This application is a National Stage of International Application No. PCT/CN2018/122261, filed on Dec. 20, 2018, which claims priority to Chinese Patent Application No. 201811297295.8, filed on Nov. 1, 2018, both of which are hereby incorporated by reference in their entireties.
The invention belongs to the technical field of electronic products, and specifically relates to an acoustic module and an electronic product.
In recent years, consumer electronic products have developed rapidly, and the electronic devices such as smart phones and VR devices have been recognized by consumers and have been widely used. Consumer electronic products have a trend of becoming thinner and lighter, and the thicknesses of mobile phones, tablet computers, or the like are becoming thinner and thinner. In addition, consumers also set higher demands for the aesthetic appearance of the electronic products.
In order to meet the requirement of appearance design, those skilled in the art need to design components in the electronic product in a more compact manner, and also need to arrange the components related to product appearance in a predetermined appropriate position. Take an acoustic module of the electronic product as an example, the acoustic module is typically used to convert the sound signal into sound and is an important accessory for the electronic product. The housing of the electronic product is usually provided with a sound emission hole for the sound to be transmitted, and the acoustic module is usually located at a position close to the sound emission hole of the housing of the electronic product.
In an improved technical solution, a microphone is also integrated on the acoustic module. Correspondingly, the housing of the electronic product needs to be provided with a sound receiving hole for the microphone to receive sound. In this case, the microphone needs to be at a position corresponding to the sound receiving hole. However, the sound emission position and the sound receiving position of an existing integrated acoustic module cannot meet the requirements on the positions of the sound emission hole and the sound receiving hole on the housing of the electronic product. If there is no positional correspondence between the sound emission and receiving positions of the acoustic module, it will have considerable adverse impact on the acoustic performance of the acoustic module.
An object of the present invention is to provide a new technical solution for the acoustic module.
According to the first aspect of the present invention, there is provided an acoustic module comprising:
a module housing comprising an upper housing and a lower housing, wherein the upper housing of the module has a side wall and a top wall, the side wall has a through hole formed thereon, a distance between an upper edge of the through hole and the top wall is greater than or equal to one half of an overall height of the side wall, and the upper housing is configured to be capable of being fastened onto the low housing;
a fixing member: and
a microphone;
Optionally, a containing area is formed in the fixing member, the microphone is disposed in the containing area, and the sound channel is in communication with the containing area.
Optionally, the containing area has one open side, the one open side of the containing area is fastened onto the inner surface of the top wall, and a bottom surface of the microphone is in contact with the inner surface of the top wall.
Optionally, the fixing member is provided with a separation plate, the separation plate has a connecting hole formed therein, one side of the separation plate is configured to enclose and constitute the containing area, the other side of the separation plate is configured to enclose and constitute the sound channel, and through which connecting, hole the containing area and the sound channel are in communication with each other.
Optionally, a sound receiving surface of the microphone faces the connecting hole.
Optionally, a normal line of the sound receiving surface of the microphone is perpendicular to the inner surface of the top wall, an extension direction of the sound channel is parallel to the inner surface of the top wall, and the sound receiving surface of the microphone faces away from the inner surface of the top wall.
Optionally, a protective film is provided on the sound receiving surface of the microphone.
Optionally, the acoustic module further comprises a sound generating component which is disposed in the module housing, a sound emission hole is formed as a perforation in the side wall, the sound emission hole and the through hole are arranged side by side, and the sound emission hole is configured to allow sound generated by the sound generating component to be transmitted from the sound emission hole.
Optionally, the microphone is provided with a flexible circuit board connected thereto.
The present invention also provides an electronic product comprising:
the acoustic module as described above; and
a product housing in which the acoustic module is fixedly disposed;
wherein the product housing has a sound receiving opening formed thereon, the sound receiving opening and the through hole are in communication with each other and are positioned in alignment with each other.
According to an embodiment of the present disclosure, a positional correspondence may be more easily formed between the sound receiving position of the microphone and the sound receiving hole position on the electronic product.
Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the drawings.
The drawings incorporated in the specification and constituting a part of the specification show embodiments of the present invention, and together with the description thereof, serve to explain the principle of the present invention.
Various exemplary embodiments of the invention will now be described in detail with reference to the drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the invention.
The following description of at least one exemplary embodiment is actually merely illustrative, and in no way serves as any limitation on the invention and its application or use.
The technologies, methods, and devices known to those of ordinary skill in relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the specification.
In all examples shown and discussed herein, any specific values should be interpreted as exemplary only and not as limitations. Therefore, other examples of the exemplary embodiment may have different values.
It should be noted that similar reference numerals and letters indicate similar items in the following figures, so once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
The present invention provides an improved acoustic module. As shown in
As shown in
As shown in
In practical applications of the acoustic module, the lower housing is usually located at the lower side in the gravity direction, and the upper housing is located above the lower housing. That is, the inner surface of the top wall of the upper housing faces downward. By providing the acoustic module of the present invention with the fixing member, the microphone may be conveniently fixed upward at a position close to the inner surface of the top wall. Further, as the above-mentioned sound channel is formed in the fixing member, in order to ensure that the sound may pass through the sound channel smoothly, the sound channel must take up a certain volume of space, because it is necessary to have an unhindered and smooth space for air and sound waves to flow. As shown in
The approach to design the present invention enables the through hole on the acoustic module for receiving sound to be adapted to the relatively lower sound receiving hole provided on the electronic product. The through hole may be connected with the sound receiving hole on the electronic product, and the microphone may smoothly receive the sound through the through hole and the sound receiving hole with the aid of the sound channel formed by the fixing member. The acoustic module provided by the present invention may better adapt to the position of the sound receiving hole required on the electronic product, reduce the problem of the misalignment of the through hole and the sound receiving hole, or avoid the problem of poor sound receiving caused by the microphone in order to receive the sound from the sound receiving hole that has been determined.
Without using the technical solution provided by the present invention, it is difficult to arrange the microphone at a position close to the top wall of the upper housing. If the microphone is in a middle position in the height direction of the module housing, or is located a position near the bottom of the lower housing, it is difficult for the microphone to smoothly receive sound from the through hole far from the top wall of the upper housing.
Preferably, the width of the through hole itself in the height direction of the side wall is less than or equal to one third of the overall height of the side wall. If the width of the through hole is too wide, on one hand, it may adversely impact the assembly position of the microphone and reduce the assembly space that may accommodate the microphone, and on the other hand, the through hole may not match the aperture on the electronic product for the sound receiving.
Optionally, as shown in
Preferably, as shown in
Optionally, as shown in
Optionally, the microphone may be a MEMS micro microphone. The microphone usually has a micro-hole for receiving sound, and the micro-hole is usually on one side surface of the microphone device, which surface is the sound receiving surface of the microphone. Preferably, the sound receiving surface of the microphone faces the connecting hole, to facilitate reception of sound.
Optionally, as shown in
Optionally, as shown in
The acoustic module may further comprise a sound generating component which is disposed in the module housing and the fixing member and the microphone are arranged beside the sound generating component. A sound emission hole is formed as a perforation in the side wall of the upper housing. The sound emission hole is for the sound generated by the sound generating component to transmit out. Preferably, as shown in
Optionally, as shown in
The present invention also provides an electronic product, which may be a is phone or a tablet, etc., and includes product housing and the acoustic module as described above. The acoustic module is fixedly arranged in the product housing, and a sound receiving opening is formed on the product housing. The through hole on the acoustic module and the sound receiving opening are in communication with each other and are positioned in alignment with each other. The sound receiving opening may be arranged at a position of the side wall of the product housing close to the bottom. In this case, the acoustic module provided by the present invention may still provide the through hole at a position corresponding to the sound receiving opening while ensuring the smoothness of the sound receiving.
Further, a sound emission opening may also be formed on the product housing, and the sound emission opening corresponds to the sound emission hole on the acoustic module, and is used to for the sound generating component to transmit sound from the sound emission hole.
Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the examples are only for illustration rather than limiting the scope of the present invention. It should be understood by a person skilled in the art that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the attached.
Number | Date | Country | Kind |
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201811297295.8 | Nov 2018 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2018/122261 | 12/20/2018 | WO |
Publishing Document | Publishing Date | Country | Kind |
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WO2020/087700 | 5/7/2020 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4142072 | Berland | Feb 1979 | A |
5848172 | Allen | Dec 1998 | A |
6151399 | Killion | Nov 2000 | A |
7233679 | Muthuswamy | Jun 2007 | B2 |
Number | Date | Country |
---|---|---|
202261712 | May 2012 | CN |
203086648 | Jul 2013 | CN |
104821972 | Aug 2015 | CN |
108494919 | Sep 2018 | CN |
Number | Date | Country | |
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20210400392 A1 | Dec 2021 | US |