Patent Application
20140116137
This application is based upon and claims the benefit of the priority of Japanese patent application No. 2011-117567 filed on May 26, 2011, the disclosure of which is incorporated herein in its entirety by reference thereto.
This invention relates to an acceleration sensor for measuring or detecting vibration of an electronic device having a mechanical driving source.
Recent years, information electronic devices become popular, and the amount of information stored into an information storage apparatus such as HDDs and the value of the information thereof have been increased. In general, an HDD having high cost performance in capacity is used as an information storage apparatus.
However, since the HDDs are configured with mechanical running parts, the loss of information associated with the mechanical failure thereof is to be a problem. Therefore, before the HDD failure is generated, the protection of information stored in the HDD is carried out by measuring vibration generated when the mechanical running parts operate and by detecting a characteristic vibration as a sign of failure. Here, in general, an acceleration sensor is used for detection of vibration.
In an acceleration sensor used for a system for information protection, a long life and high-reliability acceleration sensor is required that can withstand the use under electrically noisy surroundings in electronic devices and having impact resistance exceeding a specification of apparatus that is subjected to measurement.
Heretofore, a sensor using a piezoelectric body, such as piezoelectric ceramic, is known as an acceleration sensor, which uses mechanic-electric conversion properties. A piezoelectric acceleration sensor converts the strain of the piezoelectric body generated by mechanical vibration from outside, to electrical voltage by the piezoelectric effect thereof and then supplying it. There is a type of a piezoelectric acceleration sensor in which electrical charge is generated due to the bending vibration of a vibrating element composed of a laminate structure of a piezoelectric ceramic plate and a metal supporting plate.
According to a supporting manner of the vibrating element, bending type piezoelectric acceleration sensors are classified into a cantilever beam type structure and a fixed-fixed beam type structure. Both of the bending type piezoelectric acceleration sensors are achieved by fixing an end of the vibrating element to a sensor housing to be a supporting base by using adhesive agents etc.
In addition, in order to improve the electrical shielding effect of the loaded electric circuit and the vibration transmission efficiency to the vibrating element, metal materials are widely used for the sensor housing (Patent literature 1).
However, when the metallic sensor housing and the vibrating element are directly and electrically connected, there is a problem in that an electrical noise caused by an outer mixed electrical charge is overlapped to a sensor output signal due to mixing a electrical charge, which is transmitted from outside to the vibrating element via the sensor housing, into an amplifier circuit which essentially amplifies an output electrical charge of the vibrating element. As a structure that can solve this problem, there is a structure providing an insulating layer between the vibrating element and the sensor housing supporting portion (Patent literature 2).
In addition, a structure forming the vibrating element on the circuit board can electrically insulate the sensor housing and the vibrating element (Patent literature 3). Further, there is a structure insulating the vibrating element from the metal housing by that the vibrating element has a hollow circular diaphragm structure and the hollow portion thereof is supported by an insulating ring projection (Patent literature 4).
The entire disclosures in the above Patent literatures 1 to 4 are incorporated and described herein by reference thereto. The following analysis is provided by the present invention. In a conventional acceleration sensor, there is a problem shown below. First, there is a problem that, if a thickness of an adhesive layer formed is thin, concave-convex shapes in the surface of a supporting portion formed in a sensor housing and an adhesion surface of a vibrating element partially make contact thereby having electrical conductivities, and, as a result, insulation properties can not be maintained. Further, there is a problem in that the vibration characteristic of the vibrating element varies depending on the fluctuation in the thickness of the adhesive layer.
Second, there is a problem that, in general, electrically-conductive adhesive agents are used for bonding boards and vibrating elements, however, it is difficult to extend a life due to a detachment of a joint portion by an impact acceleration applied from outside or by stress repetitively generated in a supporting portion by the bending vibration of the vibrating element.
Third, there is a problem that, in a structure that a hollow circular diaphragm vibrating element is supported by an insulating ring projection, since an electrode for a sensor output is provided in a peripheral portion subjected to large vibration amplitudes, vibration characteristics of the vibrating element is changed depending on the fluctuation in solder volume or in solder point and, as a result, individual differences become large.
Therefore, a highly reliable acceleration sensor is desired that can easily control the thickness of the insulating layer provided between the vibrating element and the supporting base, and that has a supporting portion structure which increases the adhesion strength between a contact portion of the vibrating element and a circuit board for getting electrical signals and which increases the adhesion strength with the supporting base and that achieves a long life and the stable sensor characteristics of high resistance to mechanical impact and electrical noise mixed from outside.
In a first aspect of the present invention, an acceleration sensor according to the present invention is a piezoelectric acceleration sensor comprising a vibrating element including a piezoelectric body, a circuit board amplifying output charge of the piezoelectric body that is generated due to bending vibration of the vibrating element, and a sensor housing composed of a highly conductive material, the sensor housing receiving the vibrating element and the circuit board. The circuit board includes one or two extending region(s) formed so as to protrude from one side of the circuit board, the extending region(s) connecting mechanically and electrically the circuit board to the vibrating element. The sensor housing includes a supporting base supporting the vibrating element, and a recess portion is formed on the supporting base. The supporting base is configured such that the extending region(s) of the circuit board cover(s) the recess portion, and the vibrating element is fixed and supported by an insulating adhesive agent with which a space that is formed from the recess portion and the extending region(s) is filled.
According to such configuration, an acceleration sensor with high reliability can be achieved that is necessary for measuring or detecting the vibration of an electrical device having a mechanical driving source.
In a first aspect, it is preferred that the sensor housing further includes a stepwise guide portion for positioning the circuit board.
In addition, it is preferred that one or more through-hole(s) is/are provided in a contact portion of the insulating adhesive agent with which the space is filled and the extending region, in the extending region.
In addition, it is preferred that one or more depression(s) is/are provided in a contact portion of the insulating adhesive agent with which the space is filled and the extending region, in the extending region.
In addition, it is preferred that a notch portion is formed in a root portion of the extending region.
In addition, it is preferred that the vibrating element has a laminate structure of the piezoelectric body and a metal supporting plate.
In addition, it is preferred that a depth of the recess portion is three times more than a larger value among a center line average roughness of the surface of the metal supporting plate of the vibrating element and a center line average roughness of the bottom face of the recess portion.
In addition, it is preferred that a height of the guide portion from the bottom face of the sensor housing is same as a height of the supporting base from the bottom face of the sensor housing.
According to such configuration, the insulation property from the sensor housing can be maintained by the insulating adhesive layer intervening between the vibrating element and the supporting base, and since the thickness of an insulating layer can be controlled to a constant thickness by a gap (clearance) between the surface of the supporting base where the circuit board is arranged and the bottom face of the recess portion, an acceleration sensor can be achieved that has high resistance to electrical noise mixed from outside, and has highly stable sensor characteristics and small fluctuation of the sensor characteristics.
Further, the insulating adhesive agent can integrally bond an end of the vibrating element and the circuit board through a gap between an aperture of the recess portion formed at the supporting base and the vibrating element, and since a bond surface area formed from two faces that are the bottom face of the recess portion and a wall face, becomes wider than a flat face having no recess portion by filling the insulating adhesive agent into the recess portion, the adhesive strength of the vibrating element and the supporting base also increases. Thus, a detachment of the vibrating element and the circuit board and a detachment from the supporting base that are associated with an impact acceleration applied from outside, can be prevented, a long life acceleration sensor can be achieved by acquiring high mechanical impact resistance.
Exemplary Embodiments of the present invention will be explained referring to the drawings. In addition, in a configuration of each Exemplary Embodiment explained below, the same elements are denoted by the same reference numerals and the redundant explanations thereof are omitted. It is to be noted that drawing reference symbols are added in order to understand the present invention, and are not intended to limit the present invention to the illustrated modes of the drawings.
A first exemplary embodiment is an acceleration sensor comprising a sensor housing 11 using a highly conductive material, a vibrating element 100 having a laminate structure of a piezoelectric body 101 and a metal supporting plate 102, and a circuit board 10 amplifying an output electrical charge of the piezoelectric body 101 which is generated due to bending vibration of the vibrating element 100.
Shown in the plan view of
The sensor housing 11 has a guide portion 13 positioning and mounting the circuit board 10 and a supporting base 14 supporting and fixing the vibrating element 100. As shown in
As shown in
An outer form of the sensor housing 11 was 8.5 mm in length, 8.5 mm in width and 3 mm in height. The guide portion 13 provided in the shown position for mounting the circuit board was 0.5 mm in width and 1 mm in height. The supporting base 14 provided at a shown position for mounting the vibrating element was 2 mm in width, 1 mm in length, and 1 mm in height, and the recess portion 15 (which was 1.8 mm in width, 0.8 mm in length and 105 micro meters in depth) was formed on the supporting base. An outer form of the circuit base 10 was 7.5 mm in length and 7.5 mm in width, and the extending regions 12 (which was 2 mm in length and 1 mm in width) for mounting the vibrating element were provided at two positions shown on one side (region) of the circuit board. An outer form of the metal supporting plate 102 of the vibrating element was 1.5 mm in width, 6.5 mm in length, and 100 micro meters in thickness.
In Table 1, a comparison between electrical noise resistance of the acceleration sensor according to the first exemplary embodiment in the present invention and that of a conventional acceleration sensor in which a vibrating element is electrically connected to a sensor housing is shown, the electrical noise resistance being measured in an amount of a normalized electrical charge obtained by normalizing an amount of the electrical charge applied to the sensor housing from outside with an amount of the electrical charge in which electrical noise due to a externally applied electrical charge is not overlapped to the signal output of the acceleration sensor.
In a normalized impact acceleration obtained by normalizing an impact acceleration applied from outside with an acceleration at which a detachment between the vibrating element and the sensor housing is generated in the conventional sensor, the mechanical impact resistances of the first exemplary embodiment of the present invention and the conventional sensor are shown in Table 2.
As can be seen from Tables 1 and 2, the acceleration sensor of the first exemplary embodiment shows high electrical noise resistance and high mechanical impact resistance.
In a second exemplary embodiment, as shown in
A mechanical impact resistance of the second exemplary embodiment of the present invention is shown in Table 3 in a normalized impact acceleration obtained by normalizing an impact acceleration applied from outside with the acceleration at which the detachment of the vibrating element and the sensor housing is generated in the sensor of the first exemplary embodiment.
As can be seen from Table 3, the acceleration sensor of the second exemplary embodiment shows high mechanical impact resistance.
In addition, a depression may be formed instead of the through-hole formed in the extending region (not shown). A similar effect by the increase of the adhesion surface area of the extending region can be achieved.
In a third exemplary embodiment, as shown in
In a normalized acceleration obtained by normalizing a vibration acceleration transmitted from the signal cable with a vibration acceleration transmitted from the sensor cable when mechanical noise was overlapped to a sensor output in the acceleration sensor in the first exemplary embodiment, the mechanical noise resistance of the third exemplary embodiment of the present invention is shown in Table 4. As can be seen from Table 4, the acceleration sensor of the fourth exemplary embodiment shows high mechanical noise resistance.
As shown in
An impedance change is shown in
In the fifth exemplary embodiment, as shown in
Table 5 shows that a rate of an acceleration sensor in which electrical and mechanical failure was generated before the failure of the HDD, the subject of measurement, was failed. As tested samples, 100 samples were prepared. As a comparison, the same number of acceleration sensors having a conventional structure were evaluated.
As can be seen from Table 5, since the failure rate of the acceleration sensor of this exemplary embodiment was 1%, it was lower than that of the conventional acceleration sensor (10%). Thus, it is found that high reliability can be maintained.
While the present invention has been described with reference to above embodiments, modifications and adjustments of exemplary embodiments are possible within the bounds of the entire disclosure (including the claims and figures) of the present invention, and also based on fundamental technological concepts thereof. Furthermore, a wide variety of combinations and selections of various disclosed elements (including each element of each claim, embodiment and figure etc.) is possible within the claims of the present invention. That is, the present invention clearly includes every type of transformation and modification that a person skilled in the art can do according to the entire disclosure including the claims and figures and to technological concepts thereof.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2011-117567 | May 2011 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2012/063470 | 5/25/2012 | WO | 00 | 11/21/2013 |
