%, not greater than 84%, not greater than 82%, not greater than 80%, not greater than 78%, not greater than 76%, not greater than 75%, not greater than 73%, not greater than 71%, not greater than 70%, not greater than 68%, not greater than 66%, not greater than 64%, not greater than 62%, not greater than 60%, not greater than 58%, not greater than 55%, not greater than 53%, not greater than 51%, not greater than 50%, not greater than 48%, not greater than 45%, not greater than 43%, not greater than 41%, not greater than 40%, not greater than 38%, not greater than 36%, not greater than 34%, not greater than 32%, or not greater than 30% of the average thickness of the abrasive coating. In another instance, the electronic assembly can have a thickness of at least 5% of an average thickness of the abrasive coating, such as at least 10%, at least 12%, at least 13%, at least 15%, at least 17%, at least 18%, at least 20%, at least 22%, at least 24%, at least 25%, at least 27%, at least 30%, at least 31%, at least 33%, at least 35%, at least 37%, at least 40%, at least 42%, at least 44%, at least 46%, at least 48%, at least 50%, at least 52%, at least 54%, at least 55%, at least 58%, at least 60%, at least 62%, at least 64%, at least 66%, at least 68%, or at least 70% of the average thickness of the abrasive coating. Moreover, the thickness of the electronic assembly can include any minimum and maximum percentages noted herein. For instance, the electronic assembly can have a thickness of at least 5% and at most 99% of the average thickness of the abrasive coating. In another embodiment, the abrasive coating can have an average thickness from 0.015 mm to 1.5 mm. As used herein, average thickness of the abrasive coating can be determined according to ASTM D1777-96. The average thickness can be the average of 10 samples taken from the abrasive article in the same longitudinal direction (or machine direction).
In another embodiment, the electronic assembly can have a certain thickness relative to the average thickness of the abrasive article that can facilitate formation of the abrasive article. A particular abrasive article can include a coated abrasive, as illustrated in
In an exemplary forming process for forming an exemplary abrasive article, an electronic assembly can be disposed over the substrate, such as the backing 401, and at least a portion of the abrasive coating, such as at least a portion of the make coat 402, can be disposed over the substrate and the electronic assembly 420. In an instance, curing of the portion can be performed prior to applying the rest of the abrasive coating. For instance, the make coat 402 overlying the electronic assembly 420 can be cured prior to application of abrasive particles 404, the size coat 403, or both. The rest of the abrasive coating can be applied and cured to form a finally formed abrasive article. In another instance, a first portion of the abrasive coating may be applied to the substrate before an electronic assembly is disposed on the substrate, and another portion or the rest of the abrasive coating can be applied before or after curing of the first portion of the abrasive coating and cured. The abrasive article may be formed when all of the abrasive coating is applied and cured.
In an embodiment, the abrasive article can have a certain flexibility difference that can allow the abrasive article to perform and function in the similar manner as a same abrasive article not including the electronic assembly, particularly when the abrasive article is a non-woven or coated abrasive. A first portion of the abrasive article including the electronic assembly and a substantially same second portion not including the electronic assembly can be cut from the abrasive article. Flexibility of the first and second portions can be used to determine the flexibility difference. Each of the first and second portion samples can have a size of 75 mm×150 mm. Test of flexibility can be performed using mandrel bend test according to ASTM D4338-97 with modifications. Tests are conducted on freshly prepared portion samples. Each portion sample is folded to form an inverted U-shaped angle over the mandrel maintaining intimate contact across the mandrel surface. The test is repeated with progressively smaller diameter mandrels until the sample cracks or fails in bending. Flexibility is considered as the smallest diameter mandrel over which four out of five test portion samples do not break. Test of flexibility of the first and second portions can be performed in the longitudinal, transversal, or both directions.
The flexibility difference can be determined using the formula, μF=[|(F2nd−F1st)|/F2nd]×100%, wherein δF is the flexibility difference in the tested direction, F1st is the first flexibility in the tested direction (i.e., longitudinal or transversal), and F2nd is the second flexibility in the tested direction. In an aspect, the first portion can have a first flexibility in a longitudinal direction and the second portion can have a second flexibility in the longitudinal direction, wherein the flexibility difference between the first and the second flexibility may be not greater than 50%, not greater than 45%, not greater than 40%, not greater than 35%, not greater than 30%, not greater than 25%, not greater than 20%, not greater than 15%, not greater than 10%, not greater than 9%, not greater than 8%, not greater than 6%, not greater than 5%, not greater than 4%, not greater than 2%, or not greater than 1%. In another aspect, the flexibility difference in the longitudinal direction can be greater than 0, such as at least 0.001%, at least 0.005%, at least 0.01%, at least 0.05%, at least 0.1%, at least 0.3%, at least 0.5%, at least 0.8%, at least 1%, at least 2%, at least 5%, or at least 10%. In a further aspect, the flexibility difference in the longitudinal direction can be in a range including any of the minimum and maximum percentages noted herein. In a particular aspect, the first flexibility and the second flexibly in the longitudinal direction can be substantially the same.
In a further aspect, the first portion can have a third flexibility in a transversal direction and the second portion can have a fourth flexibility in the transversal direction, wherein the flexibility difference between the first and second portion in the transversal direction may be not greater than 50%, not greater than 45%, not greater than 40%, not greater than 35%, not greater than 30%, not greater than 25%, not greater than 20%, not greater than 15%, not greater than 10% of the fourth flexibility or not greater than 9% or not greater than 8% or not greater than 6% or not greater than 5% or not greater than 4% or not greater than 2%. In another aspect, the flexibility difference between the third and fourth flexibility can be greater than 0, such as at least 0.001%, at least 0.005%, at least 0.01%, at least 0.05%, at least 0.1%, at least 0.3%, at least 0.5%, at least 0.8%, at least 1%, at least 2%, at least 5%, or at least 10%. In a further aspect, the flexibility difference between the third and fourth flexibility can be in a range including any of the minimum and maximum percentages noted herein. In a particular aspect, the third flexibility and the fourth flexibly in the longitudinal direction can be substantially the same.
In another embodiment, the abrasive article can have a certain flexural rigidity difference that can allow the abrasive article to perform and function in the similar manner as a same abrasive article not including the electronic assembly, particularly when the abrasive article is a non-woven or coated abrasive. The flexural rigidity difference can be determined based on the flexural rigidity difference of the first portion and the second portion and using the formula, δFX=[|(FX2nd−FX1st)|/FX2nd]×100%, wherein δFX is the flexure rigidity difference, FX1st is flexure rigidity of the first portion, and FX2nd is flexure rigidity of the second portion. The first portion of the abrasive article includes the electronic assembly and the second portion is substantially the same not including the electronic assembly. The first portion and second portion samples are cut in the machine direction having the dimension of 200 mm×25 mm. Flexure rigidity of the first and second portions can be determined according to ASTM D1388-96 using a heart loop tester. 5 samples for each of the first and second portions can be tested. Each sample is formed into a heart-shaped loop. The length of the loop is measured when it is hanging vertically under its own mass. From this measured length, the bending length, and flexural rigidity can be calculated.
In an aspect, the flexural rigidity difference of the abrasive article may be not greater than 50% or not greater than 45% or not greater than 40% or not greater than 35% or not greater than 30% or not greater than 25% or not greater than 20% or not greater than 19% or not greater than 18% or not greater than 16% or not greater than 15% or not greater than 14% or not greater than 12% or not greater than 11% or not greater than 10% or not greater than 9% or not greater than 8% or not greater than 6% or not greater than 5% or not greater than 4% or not greater than 2% or not greater than 1% of the second flexural rigidity. In another aspect, the flexure rigidity difference can be greater than 0, such as at least 0.001%, at least 0.005%, at least 0.01%, at least 0.05%, at least 0.1%, at least 0.3%, at least 0.5%, at least 0.8%, at least 1%, at least 2%, at least 5%, or at least 10%. In a further aspect, the flexure rigidity difference can be in a range including any of the minimum and maximum percentages noted herein. In a particular aspect, the flexure rigidity of the first portion and the second portion can be substantially the same.
In another embodiment, the abrasive article can have a certain tensile strength difference that can allow the abrasive article to perform and function in the similar manner as a same abrasive article not including the electronic assembly, particularly when the abrasive article is a non-woven or coated abrasive. The tensile strength difference can be determined based on the tensile strength difference of a first portion and a second portion of the abrasive article, using the formula, δT=[|(T2nd−T1st)|/T2nd]×100%, wherein δT is the tensile strength difference, T1st is the tensile strength of the first portion, and T2nd is the tensile strength of the second portion. The tensile strength of the first and second portions is determined using a method derived from ASTM D5035. The first portion includes the electronic assembly, and the second portion is substantially the same without the electronic assembly. The portion samples are cut such that the gauge length is parallel to the longitudinal (machine) direction or the radial axis based on the type of abrasive article. 5 samples for each of the first and second portions can be prepared having the size of 25 mm×50 mm. Each sample is clamped in a tensile testing machine and a force is applied until the sample breaks at a loading rate of 300 mm/min. The breaking force and elongation is recorded and used to determine the tensile strength. The average of 5 samples is used as the tensile strength of the abrasive article.
In an aspect, the tensile strength difference of the abrasive article may be not greater than 50% or not greater than 45% or not greater than 40% or not greater than 35% or not greater than 30% or not greater than 25% or not greater than 20% or not greater than 19% or not greater than 18% or not greater than 16% or not greater than 15% or not greater than 14% or not greater than 12% or not greater than 11% or not greater than 10% or not greater than 9% or not greater than 8% or not greater than 6% or not greater than 5% or not greater than 4% or not greater than 2% or not greater than 1% of the second flexural strength. In another aspect, the tensile difference can be greater than 0, such as at least 0.001%, at least 0.005%, at least 0.01%, at least 0.05%, at least 0.1%, at least 0.3%, at least 0.5%, at least 0.8%, at least 1%, at least 2%, at least 5%, or at least 10%. In a further aspect, the tensile strength difference can be in a range including any of the minimum and maximum percentages noted herein. In a particular aspect, the tensile strength of the first portion and the second portion can be substantially the same.
In an embodiment, the electronic assembly can be placed out of the flange area to help to reduce the likelihood of damaging the electronic assembly during a material removal operation of the abrasive article. In a further embodiment, the electronic assembly may be placed in an area between the discard diameter of a wheel and the flange diameter. In another embodiment, the electronic assembly can be placed in the inner circumferential region.
In another embodiment, the abrasive article can be in the form of a disc or a wheel having a central opening. As illustrated in
In another instance, the electronic assembly can be distal to the central opening 451 and adjacent the outer circumference of the abrasive article. For instance, the distance 455 between the center of the abrasive article and the electronic assembly 454 may be greater than 0.5R, such as at least 0.6R, at least 0.7R, at least 0.8R, or at least 0.9R. Additionally or alternatively, the distance 455 may be not greater than 0.99R or not greater than 0.95R or not greater than 0.93R or not greater than 0.9R. Moreover, the distance 455 can be in a range including any of the minimum and maximum values noted herein.
In another embodiment, the electronic assembly 454 can have a certain orientation that can facilitate improved performance of the electronic assembly or help to reduce likelihood of damaging the electronic assembly during operations utilizing the abrasive article. For example, as illustrated in
In another embodiment, the abrasive article may be in the form of a belt. As illustrated in
In a further embodiment, the electronic assembly 470 can have a certain orientation that can facilitate improved performance of the electronic assembly or help to reduce likelihood of damaging the electronic assembly during operations utilizing the abrasive article. For example, as illustrated, the longitudinal axis 471 of the electronic assembly 470 can substantially aligned with a longitudinal axis 463 of the abrasive article 460. In another example, a lateral axis of the electronic assembly can be substantially aligned with the longitudinal axis of the abrasive article. In another instance, the longitudinal axis of the electronic assembly can be angled with respect to the longitudinal axis of the abrasive article.
As illustrated in
After forming the abrasive body with the electronic assembly including the electronic device, the process can further include writing manufacturing information to the electronic device at 502. Writing information can be conducted during a write operation, wherein information can be written to and stored on the electronic device. Some suitable examples of manufacturing information can include processing information, manufacturing date, shipment information, product identification information or any combination thereof. In certain instances, processing information can include information pertaining to at least one processing condition used during forming of the abrasive body. Some suitable examples of processing information can include manufacturing machine data (e.g., machine identification, serial number, etc.) processing temperature, a processing pressure, processing time, processing atmosphere, or any combination thereof.
According to one embodiment, writing manufacturing information to the electronic device can occur during at least one process of forming the abrasive body. The process of forming can include any of the processes described herein, including for example, but not limited to, pressing, molding, casting, heating, curing, coating, cooling, stamping, drying, or any combination thereof. In certain instances, a machine conducting the forming process can conduct the writing operation and write the manufacturing information onto the electronic device. It will be appreciated that such manufacturing information can be processing information.
In an alternative embodiment, a sensor included in the electronic assembly can assist writing manufacturing information to the electronic device during forming of the abrasive body. The sensor may be configured to sense the conditions occurring during processing and write this information to an electronic device as manufacturing information. In still another embodiment, one or more other systems and/or individuals may write the one or more processing conditions used during the forming of the abrasive body as manufacturing information to the electronic device.
In an alternative embodiment, the process of writing manufacturing information to the electronic device can occur after forming the abrasive body. One or more systems and/or individuals may conduct a writing operation to write the manufacturing information on the electronic device after forming of the abrasive body.
In accordance with an embodiment, the manufacturing information stored on the electronic device may be utilized to conduct a quality control inspection of an abrasive article or a plurality of abrasive articles. Review of the manufacturing information, such as processing information, may assist with the identification of processing conditions and identification of abrasive articles that may not meeting a desired minimum quality rating.
After writing information to the electronic device, the one or more actions may be conducted using the manufacturing information. For example, in one embodiment, a system and/or individual may delete at least a portion of the manufacturing information prior to sending the abrasive article to a customer. It may be suitable to delete certain manufacturing information, such as certain processing information pertaining to aspects of forming the abrasive article.
In another embodiment, one or more write operations may be conducted to write information to the electronic device prior to sending the abrasive article to a customer. Such a writing operation may include storing customer information on the electronic device. The customer information may assist with the shipment and/or use of the abrasive article. Various types of customer information that can be included on the electronic device are described herein.
In another embodiment, a read operation may be conducted after writing information to the electronic device. For example, the read operation may read information from the electronic device prior to sending the abrasive article to a customer. Conducting a read operation may facilitate a quality inspection of the abrasive article and the information contained on the electronic device. Upon finalizing of the manufacturing operation, the abrasive article may be sent to shipping and thereafter sent to a customer for use of the abrasive article.
In one particular embodiment, customer information can include use information pertaining to suitable use conditions of the abrasive article. Accordingly, the customer may use the use information to ensure that the abrasive article is used under the proper operating conditions. Specific example of the use information can include, but is not limited to, minimum operating speed, maximum operating speed, burst speed, maximum power of the machine, maximum depth of cut, maximum down force, optimal wheel angle, and the like.
In still another embodiment the process of using customer information can include alerting one or more systems and/or individuals in the supply chain to a particular alert condition. Alert conditions may be based upon one or more pre-programmed thresholds, whereupon exceeding such a threshold, the electronic device can be configured to generate an alert signal. The alert signal can be any signal suitable to contact a system and/or individual in the supply chain, including any system and/or individual associated with manufacturing, shipping, and customers. According to one embodiment, the alert signal may be a sound, optical indicia, or a combination thereof intended to alert a user. In another embodiment, the alert signal may be an electronic communication sent to one or more remote systems or individuals. For example, the alert signal can be sent to a customer-registered device, a manufacturer-registered device, or any combination thereof. Some examples of customer-registered devices can include a customer-registered mobile device or a machine configured to use the abrasive article. In one embodiment the alert signal can be in the form of a text message to a customer-registered mobile device. In another embodiment the alert signal can be an electronic mail (i.e., email) communication to a customer-registered mobile device. A manufacturer-registered device can include for example a manufacturer-registered mobile device, or a manufacturer-registered computer system configured to monitor alert signals from various customers and associated abrasive articles.
In one embodiment, the alert condition can warn of potential damage to the abrasive article. The alert signal can be sent to a user, a system utilizing the abrasive article, and/or other systems and/or individuals in the supply chain of the abrasive article. According to a particular embodiment, the electronic device may include one or more sensors be configured to sense one or more operating conditions. When one of the operating conditions is exceeded, the sensors can communicate with one or more other electronic devices in the electronic assembly and create an alert condition. The alert condition can generate an alert signal that can be sent to one or more systems and/or individuals in the supply chain. In particular instance, the alert signal can be sent to the grinding machine using the abrasive article. The alert signal may be used by the grinding machine to change the operating conditions and eliminate the alert condition.
In another embodiment, the process of alerting the customer can include alerting the customer to alert condition associated with the age of the abrasive article. For example, the electronic device may include one or more timers, wherein after a programmed amount of time has elapsed without use of the abrasive article, the timer can generate an alert condition warning the customer of the age of the abrasive article. It will be appreciated that the other systems and/or individuals in the supply chain can be alerted.
According to another aspect, alerting the customer can include alerting the customer to an alert condition associated with one or more environmental conditions of the abrasive article. For example, in one embodiment, the electronic device can be coupled to a sensor configured to sense one or more environmental conditions. Some suitable examples of environmental conditions that may be sensed by the sensor can include, but is not limited to, the presence of a threshold amount of water vapor within the packaging of the abrasive article, the presence of a threshold amount of water vapor in the abrasive article, the temperature of the abrasive article, the pressure on the abrasive article, the presence of harmful chemicals in the packaging, the presence of harmful chemicals in the abrasive article, damage to the abrasive article, tampering, age of the abrasive article or any combination thereof. The sensors can be pre-programmed with suitable threshold values for certain environmental conditions. If any of the pre-programmed threshold values are exceeded, the sensor can communicate with an electronic device to generate an alert condition and send an alert signal. The alert signal can be sent to one or more systems and/or individuals in the supply chain.
In still another embodiment, alerting the customer can include alerting the customer and/or manufacturer to an alert condition associated with the shipment of the abrasive article. Such an alert signal may facilitate improved distribution and transfer of abrasive articles between a manufacturer and customer. For example, the electronic assembly may include a GPS, which may facilitate tracking of the abrasive article by a customer or manufacturer. Customer information may be used to provide feedback to other systems and/or individuals in the supply chain. For example, customer information may be used to provide feedback to systems and/or individuals associated with the shipping of abrasive articles between the manufacturer and customer. As noted herein, feedback of customer information may facilitate smoother and improved sales, distribution and/or transportation of abrasive articles to customers.
According to another aspect, customer information may be utilized to provide feedback to a manufacturer. For example, in one embodiment customer information such as product use information may be utilized and provided to a manufacturer to better understand conditions of use by customer for a given abrasive article. Such information may be valuable to a manufacturer to assist with providing a customer with optimized abrasive articles and or making suggestions for alternative use conditions or alternative abrasive products.
In another embodiment, the customer information may be used to facilitate future exchanges between the manufacturer and the customer. For example, one or more types of information, such as environmental information or customer information may be used to notify the manufacturer that the customer is in need of more abrasive articles. In one particular embodiment, the customer information may be used to alert the one or more systems or individuals in the supply chain, including for example, an alert to one or more website addresses, emails, and/or sales representatives of the manufacturer.
Many different aspects and embodiments are possible. Some of those aspects and embodiments are described herein. After reading this specification, skilled artisans will appreciate that those aspects and embodiments are only illustrative and do not limit the scope of the present invention. Embodiments may be in accordance with any one or more of the items as listed below.
Representative cut-off wheels S1 were formed as disclosed in embodiments herein. Briefly, a mixture including abrasive particles and a bond material was disposed in a mold and pressed to form a green body. Electronic assemblies 1 to 3 or 4 to 6 as disclosed in Table 1 were placed on the surface in the interior circumferential region of the green body. A set of wheel Samples S1 were formed using electronic assemblies 1 to 3, and another set formed with electronic assemblies 4 to 6. RFID and NFC tags were encapsulated in the protection layers made of polyimide or PEN. The protection layer surrounding the temperature sensor had an opening for the sensing element to detect the temperature of the surface of the body. The temperature sensor was otherwise covered by the protection layer. Green bodies with the electronic assemblies were stacked, and allowed to cure at a temperature up to 180° C. for 16 hours to form finally formed cut-off wheels. The electronic assemblies were bonded to the surface of each wheel.
Additional cut-off wheels S2 were formed according to embodiments noted herein. Briefly, green bodies were formed in the same manner as those of wheels S1. The green bodies were stacked and allowed to cure at the same conditions noted for wheels S1. An RFID tag, NFC tag, and a temperature sensor were placed on a surface in the interior circumferential region of the finally formed wheel bodies. Blotter paper was placed to cover the interior circumferential region, and pressure of 0.2 to 3 bars was applied to the blotter paper, the tags, and the bodies at the temperature of about 150° C. for 20 to 30 minutes to form the finally formed wheels S2.
Wheel Samples S1 and S2 were tested on readability of the tags and sensors. Compared to those that were not subjected to the forming process, readability of the tags and sensors was not affected by the forming process.
Further cut-off wheel Samples were formed in the same manner as Samples S1 except that different electronic assemblies were used. Wheel Samples S3 were formed using electronic assemblies included the same electronic devices and protection layer as noted for Samples S1, and included a hydrophobic layer in addition to the protection layer. Wheel Samples S4 were formed using electronic assemblies where each of the RFID, NFC, and temperature sensors were encapsulated in a hydrophobic layer. The hydrophobic layer for all the samples was made of fluorinated silane.
Samples S3 and S4 were soaked in water-based coolant having a pH of 8.5 to 9.5 for 8 days, and readability of the tags and sensors were tested by using a reader. Another set of wheel Samples S1 and S2 were sprayed on with the similar coolant under normal operating conditions for 20 to 30 minutes. The coolant flow rate was 0.2 to 5 m3/hr. The readability of the tags and sensors after each test was not affected compared to that prior to the test. Further wheel Samples S3 and S4 were sprayed with slurries including the coolant and abrasive particles using a nozzle in the vertical direction for 20 to 30 minutes. The flow rate of the slurry was 0.2 to 1 m3/hr. The readability of the tags and sensors was not affected by the test conditions compared to that prior to the test.
Grinding wheel samples S5 and S6 were formed according to embodiments herein. For forming Sample S5, half of a mixture including abrasive particles and organic bond materials was disposed in a mold and pressed to form a first green body. An electronic assembly including a RFID tag was placed on the first green body and covered by the remaining mixture. The RFID tag was contained in a package including a layer of a thermal barrier and a layer of a pressure barrier. Each layer had a thickness of approximately 80 microns and was made of polyimide. The mixture was pressed to form the green body having the full thickness with the electronic assembly embedded at the depth of 50% of the full thickness. The green body was then heated to cure at the temperature of 160° C. for 24 hours to form the grinding wheel. Sample S6 was formed in the same manner as S5, except that an electronic assembly including a NFC tag and a temperature sensor was embedded at the depth of 20%.
The wheels were operated on a grinder and run at the speed of 2800 rpm for 20 to 30 minutes. Readability of the tags were tested at the end of the grinding operation, and the tags were found fully functional.
Grinding wheel sample S7 was formed according to embodiments noted herein. Briefly, a RFID tag was disposed on the inner circumferential wall of a vitrified wheel. A cement material including calcium-based silicate was applied over the electronic assembly and the entire exposed surface of the inner circumferential wall and allowed to cure at room temperature for 30 minutes to form Sample S7. Readability of the RFID tag was tested and no difference was observed compared to readability of the RFID tag prior to the attachment to the vitrified wheel.
The terms “comprises,” “comprising,” “includes,” “including,” “has,” “having” or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a method, article, or apparatus that comprises a list of features is not necessarily limited only to those features but may include other features not expressly listed or inherent to such method, article, or apparatus. Further, unless expressly stated to the contrary, “or” refers to an inclusive-or and not to an exclusive-or. For example, a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
Also, the use of “a” or “an” is employed to describe elements and components described herein. This is done merely for convenience and to give a general sense of the scope of the invention. This description should be read to include one, at least one, or the singular as also including the plural, or vice versa, unless it is clear that it is meant otherwise. For example, when a single item is described herein, more than one item may be used in place of a single item. Similarly, where more than one item is described herein, a single item may be substituted for that more than one item.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201741035158 | Oct 2017 | IN | national |
This application is a continuation of and claims priority under 35 U.S.C. § 120 to U.S. patent application Ser. No. 16/152,386, entitled “ABRASIVE ARTICLE AND METHOD FOR FORMING SAME,” by Robin Chandras JAYARAM et al., filed Oct. 4, 2018, which claims priority to Indian Application 201741035158, entitled “ABRASIVE ARTICLE AND METHOD FOR FORMING SAME”, by Robin Chandras JAYARAM et al., filed Oct. 4, 2017, all of which are assigned to the current assignee hereof and incorporated herein by reference in their entireties for all purposes.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 16152386 | Oct 2018 | US |
| Child | 18333744 | US |
