Claims
- 1. A process for preparing an abrasive article comprising:
- a) providing a coated abrasive comprising:
- i) a flexible backing having a front side and a back side;
- ii) a plurality of abrasive composites bonded to the front side of the backing, wherein the composites comprises at least one binder and a plurality of abrasive grains; and
- iii) a plurality of metal deposits accessible to metallic adhesive from the back side of the backing;
- b) providing a substrate;
- c) providing a metallic adhesive;
- d) contacting the metallic adhesive, a surface of the substrate, and the metal deposits; and
- e) heating to bond the metallic adhesive to the metal deposits and to the substrate, whereby the metallic adhesive serves to bond the coated abrasive to the substrate.
- 2. A process according to claim 1, wherein the metallic adhesive is selected from the group consisting of a metal solder and a brazing metal.
- 3. A process according to claim 2, wherein the metallic adhesive is a tin/lead alloy solder.
- 4. A process according to claim 1, wherein the heating step comprises vapor heating or vapor phase reflow solder heating for a time sufficient to bond the coated abrasive to the substrate.
- 5. A process according to claim 4, wherein the metallic adhesive is applied either to the metal deposits, the substrate, or to both prior to heating.
- 6. A process according to claim 4, wherein:
- (a) the abrasive grains of the coated abrasive are selected from the group consisting of diamond grains, cubic boron nitride, and mixtures thereof;
- (b) the backing for the coated abrasive is a polyester scrim backing;
- (c) both the metal deposits and the binder for the abrasive grains are nickel;
- (d) the substrate is circuit board; and
- (e) the metallic adhesive is a tin/lead metal solder.
- 7. A process according to claim 4, wherein:
- (a) the abrasive grains are selected from the group consisting of diamond grains, cubic boron nitride, and mixtures thereof;
- (b) the coated abrasive backing is a polyester scrim backing;
- (c) both the metal deposits and the binder for the abrasive grains are nickel;
- (d) the substrate is copper tubing; and (e) the metallic adhesive is a tin/lead solder.
- 8. A process according to claim 4, comprising coating the substrate first with solder before metal deposits of the coated abrasive are contacted therewith.
- 9. A process according to claim 4, wherein the vapor heating is accomplished by contacting the metallic adhesive, the coated abrasive, and the substrate by heated vapors of a fluorinated organic compound at temperatures sufficient to bond the metallic adhesive to both the metal deposits and the substrate.
- 10. A process according to claim 9 wherein the fluorinated organic compound is a perfluoroalkyl tertiary monoamine liquid having a boiling point of 215.degree. C.
Parent Case Info
This is a division of application Ser. No. 07/691,147 filed Apr. 25, 1991, U.S. Pat. No. 5,127,197.
US Referenced Citations (16)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0403652 |
Dec 1990 |
EPX |
57-132973 |
Nov 1982 |
JPX |
61-050773 |
Jul 1986 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
691147 |
Apr 1991 |
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