Claims
- 1. An acceleration sensor device comprising:an acceleration sensor including a piezoelectric element provided with a respective electrode and subject to a shearing strains, and a weight section connected to said piezoelectric element and supported at a support point different from a position of a center of gravity of an assembly of said piezoelectric element and weight section, wherein said weight section is provided with a wiring pattern connected to each said electrode, wherein said piezoelectric element detects an angular moment about the support point as shearing strains, the angular moment being exerted in said weight section when an acceleration is applied, and electrical signals corresponding to said acceleration are output from each said electrode through said wiring pattern; and a package including a base provided with said wiring pattern and a cap covering said base, for storing said acceleration sensor therein.
- 2. The acceleration sensor device as set forth in claim 1, whereinsaid package has a detection circuit for detecting an acceleration based on said electrical signal.
- 3. The acceleration sensor device as set forth in claim 1, whereina part of said weight section is sandwiched by said package.
- 4. The acceleration sensor device as set forth in claim 1, whereina part of said weight section and a part of said piezoelectric element are sandwiched by said package.
- 5. The acceleration sensor device as set forth in claim 3, whereinthe part of said weight section sandwiched by said package is a portion located on one side of the position of said piezoelectric element opposite to the other side including the position of said center of gravity.
- 6. The acceleration sensor device as set forth in claim 3, whereina length of the part of said weight section sandwiched by said package is not more than a length of said piezoelectric element.
- 7. The acceleration sensor device as set forth in claim 1, whereinsaid piezoelectric element has a package-side electrode, said package is provided with a wiring pattern connected to said package-side electrode, said piezoelectric element and package are bonded together with an adhesive, and an area of their bonded face is larger than an area of said package-side electrode and/or said wiring pattern.
Priority Claims (3)
Number |
Date |
Country |
Kind |
11-375813 |
Dec 1999 |
JP |
|
2000-105426 |
Apr 2000 |
JP |
|
2000-131714 |
Apr 2000 |
JP |
|
Parent Case Info
This application is a divisional of prior application Ser. No. 09/722,716 filed Nov. 28, 2000 now U.S. Pat. No. 6,578,421.
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May 1996 |
A |
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Kouhei et al. |
Oct 1998 |
A |
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