Claims
- 1. A method of making an absorbent paper product of an approximate specific surface weight between 36 and 105 g/m2, comprising at least three plies, a central ply, an embossed upper outer ply, and an embossed lower outer ply, each ply being fitted with a salient pattern including at least in part discrete protrusions, the distal areas of at least part of the protrusions of each outer ply facing the central ply, and at least one of the upper outer ply and lower outer ply having a pattern density larger than 30 protrusions/cm2, the lower outer ply comprising a first pattern and a second pattern, the height of the second pattern being less than the height of the first pattern, wherein the central ply and the upper outer ply are joined in a nested mode to said lower outer ply at a level of at least part of the tops of the first pattern of said lower outer ply, wherein each of the at least three plies has an approximate specific surface weight of between 12 and 35 g/m2, said method comprising:embossing said lower outer ply on an embossing cylinder comprising at least one salient pattern constituted at least in part by embossing tips of a height (H1) in order to fit said lower outer ply with a first pattern of protrusions, superposing the central ply on said protrusions of the first pattern of said lower outer ply, embossing said upper outer ply on an embossing cylinder having a salient pattern constituted at least in part by embossing tips of a height (h′1), joining the lower outer ply fitted with the central ply to the upper outer ply by means of a joining cylinder in the nested mode, and applying sufficient pressure to assure joining of the at least three plies.
- 2. Method as claimed in claim 1, wherein an adhesive is applied to an outside surface of the central ply opposite distal areas of the first pattern of the lower outer ply.
- 3. Method as claimed in claim 2 wherein the adhesive is applied by an adhesive dispenser comprising an applicator cylinder.
- 4. Method as claimed in claim 1 wherein the embossing cylinder comprises a second pattern of embossing tips at a level h1 having a height less than that of H1.
- 5. Method as claimed in claim 4 wherein the embossing tips of height (H1) are from 0.2 and 2 mm in height and a differential between H1 and h1 is between 0.1 and 0.7 mm.
- 6. Method as claimed in claim 1 wherein an aqueous or hot-melt adhesive is applied by spraying to join the at least three plies.
- 7. Method as claimed in claim 6, wherein the adhesive is applied at a level of the first pattern.
Priority Claims (1)
Number |
Date |
Country |
Kind |
99440240 |
Aug 1999 |
EP |
|
Parent Case Info
This is a division of application Ser. No. 09/651,995 filed Aug. 31, 2000 now U.S. Pat. No. 6,551,691.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4659608 |
Schulz |
Apr 1987 |
A |
4671983 |
Burt |
Jun 1987 |
A |
4978565 |
Pigneul et al. |
Dec 1990 |
A |