Claims
- 1. A method for preparing an injection molded saw segment comprises the steps of:
- (a) heating a mass of ultra-hard abrasive particles dispersed in a non-porous thermoplastic polymer matrix in the barrel of an injection molding machine at a temperature of from about 280.degree. to 400.degree. C., wherein the abrasive content of the segment is at least 4 volume percent;
- (b) injecting said heated product of step (a) into a mold at a pressure of from about 70 MPa to 150 MPa; and
- (c) maintaining said injected product of step (b) in said mold at a pressure of about 35 MPa to about 75 MPa for a period of from about 2 to about 10 seconds.
- 2. The method of claim 1 wherein the heating step (a) is conducted at a temperature of from about 150.degree. to 200.degree. C.
- 3. The method of claim 1 wherein the thermoplastic polymer contains a particulate or fiber filler in an amount of up to 40 percent by volume.
- 4. The method of claim 1 wherein the ultra-hard abrasive particles have a size ranging from 50 to 900 microns.
- 5. The method of claim 1 wherein the concentration of the abrasive particles content of the segment is in the range of from 4 to 20 volume percent.
- 6. The method of claim 1 wherein the concentration of the abrasive particles content of the segment is from 15 to 30 volume percent.
- 7. The method of claim 1 wherein the abrasive particles are selected from single crystal diamond, single crystal CBN, polycrystalline diamond and polycrystalline CBN.
- 8. The method of claim 1 wherein the thermoplastic polymer is selected from polyetheretherketone; polyetherketone, polyaryletherketone, poly(amide-imide), polyphenylene sulphide, LCP polymers and mixtures thereof.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9020462 |
Sep 1990 |
GBX |
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Parent Case Info
This is a continuation of copending application Ser. No. 762,422 filed on Sep. 19, 1991 now abandoned.
US Referenced Citations (10)
Foreign Referenced Citations (3)
Number |
Date |
Country |
8809251 |
Dec 1988 |
DEX |
2428510 |
Jan 1990 |
FRX |
0167770 |
Aug 1985 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Patent Abstract of Japan vol. 8, No. 203 (M-326)(1640) Sep. 18, 1984 & JP,A, 59 093 264 (Toukiyou Diamond Kougu Seisakusho K.K.) May 29, 1984. |
Continuations (1)
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Number |
Date |
Country |
Parent |
762422 |
Sep 1991 |
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