ABRUPT METAL-INSULATOR TRANSITION DEVICE WITH PARALLEL CONDUCTING LAYERS

Abstract

An abrupt MIT (metal-insulator transition) device with parallel conducting layers is provided. The abrupt MIT device includes a first electrode disposed on a certain region of a substrate, a second electrode disposed so as to be spaced a predetermined distance apart from the first electrode, and at least one conducting layer electrically connecting the first electrode with the second electrode and having a width that allows the entire region of the conducting layer to be transformed into a metal layer due to an MIT. Due to this configuration, deterioration of the conducting layer, which is typically caused by current flowing through the conducting layer, is less likely to occur.

Description

TECHNICAL FIELD

The present invention relates to a device using a metal-insulator transition (MIT) effect, and more particularly, to a device using an abrupt MIT material as a conductor whose phase can be transformed into a metal.

BACKGROUND ART

As is generally known, an MIT occurs at a Mott insulator and a Hubbard insulator. The Hubbard insulator is a consecutive MIT. A field effect transistor (FET) that uses the Hubbard insulator as a channel layer was introduced in an article by D. M. Newns et al., Appl. Phys. Lett., vol. 73, p. 780, 1998. Since the Hubbard insulator uses an MIT that occurs consecutively, charges to be used as a carrier need to be added consecutively until an excellent metallic characteristic is achieved.

An article by Hyun-Tak Kim, NATO Science Series Vol. II/67, Kluwer, p. 137, 2002, which is also described on the web site http://xxx.lanl.gow/abs/cond-mat/0110112, teaches a theory that supports an abrupt MIT due to the Mott insulator. According to the theory in the above article, the Mott insulator has a bounded and metallic electron structure. Energy between electrons of the Mott insulator is made to change, and thus, an insulator-to-metal transition does not occur consecutively; rather it occurs abruptly. Changing temperature, pressure or an electric field instigates the energy change between the electrons of the Mott insulator. For instance, when holes with a low doping density are added to the Mott insulator, the insulator-to-metal transition occurs abruptly or suddenly.

In a typical abrupt MIT device, when an inconsecutive MIT occurs, a large amount of current flows abruptly. Thus, a conducting layer is more likely to be deteriorated. FIG. 1 illustrates a top view of a typical MIT device 10.

The typical MIT device 10 includes a pair of electrodes 14 and 16 arranged to be spaced a predetermined distance apart from each other on certain regions of a substrate 12. An MIT material layer is disposed between the pair of the electrodes 14 and 16. The MIT material layer makes an electric connection between the electrodes 14 and 16 and causes an abrupt MIT. The abrupt MIT causes the MIT material layer to be transformed into a metal layer. Hence, the MIT material layer can be used as a conducting layer 18. The conducting layer 18 has a width of ‘W’.

FIG. 2 illustrates a top view of a sample 20 analyzed by micro-Raman spectroscopy to check structural uniformity of the conducting layer 18 of the typical MIT device 10 (FIG. 1). FIG. 3 illustrates a graph of the intensity as a function of the Raman shift for the conducting layer 18 illustrated in FIG. 2. As is well known, Raman spectroscopy is used to observe vibration energy of lattices. For metal, a peak is not observed. The width W of the conducting layer 18 is exaggerated for clarity.

The sample 20 includes the conducting layer 18 disposed on a support 22 and an analytical electrode 24 segmented into a certain number of regions and contacting the conducting layer 18. For instance, the analytical electrode 24 is segmented into three regions including an upper region 24A, a central region 24B and a lower region 24C and has a protruding structure. In FIG. 3, the intensity as a function of the Raman shift, which is typically reported in units of cm⁻¹, shows the characteristics of a substrate, more particularly, a region a representing Al₂O₃ and regions b and c measured when a large amount of current, e.g., a current amount of ‘F’ as marked in FIG. 8, flows through the conducting layer 18. The curvature regions b and c are the measurements at the central region 24B (see FIG. 2) and at the upper and lower regions 24A and 24C (see FIG. 2), respectively. Reference numeral 35 represents a peak indicating Al₂O₃. Scattered Raman peaks indicate that a phase of the conducting layer 18 is not yet transformed into a metal state. Therefore, the MIT does not yet take place at the upper region 24A and the lower region 24C, and continues to remain in an insulator state. The central region 24B has a phase transition to metal. The conducting layer 18 that includes an insulator region is called a non-uniform conducting layer. However, an MIT material to be used as the conducting layer 18 usually needs to be uniform. That is, the conducting layer needs to be a uniform conducting layer that is entirely transformed into a metal layer after the MIT.

Due to several limitations in typical fabrication methods, the conducting layer is often non-uniform in actual industrial practice. For instance, the inventors of this patent application reported this exemplary case in New J. Phys. Vol. 6, p. 52, 2004. It was experimentally verified that the conducting layer 18 was easily deteriorated due to the non-uniformity characteristic. In detail, the non-uniform conducting layer 18 was easily deteriorated due to heat generated by a large amount of current.

In order to implement an MIT in other application fields, a large amount of current needs to flow uniformly after a phase transition from an insulator to a metal occurs. Hence, it is generally essential to develop a uniform conducting layer. A method of reducing the deterioration of a conducting layer when current flows through an MIT device has not yet been developed.

DISCLOSURE OF INVENTION

Technical Problem

The present invention provides an abrupt MIT device that can reduce deterioration of a conducting layer when current flows through the conducting layer.

Technical Solution

According to an aspect of the present invention, there is provided an abrupt MIT device, including a first electrode disposed on a certain region of a substrate, a second electrode disposed so as to be spaced a predetermined distance apart from the first electrode, and at least one conducting layer electrically connecting the first electrode with the second electrode and having a width that allows the entire region of the conducting layer to be transformed into a metal layer due to an MIT.

The abrupt MIT device may further include a gate electrode configured to extend over a certain region of the conducting layer and have a gate insulation layer interposed between the conducting layer and the gate electrode. The conducting layer, the first electrode and the second electrode may be configured to become parts of a protection circuit. The abrupt MIT device may further include an electrical system connected in parallel with the protection circuit.

DESCRIPTION OF DRAWINGS

The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:

FIG. 1 illustrates a top view of a typical MIT device including two terminals configured in a horizontal structure;

FIG. 2 illustrates a top view of a sample analyzed by micro-Raman spectroscopy to check structural uniformity of a conducting layer of a typical MIT device;

FIG. 3 illustrates a graph of the intensity as a function of the Raman shift for the conducting layer illustrated in FIG. 2;

FIG. 4 illustrates a top view of an MIT device including two terminals configured in a horizontal structure, according to an embodiment of the present invention;

FIG. 5 illustrates a top view of an MIT device including three terminals configured in a horizontal structure, in which a gate insulator is formed on a conducting layer, according to another embodiment of the present invention;

FIG. 6 illustrates a top view of an MIT device including three terminals configured in a horizontal structure, in which a gate insulator is formed below a conducting layer, according to another embodiment of the present invention;

FIG. 7 illustrates a top view of an MIT device including three terminals configured in a horizontal structure, in which a conducting layer is formed on a gate insulator, according to another embodiment of the present invention;

FIG. 8 illustrates a graph of current (I) versus voltage (V) applied to a conducting layer according to an embodiment of the present invention;

FIG. 9 is a circuit diagram illustrating a protection circuit, an equivalent load R_L and a power supply voltage V_p terminal according to an embodiment of the present invention; and

FIG. 10 illustrates a graph of voltage of an MIT device versus time for which the power supply voltage V_p terminal illustrated in FIG. 9 supplies a voltage of approximately 1,500 V according to an embodiment of the present invention.

BEST MODE

The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. The invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Like reference numerals denote like elements even in different drawings.

A conducting layer that is entirely transformed into a metal layer due to an MIT and MIT devices using the conducting layer according to various embodiments of the present invention will be described below in detail. The conducting layer has a path where current can flow, and in particular, conducting layers according to various embodiments of the present invention can be transformed into a metal layer across their entire width. As described in FIG. 3, the conducting layer does not have the scattered Raman peak, and more particularly, current needs to flow uniformly to the conducting layer.

The conducting layer according to various embodiments of the present invention includes a material that can undergo an abrupt MIT. Thus, a device using the conducting layer can be referred as to an MIT device. The MIT device can be modified into various forms within the scope and sprit of the present invention. The illustrated MIT devices are exemplary embodiments.

FIG. 4 illustrates a top view of an MIT device 100 including two terminals configured in a horizontal structure according to an embodiment of the present invention.

As illustrated, at least one conducting layer 110 is disposed between a first electrode 104 and a second electrode 106 that are arranged so as to be spaced a pre-determined distance apart from each other over certain regions of a substrate 102. The conducting layer 110 makes an electric connection between the first electrode 104 and the second electrode 106, and in the present embodiment, multiple conducting layers 110 are formed. Each of the conducting layers 110 has a region having a width W₁, W₂ or W₃, at which the individual conducting layers 110 can be transformed into metal layers due to an MIT. If there are multiple conducting layers 110, the conducting layers 110 may be electrically connected in parallel. Although not illustrated, a buffer layer may further be disposed between the substrate 102 and the conducing layer 110. The buffer layer may be disposed over the entire substrate 102.

The conducting layer 110 may include one selected from a group consisting of an inorganic compound semiconductor and an insulator, an organic semiconductor and an insulator, a semiconductor, and an oxide-based semiconductor and an insulator. The inorganic compound semiconductor includes one selected from a group consisting of oxygen, carbon, semi-conductive elements from groups III to V or groups II to VI, transition metal elements, rare-earth elements, and lanthanum-based elements, and holes with a low doping density are added thereto. Holes with a low doping density are also added to the organic semiconductor, and the insulator the semiconductor, and the oxide-based semiconductor and the insulator.

The entire region of the conducting layer 110 having the set width is transformed into a metal layer, and thus, the Raman peak is not observed. Also, current needs to flow uniformly throughout the conducting layer 110. If the current flow is uniform throughout the conducting layer 110, heat generation caused by resistance can be reduced. As a result, the conducting layer 110 can be formed more stably.

The current flowing through the conducting layer 110 is substantially the same as the sum of the areas of the multiple conducting layers 110, and the amount of current may be at least two times larger than that of the current flowing through the conducting layer 18 that has the Raman peak as described in FIG. 3. For instance, assuming that one conducting layer including the Raman peak (i.e., the non-uniform conducting layer) has a width W, this conducting layer can be segmented into multiple conducting layers 110, each having a width W₁, W₂ or W₃ as described in the present embodiment. Although FIG. 3 illustrates three conducting layers 110, which are uniform conducting layers, as an example, various numbers of conducting layers 110 may be formed as need requires. The conducting layer 110 according to the present embodiment is a uniform conductor. Thus, a larger current amount can flow thereto as compared with the current amount flowing to the typical non-uniform conducting layer. A parallel connection of the multiple conducting layers 110 allows a current flow to increase to a greater extent.

Each of the first electrode 104 and the second electrode 106 may include one selected from a group consisting of a metal group, a compound of metals selected from the metal group, and an oxide-based material including one metal from the metal group and the compound. The metal group includes Li, Be, C, Na, Mg, Al, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Cs, Ba, La, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Pb, Bi, Po, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Th, U, Np, and Pu.

A protection electrode 108 being resistant to heat, which may be generated by current flowing to the conducting layer 110, may be further formed between the conducting layer 110 and the first electrode 104 and between the conducting layer 110 and the second electrode 106. Since the conducting layer 110 illustrated in FIG. 1 may be realised as multiple conducting layers 110, multiple protection electrodes 108 may also be formed. The protection electrode 108 may include one selected from a group consisting of a metal group, a compound of metals selected from the metal group, and an oxide-based material including one metal from the metal group and the compound. The metal group includes Li, Be, C, Na, Mg, Al, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Cs, Ba, La, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Pb, Bi, Po, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Th, U, Np, and Pu.

Although the substrate 102 is not limited to a specific material, the substrate 102 may include one selected from a group consisting of an organic layer, an inorganic layer, at least one multi-layer including multiple layers of the organic layer and the inorganic layer, and a patterned structure thereof. For instance, the substrate 102 may be formed using various materials such as single crystal sapphire, silicon, glass, quartz, compound semiconductors, and plastic materials. In the case of using glass or plastic materials, a reaction temperature is limited. Using a plastic material allows the substrate 102 to be flexible. Silicon, glass and quartz are advantageous when the substrate 102 is required to have a diameter of 8 inches or more. The substrate 102 may also have a silicon on insulator (SOI) structure to satisfy the requirement.

The buffer layer is formed to improve crystallinity and adhesiveness. The buffer layer may include a crystalline thin film that has a similar lattice constant to the conducting layer 110. For instance, the buffer layer may be formed of one selected from a group consisting of aluminium oxide, high-k dielectric materials, crystalline metal, and silicon oxide. An aluminium oxide layer that can maintain a certain level of crystallinity is sufficient, and the silicon oxide layer is formed as thin as possible. In particular, the buffer layer may be formed in multiple layers including high-k dielectric layers with excellent crystallinity, mixture layers thereof, and/or crystalline metal layers. TiO₂, ZrO₂, Ta₂O₅, and HfO₂ layers are examples of the high-k dielectric layers.

In a device with two terminals, as the conducting layer 110 is transformed into a metal layer, current flows in a direction horizontal to the substrate 102. Although not described in detail, the conducting layer can be applied to a device with two terminals configured in a vertical structure, in which current flows in the direction vertical to the substrate 102.

FIGS. 5 through 7 illustrate top views of respective MIT devices 210, 220, and 230 according to other embodiments of the present invention. Devices with three terminals configured in a horizontal structure are exemplified below in the other embodiments of the present invention. The same reference numerals represent the same elements described in FIG. 4, and thus, detailed description thereof will be omitted.

As illustrated in FIG. 5, the device with the three terminals (i.e., MIT device 210) may be configured such that a gate insulation layer 202 is disposed over conducting layers 110, and a third electrode 204 extends over a certain region of the gate insulation layer 202. As illustrated in FIG. 6, another device with three terminals (i.e., the MIT device 220) may be configured such that a fourth electrode 214 is disposed between a substrate 102 and conducting layers 110, and the fourth electrode extends over certain regions of the conducting layers 110 with a gate insulation layer 212 formed between the fourth electrode 214 and the conducting layers 110. FIG. 5 illustrates a device structure in which the third gate electrode 204 is disposed on top of the conducting layers 110. In contrast, FIG. 6 illustrates a device structure in which the fourth gate electrode 214 is disposed underneath the conducting layers 110.

FIG. 7 illustrates a device structure that is substantially the same as the device structure illustrated in FIG. 6 except for the shape of a conducting layer 222. The conducting layer 222 may be configured to cover an entire region between a first electrode 104 and a second electrode 106. The conducting layer 222 has a width Wf that allows the entire region of the conducting layer 222 to be transformed into a metal layer due to an MIT. Unlike the conducting layers 110 illustrated in FIGS. 5 and 6, the conducting layer 222 is not segmented. When an electric field is applied, a conductive channel of the conducting layer 222 is formed along a region having the shortest distance between the first electrode 104 and the second electrode 106. Thus, the device with the three terminals illustrated in FIG. 7 may operate similarly to the device with the three terminals illustrated in FIG. 5 or 6.

The gate insulation layers 202 and 212 illustrated in FIGS. 5 through 7 cover one surface region of each of the conducting layers 110 and 222 because of the following reason. Since the conducting layers 202 and 212 are already transformed into metal layers, as known, current flows to the surfaces of the conducting layers 110 and 222 due to a surface effect. If necessary, an amount of current flowing to the conducting layer 110 or 222 contacting the gate insulation layer 202 or 212 can be adjusted by covering exposed surface regions of the conducting layer 110 or 222, e.g., upper surfaces and both side surfaces of the conducting layers 110 illustrated in FIG. 5.

FIGS. 5 through 7 show various exemplary implementations of the device with the three terminals using the single or multiple conducing layers according to the embodiments of the present invention. Therefore, the conducting layers can be applicable to those devices with three terminals configured in various structures without departing from the scope and spirit of the present invention.

FIG. 8 illustrates a graph of current (I) versus voltage (V) of a conducting layer according to an embodiment of the present invention. The conducting layer has a length L of approximately 15 μm. Multiple conducting layers are formed (i.e., a segmented conducting layer). In this embodiment, the conducting layer is segmented into 10 regions, each having a width of approximately 10 μm, and the 10 segmented regions of the conducting layer are connected in parallel to have a total width W of approximately 150 μm. Reference denotations □, ◯, and Δ represent the number of tests performed, e.g., one time, two times and three times, respectively.

As illustrated, the conducting layer has a critical voltage e at which an abrupt electric characteristic of the conducting layer changes abruptly from an insulator d to a metal state f. In the present embodiment, the critical voltage of the conducting layer when it has undergone an abrupt transition is approximately 13 V. In more detail, when the voltage of the conducting layer is in a voltage range from approximately 0 V to 13 V, the conductive layer is in an insulator state d in which current barely flows, and when the voltage of the conductive layer is greater than approximately 13 V, the conducting layer is in the metal state f. In other words, abruptly current jump occurs at a voltage of approximately 13 V. At this time, when the conducting layer is in a metal state f, it contains lots of electrons. The critical voltage, i.e., the electrical characteristic of the conducting layer, may vary depending on a device structure including an abrupt MIT material layer and the type of material layer used.

FIG. 9 is an exemplary circuit diagram illustrating a protection circuit 300, an equivalent load R_L and a power supply voltage V_p terminal according to an embodiment of the present invention.

The protection circuit 300 is configured to remove static electricity applied to the equivalent load R_L through a terminal to which the power supply voltage V_p is supplied or to remove high voltage and high frequency noise. The protection circuit 300 is configured with an MIT device, e.g., the device with the two terminals illustrated in FIG. 4, and a protection resistor R_p that are connected in parallel. The protection resistor R_p limits a voltage or current to a certain level or amount applied to the MIT device in order to protect the MIT device.

FIG. 10 illustrates a graph of voltage versus time for which power is supplied from the power supply voltage V_p terminal illustrated in FIG. 9. In a voltage range from approximately 250 V to 1,000 V, a voltage of the MIT device was measured for every 50 V. In a voltage range from approximately 1,000 V to 1,500 V, the voltage of the MIT device was measured for every 100 V. The measured voltage level at each measuring point is labelled with small circles ◯. The conducting layer illustrated in FIG. 8 was used. More specifically, the conducting layer had a length L of approximately 15 μm and a total width of approximately 150 μm attained by making a parallel connection between the 10 segmented regions of the conducting layer, each having a width of approximately 10 μm.

As illustrated, when the power supply voltage V_p terminal supplies a voltage of approximately 1,500 V for approximately 10⁻⁹ seconds, the MIT occurs at the conducing layer. As a result, most of the current flows to the conducting layer. Due to the resistance of the protection circuit 300, the level of residual voltage is approximately 800 V, and the remaining voltage of approximately 1320 V is supplied to the equivalent load R_L, namely a load resistor. However, when the voltage supplied to the load resistor R_L, current flows barely. Thus, damage to the load resistor R_L, usually caused by the power supply voltage V_p, can be reduced. The power supply voltage V_p may be noise supplied through the terminal.

As is known in the art, the current conducting capability of the protection circuit increases as the resistance of the conducting layer decreases. After the MIT, the conducting layer according to the embodiments of the present invention can conduct a larger amount of current than the typical non-uniform conducting layer including an insulator structure. Since the conducting layer according to the embodiments of the pre sent invention is a uniform conductor, a current flow increases to a greater extent as compared with the non-uniform conducting layer. An appropriate parallel connection of the segmented regions of the conducting layers allows a much larger amount of current to flow as compared with other conducting layers.

According to the embodiments of the present invention, the abrupt MIT-based device uses at least one conducting layer having a region that can be entirely transformed into a metal layer after the MIT. Thus, it is possible to reduce deterioration of the conducting layer due to heat, typically generated by a large amount of current flowing through the conducting layer.

Furthermore, connecting the multiple conducting layers in parallel allows appropriately adjusting an amount of current flowing through the conducting layers.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.

Claims

1. An abrupt MIT (metal-insulator transition) device comprising: at least one conducting layer having a width that allows the entire region of the conducting layer to be transformed into a metal layer due to an MIT.

2. The abrupt MIT device of claim 1 further comprising: a first electrode disposed on a certain region of a substrate; anda second electrode disposed so as to be spaced a predetermined distance apart from the first electrode;wherein the conducting layer electrically connecting the first electrode with the second electrode.

3. The abrupt MIT device of claim 2, wherein the first electrode and the second electrode are spaced a predetermined distance from each other and partially cover both the first and second sides of the MIT insulator.

4. The abrupt MIT device of claim 2 wherein the first electrode and the second electrode are disposed with the MIT insulator therebetween and entirely cover both the first and second sides of the MIT insulator.

5. The abrupt MIT device of claim 1, wherein if the conducting layer is realized as a plurality of conductive layers, the conducting layers are electrically connected in parallel.

6. The abrupt MIT device of claim 1, wherein the conducting layer includes one selected from a group consisting of an inorganic compound semiconductor and an insulator, an organic semiconductor and an insulator, a semiconductor, and an oxide-based semiconductor and an insulator, wherein the inorganic compound semiconductor includes one selected from a group consisting of oxygen, carbon, semi-conductive elements from groups III to V or groups II to VI, transition metal elements, rare-earth elements, and lanthanum-based elements, and holes with a low doping density are added to the inorganic compound semiconductor and the insulator; and holes with a low doping density are added to the organic semiconductor and the insulator, the semiconductor, and the oxide-based semi-conductor and the insulator.

7. The abrupt MIT device of claim 1, wherein current flows uniformly to the entire region of the conducting layer.

8. The abrupt MIT device of claim 2, wherein each of the first electrode and the second electrode includes one selected from a group consisting of a metal group, a compound of metals selected from the metal group, and an oxide-based material including one metal from the metal group and the compound, wherein the metal group includes Li, Be, C, Na, Mg, Al, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Cs, Ba, La, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Pb, Bi, Po, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Th, U, Np, and Pu.

9. The abrupt MIT device of claim 2, further comprising a protection electrode disposed between the conducting layer and the first electrode and between the conducting layer and the second electrode and resistant to heat generated by current flowing through the conducting layer.

10. The abrupt MIT device of claim 9, wherein the protection electrode includes one selected from a group consisting of a metal group, a compound of metals selected from the metal group, and an oxide-based material including one metal from the metal group and the compound, wherein the metal group includes Li, Be, C, Na, Mg, Al, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Cs, Ba, La, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Pb, Bi, Po, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Th, U, Np, and Pu.

11. The abrupt MIT device of claim 2, further comprising a gate electrode configured to extend over a certain region of the conducting layer and have a gate insulation layer interposed between the conducting layer and the gate electrode.

12. The abrupt MIT device of claim 11, wherein the gate insulation layer covers at least one surface region of the conducting layer.

13. The abrupt MIT device of claim 11, further comprising a third electrode configured to extend over a certain region of the conducting layer and have a gate insulation layer interposed between the conducting layer and the third electrode.

14. The abrupt MIT device of claim 11, further comprising a third electrode configured to extend over the conducting layer and have a gate insulation layer interposed between the conducting layer and the substrate.

15. The abrupt MIT device of claim 11, further comprising a third electrode configured to extend over the conducting layer and have a gate insulation layer interposed between the conducting layer and the substrate, wherein the conducting layer covers an entire region between the first electrode and the second electrode.

16. The abrupt MIT device of claim 2, wherein the conducting layer, the first electrode and the second electrode are configured to become parts of a protection circuit, and the abrupt MIT device further comprises an electrical system connected in parallel with the protection circuit.

17. The abrupt MIT device of claim 16, wherein the protection circuit takes in most of the current due to the abrupt MIT.

18. The abrupt MIT device of claim 16, wherein the electrical system is protected by conducting most of the current through the protection circuit.