Acoustic Damping Pad That Reduces Deflection of a Circuit Board

Information

  • Patent Application
  • 20070165328
  • Publication Number
    20070165328
  • Date Filed
    January 18, 2007
    18 years ago
  • Date Published
    July 19, 2007
    17 years ago
Abstract
A acoustic damping pad is provided. The acoustic damping pad includes a first surface and an opposing second surface that are defined by a periphery. A first set of perforations extend between the first surface and the second surface of the acoustic damping pad. Each adjacent perforation in the first set of perforations is uniformly spaced apart from each other across a first select surface area of the first surface and across a corresponding first select surface area of the opposing second surface to form a uniform pattern.
Description

BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 illustrates a simplified schematic diagram of a data storage system.



FIG. 2 is an exploded perspective view of the data storage system illustrated schematically in FIG. 1 including an embodiment of an acoustic damping pad.



FIG. 3 is a perspective view of the acoustic damping pad of FIG. 2 secured to a base.



FIG. 4 is a perspective view of an acoustic damping pad.



FIG. 5 is a perspective view of an acoustic damping pad.


Claims
  • 1. An acoustic damping pad comprising: a first surface and an opposing second surface defined by a periphery; anda first set of perforations extending between the first surface and the second surface of the acoustic damping pad, wherein each adjacent perforation in the first set of perforations is uniformly spaced apart from each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern.
  • 2. The acoustic damping pad of claim 1, wherein the periphery of the pad corresponds with a periphery of a printed circuit board assembly secured to the acoustic dampening pad.
  • 3. The acoustic damping pad of claim 2, wherein the first set of perforations is positioned on the acoustic damping pad at a location that corresponds with a location on the printed circuit board assembly which includes deflection.
  • 4. The acoustic damping pad of claim 1, wherein each of the first set of perforations is substantially circular shaped.
  • 5. The acoustic damping pad of claim 1, wherein each of the first set of perforations have substantially similar sizes and geometric shapes.
  • 6. The acoustic damping pad of claim 1, further comprising a second set of perforations extending between the first surface and the second surface of the acoustic damping pad, wherein each adjacent perforation in the second set of perforations is uniformly spaced apart from each other across a second select surface area of the first surface and a corresponding second select surface area of the opposing second surface to form a uniform pattern.
  • 7. The acoustic damping pad of claim 6, wherein each of the second set of perforations have substantially similar sizes and geometric shapes.
  • 8. The acoustic damping pad of claim 6, wherein each of the first set of perforations include different sizes and geometric shapes than each of the second set of perforations.
  • 9. The acoustic damping pad of claim 6, wherein the first set of perforations and the second set of perforations include geometric shapes selected from one of a circle, an ellipse and a rectangle.
  • 10. A data storage system comprising: a housing including a base coupled to a top cover, wherein the housing has an external surface;a printed circuit board assembly coupled to the housing, the printed circuit board assembly including at least one area susceptible to deflection when coupled to the housing; andan acoustic dampening pad compressively positioned between the external surface of the housing and the printed circuit board assembly, the acoustic dampening pad including a first surface facing the external surface of the housing, a second surface facing the printed circuit board assembly and a plurality of perforations extending between the first surface and the second surface of the pad that are positioned on the acoustic dampening pad in a location that corresponds with the at least one area of deflection of the printed circuit board assembly.
  • 11. The data storage system of claim 10, wherein the plurality of perforations comprises a first set of perforations uniformly spaced apart from each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern.
  • 12. The data storage system of claim 11, wherein each perforation of the first set of perforations comprises similar geometric shapes and sizes.
  • 13. The data storage system of claim 10, wherein the plurality of perforations comprises: a first set of perforations uniformly spaced apart form each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern; anda second set of perforations uniformly spaced apart form each other across a second select surface area of the first surface and a corresponding second select surface area of the opposing second surface to form a uniform pattern.
  • 14. The data storage system of claim 13, wherein each perforation of the second set of perforations comprises similar geometric shapes and sizes.
  • 15. The data storage system of claim 13, wherein the wherein each of the first set of perforations include different sizes and geometric shapes than each of the second set of perforations.
  • 16. The data storage system of claim 13, wherein the first set of perforations and the second set of perforations include geometric shapes selected from one of a circle, an ellipse and a rectangle.
  • 17. An acoustic damping pad compressively positioned between an enclosure and a printed circuit board assembly of a data storage system, the acoustic dampening pad comprising: a first surface and an opposing second surface defined by a periphery; anda plurality of perforations extending between the first surface and the second surface of the pad that are positioned in a location that correspond with at least one area of deflection on the printed circuit board assembly, wherein each adjacent perforation is uniformly spaced apart from each other to form at least one uniform pattern.
  • 18. The data storage system of claim 17, wherein the plurality of perforations comprises a first set of perforations uniformly spaced apart from each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern.
  • 19. The data storage system of claim 17, wherein the plurality of perforations comprises: a first set of perforations uniformly spaced apart form each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern; anda second set of perforations uniformly spaced apart form each other across a second select surface area of the first surface and a corresponding second select surface area of the opposing second surface to form a uniform pattern.
  • 20. The data storage system of claim 19, wherein the wherein each of the first set of perforations include different sizes and geometric shapes than each of the second set of perforations.
Provisional Applications (1)
Number Date Country
60759806 Jan 2006 US