Accurate bandgap circuit for a CMOS process without NPN devices

Information

  • Patent Grant
  • 6181196
  • Patent Number
    6,181,196
  • Date Filed
    Monday, December 14, 1998
    26 years ago
  • Date Issued
    Tuesday, January 30, 2001
    24 years ago
Abstract
An integrated circuit (12) made with a CMOS P-epi process includes a bandgap circuit (16). A pair of PNP bipolar junction transistors (73, 72) have respective currents flowing through them with a ratio of 8 to 1. A differential stage has a further pair of PNP bipolar junction transistors (66, 67) which are identical, and which have their emitters coupled to each other and to a power source (11). Each transistor of the further pair has a base coupled to the emitter of a respective transistor of the first pair. The output of the differential stage controls a current source (82), which causes a current to flow through multiple resistors (86, 87, 88) and through a diode (30). One of the resistors (87) has its ends coupled to the respective bases of the transistors of the first pair.
Description




TECHNICAL FIELD OF THE INVENTION




This invention relates in general to a bandgap circuit and, more particularly, to a simple and accurate bandgap circuit suitable for implementation in an integrated circuit made by a CMOS P-epi process.




BACKGROUND OF THE INVENTION




Bandgap circuits are widely used for the purpose of generating an accurate reference voltage which does not vary with temperature. In a context where PNP and NPN bipolar transistors are readily available, there are known bandgap circuits which are relatively simple and accurate. In the context of an integrated circuit made by a CMOS P-epi process, PNP-type bipolar junction transistors can be fabricated in a manner compatible with the CMOS process and without undue additional expense. However, NPN-type bipolar junction transistors can only be fabricated in a CMOS P-epi process by carrying out extra process steps that add significantly to the complexity and cost of the overall process.




For many applications, cost is a critical factor, and the additional complexity and cost involved with fabricating NPN-type bipolar junction transistors cannot be justified. Therefore, as a practical matter, only field effect transistors and PNP-type bipolar junction transistors are available. A consequence is that bandgap circuits in an integrated circuit made by a CMOS P-epi process are more complex and less accurate than they would be if NPN-type bipolar transistors were readily available.




As to accuracy, bandgap circuits in a CMOS process typically include a pair of bipolar junction transistors or diodes, and an operational amplifier having a differential input stage made with CMOS transistors. The operational amplifier has an output stage with a gain of about ten. The diodes have different areas, and have their cathodes coupled together. Equal currents are caused to flow through the diodes. The anode of each diode is coupled to a respective one of the differential inputs of the operational amplifier.




The ratio of the areas of the diodes is selected so that a difference of the junction voltages across the two diodes, as detected by the differential stage of the operational amplifier, will be approximately 55 mV. The output stage of the operational amplifier has a gain of about ten, so that the operational amplifier outputs a voltage of about 0.55 V. This is then added to a bipolar junction voltage of about 0.7 V, to obtain a bandgap voltage of 1.25 V, which is the output of the bandgap circuit.




The circuitry which generates the voltage of 0.55 V has a temperature coefficient which is equal to but opposite to the temperature coefficient of the circuitry which generates the voltage of 0.7 V. Thus, when one of these voltages increases or decreases in response to a temperature change, the other respectively decreases or increases by an equal amount. Consequently, the sum of these voltages, which is the bandgap voltage, remains the same notwithstanding temperature variations.




Due to process variations, the voltage across each of the bipolar diodes may vary from an expected value by 1 mV, even if the diodes are made on the same chip by the same process and are laid out so as to be cross coupled with each other. In a worse-case scenario, where the variations in the two diodes are additive, the offset in the difference voltage of the differential stage will be about 2mV. When this offset is subjected to a gain of ten in the amplifier portion of the operational amplifier, it will produce an offset of 20 mV in the output of the operational amplifier, or in other words, 0.02 V. This 0.02 V offset or error in the output of the operational amplifier is relatively small in comparison to its intended 0.55 V output.




On the other hand, the CMOS transistors of the differential stage are subject to greater variations as a result of the manufacturing process, and in particular may inject at each of the differential inputs a variation or error of 10 mV, even if they are laid out so as to be cross-coupled with each other. In a worse-case scenario where these variations are additive, the offset in the output of the differential stage will be 20 mV. When subjected to the gain of ten in the amplifier portion, the result will be an offset or error of 0.2 V in the output of the operational amplifier. In comparison to the intended output of 0.55 V, this represents a potential error of approximately 36%, which is significant.




A further consideration is that, to the extent such a bandgap circuit uses PNP-type bipolar junction transistors to implement the two diodes, there is no provision to compensate for the split collector current ratio, which leads to undesirable variations of characteristics as a result of process variations. This is due to the fact that the available PNP-type bipolar junction transistors have a very strong substrate effect and weak lateral action, and the split collector current ratio between the substrate and lateral collectors varies significantly with different current densities. This characteristic has been viewed as preventing the design of an accurate bandgap circuit in a CMOS process lacking NPN bipolar junction transistors.




SUMMARY OF THE INVENTION




From the foregoing, it may be appreciate that a need has arisen for a bandgap circuit which is relatively simple in design, which produces an accurate bandgap voltage independent of temperature variations, and which is free of NPN-type bipolar junction transistors so as to facilitate its use in a CMOS process while avoiding the cost and complexity of additional process steps. According to the present invention, an apparatus is provided to address this need, and involves a CMOS-process integrated circuit which contains a bandgap circuit, the bandgap circuit including a differential portion having bipolar first and second components, having an output, and having first and second inputs that are respectively coupled to the first and second components, the bandgap circuit also including a further portion which is responsive to the output of the differential portion, and which has bipolar third and fourth components that are respectively coupled to the first and second inputs of the differential portion, the further portion being operative to generate a bandgap voltage.











BRIEF DESCRIPTION OF THE DRAWINGS




A better understanding of the present invention will be realized from the detailed description which follows, taken in conjunction with the accompanying drawings, in which:





FIG. 1

is a schematic diagram of a circuit which includes an integrated circuit with a bandgap portion that embodies the present invention and generates a bandgap voltage; and





FIG. 2

is a diagrammatic view of a portion of the integrated circuit of

FIG. 1

, showing a physical layout pattern according to the present invention for four transistors which are components of the bandgap portion of the circuit.











DETAILED DESCRIPTION OF THE INVENTION





FIG. 1

is a schematic diagram of a circuit


10


which embodies the present invention. The circuit


10


includes an integrated circuit


12


, and a DC power source


11


which is symbolically depicted as a battery. In the disclosed embodiment, the output PRPWR of the power source


11


during normal operation is 5 VDC.




The integrated circuit


12


includes a bandgap circuit


16


which receives the voltage PRPWR from the power source


11


, and which has an output terminal


18


that carries a bandgap voltage PR125. The bandgap voltage is a reference voltage, which in the disclosed embodiment is approximately 1.25 VDC. The actual bandgap voltage may vary slightly from chip to chip, due to manufacturing process variations. The important factor is not the particular bandgap voltage generated by a particular chip, but the fact that the bandgap circuit


16


on any given chip keeps the bandgap voltage substantially constant, notwithstanding variations of temperature or variations of the voltage PRPWR from the power source


11


.




In the disclosed embodiment, the bandgap voltage at terminal


18


is supplied to other not-illustrated circuitry within the integrated circuit


12


. However, it will be recognized that the bandgap voltage at the output terminal


18


could alternatively be exported off the integrated circuit


12


through an external connection pin, for use externally of the integrated circuit


12


. The other circuitry on the integrated circuit


12


might, for example, be a microcontroller suitable for use in an automotive application such as control of an engine or an anti-lock braking system.




The bandgap circuit


16


includes a startup and bias portion


21


, a base current compensation portion


23


, an amplifier portion


26


which includes a differential stage, a voltage multiplier portion


28


, and a diode


30


. Each of these parts of the bandgap circuit


16


is described below in more detail.




More specifically, the startup and bias portion


21


includes at


36


a p-channel field effect transistor (FET) having its source and bulk terminals coupled to the supply voltage PRPWR, and having its gate and drain coupled together. A further p-channel FET


37


has its source and bulk terminals coupled to the drain of the transistor


36


, and has its gate and drain terminals coupled to ground. Since the transistors


36


and


37


each have their gate and drain terminals coupled together, they each function as a diode. In the disclosed embodiment, the transistors


36


and


37


are identical, and each have a channel length of 30 microns and a channel width of 5 microns.




The startup and the bias portion


21


further includes an n-channel FET


38


which has its gate coupled to the drain of transistor


36


, and which has its bulk terminal coupled to ground. The source of the transistor


38


is coupled to one end of a resistor


42


, which has its other end coupled to ground. A capacitor


41


has its ends respectively coupled to the gate and the source of transistor


38


. Five additional p-channel FETs


45


-


49


each have their source and bulk terminals coupled to the supply voltage PRPWR, and their gates coupled to the drain of transistor


38


. The drain of transistor


45


is also coupled to the drain of transistor


38


.




The transistor


45


effectively forms a respective current mirror circuit with each of the transistors


46


,


47


,


48


and


49


. The transistors


46


-


49


each supply current to a respective portion of the bandgap circuit


16


, as described in more detail later.




The transistor


49


in

FIG. 1

is actually implemented with eight separate transistors that are coupled entirely in parallel with each other. For convenience, these eight transistors are all represented in

FIG. 1

with a single transistor symbol at


49


. The eight transistors at


49


are all identical to each other, and are all identical to the transistor


47


.




In the disclosed embodiment, the transistors


45


-


48


each have a channel length of 5 microns, and have respective channel widths of 20 microns, 10 microns, 10 microns, and 160 microns. Each of the eight actual transistors represented symbolically at 49 has a channel length of 5 microns and a channel width of 10 microns. Thus, the current through the transistors


46


and


47


will be about half the current through the transistor


45


, and the current through transistor


48


will be about eight times the current through transistor


45


. Similarly, the total current through the eight transistors at


49


will be about four times the current through the transistor


45


. Further, the total current flow through the transistor


49


will be about eight times the current through the transistor


47


, for reasons discussed in more detail later.




The base current compensation portion


23


of the bandgap circuit


16


includes at


56


a PNP bipolar junction transistor (BJT), which has its emitter coupled to the drain of transistor


46


, and which has first and second collectors that are both coupled to ground, the split collector ratio between the first and second collectors being 30 to 1. An n-channel FET


57


has its drain and gate coupled to the base of transistor


56


, and has its source and bulk terminals coupled to ground. A further n-channel FET


58


has its gate coupled to the gate of transistor


57


, and has its source and bulk terminals coupled to ground. Transistors


57


and


58


both have a channel length of 5 microns, transistor


57


has a channel width of 20 microns, and transistor


58


has a channel width of 130 microns. The transistors


57


and


58


define a current mirror circuit, in which the current carried by transistor


58


is approximately 6.5 times the current carried by transistor


57


.




The amplifier portion


26


includes two PNP BJTs


66


and


67


, which each have an emitter coupled to the drain of transistor


48


. Each has a first collector coupled to ground and a second collector coupled to the drain of a respective n-channel FET


68


or


69


, the split collector ratio between the first and second collectors being 30 to 1. The gate of transistor of


68


is coupled to the gate and drain of transistor


69


, and the source and bulk terminals of transistors


68


and


69


are all coupled to ground. Transistors


68


and


69


together define a current mirror. In the disclosed embodiment, transistors


68


and


69


are identical, and each have a channel length of 5 microns and a channel width of 20 microns. The transistors


66


-


69


serve as the differential stage of the amplifier portion


26


.




The amplifier portion


26


further includes a PNP BJT


72


having an emitter which is coupled to the drain of transistor


47


, the base of transistor


66


, and the drain of transistor


58


. The transistor


72


has first and second collectors which are both coupled to ground, the split collector ratio of the first and second collectors being 30 to 1. The base of transistor


72


is coupled to one end of a resistor


74


, the other end of which is coupled to the voltage multiplier portion


28


. The amplifier portion


26


also includes a PNP BJT


73


, having an emitter which is coupled to the drain of transistor


49


and the base of transistor


67


. The transistor


73


has first and second collectors which are both coupled to ground, the split collector ratio of the first and second collectors being 5 to 1. The base of transistor


73


is coupled to the voltage multiplier portion


28


. The transistors


72


and


73


serve as an input stage of the amplifier portion


26


. The transistors


56


,


66


-


67


and


72


-


73


all have the same area, which in the disclosed embodiment is one square micron.




The amplifier portion


26


further includes an n-channel FET


77


having its gate coupled to the drain of transistor


68


, and having its source and bulk terminals coupled to ground. The signal applied to the gate of transistor


77


is effectively the output of the differential stage that includes transistors


66


-


69


. A capacitor


78


is coupled between ground and the gate of transistor


77


, and provides AC coupling to facilitate stable circuit operation.




Two p-channel FETs


81


and


82


each have their source and bulk terminals coupled to the supply voltage PRPWR, and have their gates coupled to the drain of transistor


77


. The drain of transistor


77


is also coupled to the drain of transistor


81


. The transistors


77


,


81


and


82


each have a channel length of 1.5 microns, and have respective channel widths of 25 microns, 5 microns and 25 microns. The transistors


81


and


82


together define a current mirror circuit, and the transistor


82


serves as a current source in a manner described in more detail later. The current through transistor


82


will normally be about five times the current through transistor


81


. The transistors


77


,


81


and


82


together serve as an amplification stage or output stage of the amplifier portion


26


and, as mentioned above, the transistor


82


functions as a current source.




The voltage multiplier portion


28


includes three resistors


86


-


88


which are coupled in series between the diode


30


and the drain of transistor


82


, the output terminal


18


also being coupled to the drain of transistor


82


. The node between the resistors


86


and


87


is coupled to the end of the resistor


74


which is remote from the base of transistor


72


, and the node between the resistors


87


and


88


is coupled to the base of transistor


73


.




In the disclosed embodiment, the resistor


86


nearest the transistor


82


has a resistance of 45.4 KΩ, the middle resistor


87


has a resistance of 5 KΩ, and the resistor


88


nearest the diode


30


has a resistance of 5.7 KΩ. The combined resistance of the three resistors


86


-


88


is 56.1 KΩ, and is thus about 11.2 times the resistance of the resistor


87


, as discussed in more detail later. As a result, when a current is flowing through the three resistors, the voltage across all three resistors


86


-


88


will always be approximately 11.2 times the voltage across the resistor


87


, and this ratio will be maintained notwithstanding fluctuations in the magnitude of the current. This is why the resistors


86


-


88


are collectively referred to as a voltage multiplier portion


28


, the multiplication factor of which is 11.2.




The diode


30


includes a PNP BJT


91


having an emitter coupled to an end of resistor


88


, having a base coupled to ground, and having first and second collectors which are both coupled to ground, the split collector ratio of the first and second collectors being 30 to 1. In the disclosed embodiment, the transistor


91


has an area which is one square micron. The transistor


82


, voltage multiplier portion


28


, and diode


30


together serve as a voltage generating portion of the circuit


16


, which generates the bandgap voltage PR125 at 18.





FIG. 2

is a diagrammatic top view of a portion of the integrated circuit


12


, showing how the four bipolar junction transistors


66


-


67


and


72


-


73


have been laid out. More specifically, these four transistors have been positioned so that each is at a respective corner of an imaginary square, which is shown in broken lines at


94


. More specifically, the transistors


72


and


66


, which are associated with one side of the differential stage of the amplifier


26


, are provided at two opposite corners of the square. Similarly, the transistors


73


and


67


, which are associated with the other side of the differential stage, are provided at the other two opposite corners of the square. Viewed in a different way, a first imaginary line


96


that extends between the transistors


66


and


72


intersects a second imaginary line


97


that extends between the transistors


67


and


73


.




The bandgap circuit


16


has both n-channel and p-channel FETs, but has only PNP bipolar transistors, in particular at


56


,


72


,


66


,


67


,


73


and


91


. Consequently, the bandgap circuit


16


of

FIG. 1

is particularly suitable for use in an integrated circuit made with a CMOS process, such as a CMOS process with P-epi, where NPN transistors are not available unless extra process steps are implemented. The extra process steps effect an increase in the overall cost of the process which is significant, and the circuit


16


thus avoids this extra cost. The bandgap circuit


16


is simpler and more accurate than known bandgap circuits for a CMOS process in which NPN bipolar transistors are not available.




The operation of the bandgap circuit


16


will now be briefly described. At power on, the DC power source


11


is turned on in order to supply PRPWR (5 VDC) to the integrated circuit


12


, including the bandgap circuit


16


. As the voltage PRPWR ramps up from 0 VDC to 5 VDC, current will begin to flow through the transistors


36


and


37


which, as mentioned above, function as diodes. The circuit will start to operate when PRPWR reaches about 2 V


TH


(where V


TH


is the threshold voltage of PMOS and is about 0.75 volts). Since the transistors/diodes


36


and


37


are identical, the voltage at the node between them, or in other words at the gate of transistor


38


, will ramp up so as to be approximately half of the voltage present at PRPWR at any given point in time. Thus, when PRPWR is at 2 V


TH


the voltage at the base of transistor


38


will be 1 V


TH


and transistor


38


will start to turn on, as a result of which current will flow through the transistors


45


and


38


. When PRPWR is at about 3 Vbe, where Vbe is the voltage across a bipolar base-emitter junction, the transistors


46


-


49


will be turned on and will provide enough current to start the rest of the bandgap circuit


16


. As mentioned above, the transistor


45


effectively forms a respective current mirror circuit with each of the transistors


46


-


49


, and the transistors


46


-


49


each supply current to a respective node of the bandgap circuit


16


.




In this regard, and as mentioned above, the transistor


49


is really eight transistors which are coupled entirely in parallel and which are all identical to each other and to the single transistor at


47


. Accordingly, the transistor


49


supplies about eight times as much current to the node


111


as the transistor


47


supplies to the node


112


. In the disclosed embodiment, transistors


72


and


73


will be biased with current flows of approximately 10 μA and 80 μA, respectively. The precise current magnitudes are less important than maintaining a constant ratio between the currents. This difference in current creates an offset in the differential stage of the amplifier


26


, which is the delta Vbe between transistors


72


and


73


, and is discussed in more detail later.




Due to the current difference, the node


111


will be at a higher voltage than the node


112


, as a result of which the transistor


67


will be turned off and the transistor


66


will be turned on. This in turn turns on transistor


77


, so that a current flows through transistors


81


and


77


. Since transistors


81


and


82


form a current mirror, current will also flow through the transistor


82


, as well as the three resistors


86


-


88


of the voltage multiplier portion


28


, and the diode


30


defined by transistor


91


. The current through the resistors


86


-


88


creates a voltage across resistor


87


, which raises the voltage at the base of transistor


72


, which in turn raises the voltage at the base of transistor


66


, so that transistor


66


begins to turn off. This will then change the voltage at the gate of transistor


77


, which changes the current flowing through transistors


81


and


77


, which in turn changes the current flowing through transistor


82


, resistors


86


-


88


, and diode


30


, as the circuit converges toward an equilibrium state.




In the equilibrium state, due to the current mirror defined by transistors


68


and


69


, the transistors


66


and


67


of the differential stage will conduct the same amount of current. The current flowing through the transistor


82


, the resistors


86


-


88


and the diode


30


will be such that the voltage across resistor


87


is about 53.6 mV at room temperature (25° C., 300° K.), for reasons discussed in more detail later. The combined resistance of the three resistors


86


-


88


is 56.1 KΩ, or in other words 11.2 times the resistance of the middle resistor


87


, and thus the voltage across the three resistors


86


-


88


will be 11.2 times the voltage across the resistor


87


. In particular, when is the resistor has across it the equilibrium voltage of 53.6 mV (at room temperature), the voltage across the three resistors


86


-


88


will be approximately 0.6 V. The junction voltage Vbe of the transistor


91


in the disclosed embodiment will be about 0.65 V at room temperature. Thus, the sum of the voltages across the voltage multiplier portion


28


and the diode


30


will be 1.25 V at room temperature, such that the desired bandgap voltage of 1.25 V will be present at the output terminal


18


.




The ambient temperature may, of course, vary from room temperature. In this regard, the portions of the bandgap circuit


16


which determine the voltage across the voltage multiplier portion


28


have a temperature coefficient which will cause the voltage across voltage multiplier portion


28


to increase or decrease. For reasons explained later, this temperature coefficient is equal and opposite to the temperature coefficient of the transistor


91


that defines diode


30


.




Consequently, if a temperature change causes the junction voltage Vbe of the transistor


91


to increase by a certain amount, the voltage across voltage multiplier portion


28


will decrease by the same amount, so that the sum of these voltages is the same, and thus the bandgap voltage produced at output terminal


18


will remain at 1.25 V. Conversely, if a temperature change causes the junction voltage Vbe of transistor


91


to decrease by a certain amount, the voltage across voltage multiplier portion


28


will increase by the same amount, so that the sum of these voltages still does not change, and the bandgap voltage at output terminal


18


will remain at 1.25 V.




As mentioned above, manufacturing process variations for any given integrated circuit may cause the bandgap voltage produced at the output terminal


18


to have a value which is slightly different from the desired value of 1.25 V. However, whatever the particular bandgap voltage produced at


18


by a given bandgap circuit


16


, the bandgap circuit


16


will accurately maintain that particular bandgap voltage notwithstanding temperature variations, which is the intended purpose of the bandgap circuit


16


.




As discussed above, transistor


49


sources eight times as much current as the transistor


47


. The transistors


72


and


73


have identical base resistances. Since more current is flowing through the base resistance of transistor


73


than through the base resistance of transistor


72


, the resistor


74


is provided in series with the base of transistor


72


, in order to produce an extra voltage drop in a manner so that the combined voltage drop across the resistor


74


and the base resistance of transistor


72


is effectively equal to the voltage drop across the base resistance of the transistor


73


.




As explained above, the transistors


66


and


67


have the same amount of current flowing through them at equilibrium, and thus the base currents flowing out their bases are equal. In contrast, and as also explained above, the current flowing through transistor


73


is eight times the current flowing through transistor


72


. In order to maintain this ratio, approximately ⅞ of the current flowing out of the base of transistor


66


should theoretically be drawn off by the base current compensation circuit


23


, so that only about ⅛ of the current from the base of transistor


66


flows through the transistor


72


. However, actually drawing off precisely ⅞ of the current from the base of transistor


66


could introduce instability such as oscillation into the bandgap circuit. To avoid this, the base current compensation circuit


23


is designed to draw off about 6.⅝ of the base current flowing out of transistor


66


.




More specifically, a current flows through transistors


46


and


56


, and the base current from transistor


56


flows through transistor


57


. Transistors


57


and


58


define a current mirror, as discussed above, and thus the current flowing through transistor


57


sets up a current flow through transistor


58


. The base current compensation circuit


23


is designed so that the current flow through transistor


58


is approximately 6.⅝ of the base current out of transistor


66


when the bandgap circuit


16


is in equilibrium at room temperature.




With reference to

FIG. 2

, and given the fact that the four transistors


66


-


67


and


72


-


73


are all bipolar, the physical layout pattern for these four transistors effects cross-coupling or matching of the transistor pair


66


and


72


associated with one side of the differential stage relative to the transistor pair


67


and


73


associated with the other side of the differential stage. This minimizes the voltage offset which may exist between the two sides of the differential stage as a result of manufacturing process variations.




The voltage which will be present across the resistor


87


at equilibrium may be derived mathematically, as explained below. More specifically, pursuant to Kirchhoff's law, the voltages around a circuit loop must total zero. With this in mind, the following discussion focuses on the loop which includes the resistors


87


and


74


, and the base-emitter junctions of transistors


72


,


66


,


67


and


73


. For purposes of this analysis, the voltage drop across resistor


74


is negligible, and is ignored. Working around the loop, the sum of the voltages is






V


R


−[(Vbe


73


+Vbe


67


)−(Vbe


72


+Vbe


66


)]=0  (1)






where V


R


is the voltage across the resistor


87


, and each Vbe is a base-emitter junction voltage for a respective one of the transistors


66


,


67


,


72


and


73


. Since the transistors


72


and


73


have equal amounts of current passing through them, they will have equal base-emitter junction voltages Vbe, and these two terms in equation (1) will therefore cancel out, leaving






V


R


=Vbe


73


−Vbe


72


  (2)






It is known for a bipolar device that the base-emitter junction voltage Vbe may be expressed as:









Vbe
=


V
T



ln


(

I
Is

)







(
3
)













where V


T


is 25.8 mV at room temperature (25° C. or 300° K.), I is a collector current, and I


s


is a saturation current. Substituting Equation (3) into Equation (2) yields













V
R

=



V
T



ln


(


I
73


Is
73


)



-


V
T



ln


(


I
72


Is
72


)










=


V
T



[


ln


(


I
73


Is
73


)


-

ln


(


I
72


Is
72


)



]








=


V
T



ln


(



I
73



Is
72




I
72



Is
73



)










(
4
)













The saturation current I


s


is dependent on the area of the device. As discussed above, the transistors


66


and


67


are effectively identical and have the same area, and they thus have the same saturation current I


s


. The value of I


s


for each will vary with temperature, but the variation will be the same for each of them. Thus, the saturation currents Is


66


and Is


67


cancel each other out in Equation (4).




In addition, and as discussed above, the transistors


49


and


47


are designed so that the current flowing through the transistor


73


will be eight times the current flowing through transistor


72


. Consequently, the ratio of currents shown in Equation (4) is eight. This current ratio has been selected because Equation (4) involves the natural logarithm of this ratio, and the natural logarithm of eight appears at a point on the slope of the logarithm curve which is considered advantageous. However, the invention is not limited to this particular ratio, and other ratios could be used. In any event, given a current ratio of eight, and since V


T


is known to be 25.8 mV at room temperature, the voltage V


R


across resistor


87


at room temperature can be determined from Equation (4) as follows:






V


R


=V


T


ln(8)=25.8 mV (2.0775)=53.6 mV  (5)






As discussed above, the bandgap voltage at the output terminal


18


remains accurate notwithstanding temperature variations, due to the fact that the voltage across the voltage multiplier portion


28


and the voltage across the diode


30


have temperature coefficients which are equal and opposite. The manner in which this has been achieved may be explained mathematically as follows. First, a determination is made of the variation which the voltage across the resistor


87


will exhibit with respect to each degree of temperature change, as follows:















V
R




T


&RightBracketingBar;


300

°K


=



53.6

mV


300

°K




0.18


mV
/
°K







(
6
)













In other words, the voltage VR across the resistor


87


will vary by approximately 0.18 mV per Kelvin degree. It is known that the base-emitter junction voltage Vbe of the transistor


91


will vary by about 2 mV per Kelvin degree. Thus, in order that the sum of the voltages across the voltage multiplier portion


28


and the diode


30


will be constant, and since the rate of variation of the voltage Vbe across the diode


30


is 2 mV/° K., the voltage across the voltage multiplier portion


28


, or in other words the voltage across all three resistors


86


-


88


, must vary inversely by the same amount, or in other words by 2 mV/° K. With reference to Equation (6), this means that when the voltage across resistor


87


varies by 0.18 mV/° K., the voltage across all three resistors


86


-


88


must vary by 2 mV/° K. Consequently, the ratio of resistances must be:












R
86

+

R
87

+

R
88



R
87


=



2


mV
/
°K



0.18


mV
/
°K



=
11.2





(
7
)













For this reason, the resistors


86


-


88


have been chosen to have a combined resistance of 56.1 KΩ and the resistor


87


has been chosen to have a resistance of 5 KΩ, because 56.⅕ is 11.2.




A further refinement is that the 45.4 KΩ resistance of resistor


86


is approximately eight times the 5.7 KΩ resistance of the resistor


88


, in order to effect beta compensation by canceling out the effect of the base currents of transistor


72


and


73


.




If the transistors


66


and


67


of the differential stage were CMOS transistors rather than bipolar transistors, and even assuming they were laid out so as to be cross-coupled with each other, the maximum voltage offset introduced into the difference voltage in the differential stage could be 10 mV, which is significant in comparison to the difference voltage generated in the differential stage. However, since the transistors


66


and


67


are bipolar according to the present invention, the maximum voltage offset in the difference voltage is about one-tenth the offset associated with CMOS transistors. When all four of the transistors


66


-


67


and


72


-


73


are laid out as shown in

FIG. 2

, the cross-coupling between them further reduces the maximum voltage offset due to transistors


66


and


67


to about 1 mV, which is nominal in comparison to the magnitude of the difference voltage generated in the differential stage.




The present invention provides numerous technical advantages. One such technical advantage is the provision, in a CMOS process such as a CMOS P-epi process, of a bandgap circuit which is simpler and more accurate than known bandgap circuits for a CMOS process. A further advantage is that a differential stage within the bandgap circuit uses bipolar PNP transistors rather than CMOS transistors, which has the effect of reducing the input offset by a factor of about ten. Four transistors are cross-coupled in a manner which has the advantage of further reducing the input offset.




Yet another advantage is that the design of the bandgap circuit renders it independent of the split collector ratio of the PNP transistors. Two PNP transistors, which generate a difference between base-emitter voltages, are operated in a common collector mode, to nullify the effect of the difference in the split collector current ratio caused by different current densities.




Although one embodiment has been illustrated and described in detail, it should be understood that various changes, substitutions and alterations can be made therein without departing from the scope of the present invention. For example, the disclosed embodiment utilizes a current ratio of 8 to 1 between two transistors, and in this regard implements one of these transistors with eight separate transistors which are connected in parallel. However, a different current ratio could be used, and could be achieved by a technique other than providing several identical transistors which are coupled in parallel. As another example, a particular layout pattern is disclosed for four transistors, in order to facilitate a cross-coupling effect, but it will be recognized that there are other ways to lay out these transistors without departing from the scope of the present invention. As still another example, the bandgap circuit is disclosed in the specific context of a CMOS P-epi process, but the bandgap circuit can alternatively be implemented with discrete components or in an integrated circuit fabricated by some other process.




It should also be recognized that direct connections disclosed herein could be altered, such that two disclosed components or elements are coupled to one another through an intermediate device or devices without being directly connected, while still realizing the present invention. Other changes, substitutions, and alterations are also possible without departing from the spirit and scope of the present invention, as defined by the following claims.



Claims
  • 1. An apparatus comprising a CMOS-process integrated circuit which includes a bandgap circuit, said bandgap circuit including:a differential portion devoid of NPN-type bipolar components and having bipolar first and second components, having an output, and having first and second inputs that are respectively coupled to said first and second components, said differential portion further having bipolar third and fourth components that are respectively coupled to said first and second inputs of said differential portion, said third and fourth components being operatively coupled to said first and second components to generate a differential voltage, said differential portion further having a current source that is responsive to said output; a bias portion devoid of NPN-type bipolar components and being operative to bias the differential portion; a base current compensation portion devoid of NPN-type bipolar components and configured to sink base current flowing out of the first bipolar component when the bandgap circuit is in an equilibrium state; a voltage multiplier portion devoid of NPN-type bipolar components and operatively responsive to the differential voltage to generate a bandgap voltage; and a diode portion devoid of NPN-type bipolar components and operatively coupled to the voltage multiplier portion, wherein the current source is operative to cause a current to flow through said voltage multiplier portion and said diode portion and thereby control the bandgap voltage.
  • 2. An apparatus according to claim 1, wherein said first and second components respectively include first and second transistors which are bipolar junction transistors with substantially identical characteristics, said first and second transistors having emitters which are coupled to each other and to a power source, and having bases which respectively serve as said first and second inputs.
  • 3. An apparatus according to claim 1, wherein said first and second components include respective bipolar junction transistors which each have a collector coupled to a respective node of a mirror circuit.
  • 4. An apparatus according to claim 1, wherein said first, second, third and fourth components each include a PNP bipolar junction transistor.
  • 5. An apparatus according to claim 1, wherein said first, second, third and fourth components respectively include first, second, third and fourth transistors which are bipolar junction transistors, said third and fourth transistors having emitters which are respectively coupled to bases of said first and second transistors; and further wherein the bias portion includes a first transistor which is coupled between a source of power and said emitter of said third transistor and which has a control terminal provided with a biasing signal; and further includes a second transistor which is coupled between a source of power and said emitter of said fourth transistor and which has a control terminal coupled to the control terminal of said first transistor, said second transistor having approximately eight times as much current flowing therethrough as said first transistor.
  • 6. An apparatus comprising a CMOS-process integrated circuit which includes a bandgap circuit, said bandgap circuit including:a differential portion devoid of NPN-type bipolar devices and having an output and having first and second transistors which are bipolar junction transistors, said first and second transistors having emitters which are coupled to each other and to a source of power, said differential portion further including a current mirror circuit having two transistors which are each coupled between ground and a collector of a respective one of said first and second transistors and third and fourth transistors which are bipolar junction transistors, which each have an emitter coupled to a source of power and to a base of a respective one of said first and second transistors, and which each have a collector coupled to ground and a further portion having a resistance coupled in series with a bipolar junction device between ground and a bandgap voltage output terminal, said resistance including a plurality of resistors coupled in series with each other, one of said resistors having ends which are respectively coupled to a base of said third transistor and a base of said fourth transistor; and a current source devoid of NPN-type bipolar devices and which is responsive to said output of said differential portion and which is operative to cause a current to flow through said resistance and said bipolar junction device, said current having a magnitude which corresponds to a magnitude of a signal at said output of said differential portion.
  • 7. An apparatus according to claim 6, wherein said first, second, third and fourth transistors are laid out in said integrated circuit so that an imaginary line extending between said first and third transistors intersects an imaginary line extending between said second and fourth transistors.
  • 8. An apparatus according to claim 6,wherein said plurality of resistors includes first, second and third resistors, said first resistor having a first end coupled to said output terminal and a second end coupled to said base of said third transistor, said second resistor having a first end coupled to said second end of is said first resistor and having a second end coupled to said base of said fourth transistor, and said third resistor having a first end coupled to said second end of said second resistor and having a second end coupled to said bipolar junction device; wherein said fourth transistor has a current flowing therethrough which is approximately eight times a current flowing through said third transistor; and wherein a resistance of said first resistor is approximately nine times a resistance of said second resistor and approximately eight times a resistance of said third resistor.
  • 9. An apparatus according to claim 8, including a further resistor coupled between said base of said third transistor and said second end of said first resistor, and including a base current compensation circuit coupled to said base of said first transistor and operative to draw off approximately ⅞ of a base current flowing out of said first transistor.
  • 10. An apparatus comprising an integrated circuit which includes a bandgap circuit, said bandgap circuit including:a differential portion devoid of NPN-type bipolar devices and having an output, having bipolar first and second components, and having first and second inputs that are respectively coupled to said first and second components the differential portion further having bipolar third and fourth components that are respectively coupled to said first and second inputs of said differential portion, said third and fourth components being operative to generate a differential voltage; said first, second, third and fourth components being laid out in said integrated circuit so that an imaginary line extending between said first and third components intersects an imaginary line extending between said second and fourth components; a voltage multiplier portion devoid of NPN-type bipolar components and operatively responsive to the differential voltage to generate a bandgap voltage; a diode portion devoid of NPN-type bipolar components and operatively coupled to the voltage multiplier portion; and a current source devoid of NPN-type bipolar components and responsive to said output of said differential portion to cause a current to flow through said voltage multiplier portion and said diode portion and thereby control the bandgap voltage.
  • 11. An apparatus according to claim 10, wherein said first, second, third and fourth components are of substantially identical size.
  • 12. An apparatus according to claim 10, wherein said first, second, third and fourth components are each located approximately at a respective corner of an imaginary square.
  • 13. An apparatus according to claims 10, wherein each of said first, second, third and fourth components is a PNP bipolar junction transistor.
  • 14. An apparatus according to claim 10 further including a bias portion devoid of NPN-type bipolar components and being operative to bias the differential portion.
  • 15. An apparatus according to claim 10 further including a base current compensation portion devoid of NPN-type bipolar components and configured to sink base current flowing out of a differential portion bipolar component when the bandgap circuit is in an equilibrium state.
Parent Case Info

This application claims priority under 35 USC § 119(e)(1) of provisional application No. 60/068,087 filed Dec. 18, 1997.

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Number Name Date Kind
4317054 Caruso et al. Feb 1982
4447784 Dobkin May 1984
5087830 Cave et al. Feb 1992
5471131 King et al. Nov 1995
5619163 Koo Apr 1997
5900773 Susak May 1999
Non-Patent Literature Citations (2)
Entry
Article, E. Holle, A CMOS Bandgap Reference with Reduced Offset Sensitivity, presented at Fourteenth European Solid-State Circuits Conference Sep. 21-23, 1988, pp. 206-210.
Article, Mark Pedersen, Peter Metz, A CMOS to 100K ECL Interface Circuit, 1989 IEEE International Solid State Circuits Conference, pp. 226-227.
Provisional Applications (1)
Number Date Country
60/068087 Dec 1997 US