The present disclosure relates to the field of acoustics, and in particular, to an acoustic apparatus.
The acoustic output apparatus driven by piezoelectric ceramics may generate vibrations based on the inverse piezoelectric effect of piezoelectric ceramic materials so as to radiate sound waves outward. Compared with traditional electrodynamic acoustic output apparatus, the acoustic output apparatus driven by piezoelectric ceramics has higher electromechanical conversion efficiency, lower energy consumption, smaller volume, and higher integration. However, compared with the traditional electromagnetic acoustic output apparatus, the acoustic output apparatus driven by piezoelectric ceramics has poorer sound quality due to problems such as insufficient low-frequency output and many vibration modes in the audible range. Beam structures may be used in the acoustic output apparatus driven by piezoelectric ceramics to improve the low-frequency output and reduce low-frequency resonant frequencies. However, the beam structures may introduce more high-order vibration modes in the audible range, especially broadband resonance valleys in the mid-frequency band, which may weaken the mid-frequency output.
Therefore, it is desirable to provide an acoustic output apparatus, thereby suppress the high-order vibration modes in the audible range, and improving the sound quality of the acoustic output apparatus in the middle and low frequency bands.
The embodiments of the present disclosure provide an acoustic output apparatus, and the acoustic output apparatus may include a vibration assembly and a mass element. The vibration assembly may include a piezoelectric structure and a vibration element. The piezoelectric structure may be configured to convert an electrical signal into mechanical vibrations, and the vibration element may be connected to the piezoelectric structure at a first position of the piezoelectric structure and may be configured to receive the mechanical vibrations to generate an acoustic signal. The mass element may be connected to the piezoelectric structure at a second position of the piezoelectric structure.
In some embodiments, in a range of 50 Hz-5000 Hz, a vibration response curve of the piezoelectric structure at the first position may have a resonance peak and a resonance valley, and the mass element may reduce an amplitude difference between the resonance peak and the resonance valley.
In some embodiments, the piezoelectric structure may have a beam structure, and the first position and the second position may be different positions in a length direction of the beam structure.
In some embodiments, the beam structure may include a fixed end, and a difference between a vibration acceleration level of the beam structure at the first position and a vibration acceleration level of the fixed end may be larger than 20 dB.
In some embodiments, a ratio of a distance between the second position and the fixed end of the beam structure to a length of the beam structure may be larger than ⅓.
In some embodiments, a ratio of an elastic coefficient between the mass element and the piezoelectric structure to a mass of the mass element may be in a range of (100π)2-(10000π)2.
In some embodiments, a mass of the mass element may be centrally distributed at the second position.
In some embodiments, a mass of the mass element may be uniformly distributed around the second position.
In some embodiments, a mass of the mass element may be in a range of 0.1 g-6 g.
In some embodiments, an elastic coefficient between the mass element and the piezoelectric structure may be in a range of 9 N/m-6×106 N/m.
In some embodiments, the mass element may further be connected to a housing of the acoustic output apparatus.
In some embodiments, a ratio of an elastic coefficient between the mass element and the housing to an elastic coefficient between the mass element and the piezoelectric structure may be less than 10.
In some embodiments, an elastic coefficient between the mass element and the piezoelectric structure may be less than an elastic coefficient between the mass element and the housing.
In some embodiments, the mass of the vibration element may be in a range of 0.1 g-0.9 g, and a ratio of the mass of the mass element to the mass of the vibration assembly may be less than 5.
In some embodiments, the mass of the vibration element may be in a range of 0.9 g-1.8 g, and a ratio of the mass of the mass element to the mass of the vibration assembly may be less than 2.
In some embodiments, the mass of the vibration element may be in a range of 1.8-5 g, and a ratio of the mass of the mass element to the mass of the vibration may be less than 1.
In some embodiments, the mass element may be elastically connected to the piezoelectric structure through an elastic member.
In some embodiments, at least a portion of the mass element may have an elastic structure, and the mass element may be elastically connected to the piezoelectric structure through the elastic structure.
In some embodiments, the elastic structure may include a pore structure.
In some embodiments, a damping material may be disposed in the pore structure.
In some embodiments, the acoustic output apparatus may include a piezoelectric ceramic driven acoustic output apparatus.
Wherein, 100, acoustic output apparatus; 110, vibration assembly; 120, mass element; 211, piezoelectric structure; 212, vibration element; 2111, piezoelectric material layer; 2112, substrate; 2113, fixed end; 2114, free end; 411a, beam structure; 430, resonance peak; 440, resonance valley; 420, mass element; 450, resonance peak; 511a, beam structure; 512a, vibration element; 530, resonance valley; 540, resonance valley; 520, mass element; 621a, elastic structure; 621b, elastic structure; 6211b, high-quality material; 621c, elastic structure; 6211c, high-quality material; 720, resonance valley; 710, resonance peak; 821, elastic structure; 811, beam structure; 822, mass portion; 921, elastic structure; 911, beam structure; 922, mass portion; 1021, elastic structure; 1023, pore structure; 1122, mass portion; 1121, elastic member; 1220, resonance valley; 1210, resonance peak; 1310, resonance valley; 1320, resonance peak; 1410, resonance peak; 1511, piezoelectric structure; 1520, mass element; 1512, vibration element; 1610, second-order valley; 1620, third-order valley; 1720, mass element; 1711, Piezoelectric structure; 1810, resonance peak; 1820, resonance valley; 1910, resonance peak; 2010, resonance peak; 2110, resonance peak.
In order to illustrate the technical solutions of the embodiments of the present disclosure more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some examples or embodiments of the present disclosure. For those of ordinary skill in the art, without creative work, the present disclosure can be applied to other similar scenarios according to these drawings. Unless it is obvious from the language environment or otherwise stated, the same reference numbers in the drawings represent the same structure or operation.
It should be understood that the terms “system”, “apparatus”, “unit”, “component”, “module” and/or “block” may be a method that is used herein to distinguish different components, elements, parts, sections, or assemblies at different levels. However, the terms may be replaced by other expressions if they serve the same purpose.
As used in the present disclosure and the appended claims, the singular forms “a,” “an,” and “the” include plural referents unless the content clearly dictates otherwise. In general, the terms “comprise,” “comprises,” and/or “comprising,” “include,” “includes,” and/or “including,” merely prompt to include steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive listing. The methods or devices may also include other steps or elements.
Flowcharts are used in the present disclosure to illustrate operations performed by a system according to an embodiment of the present disclosure. It should be understood that the preceding or following operations are not necessarily performed in the exact order. Instead, the various operations may be processed in reverse order or simultaneously. Further, other actions may be added to these procedures, or an operation or operations may be removed from these procedures.
The embodiments of the present disclosure provide an acoustic output apparatus. The acoustic output apparatus may include a vibration assembly and a mass element. In some embodiments, the vibration assembly may include a piezoelectric structure (e.g., a beam structure) and a vibration element (e.g., a diaphragm, a vibration plate, etc.) for converting an electrical signal into mechanical vibrations. The vibration element may be mechanically connected to the piezoelectric structure at a first position of the piezoelectric structure and is configured to receive the mechanical vibrations to generate an acoustic signal. In some embodiments, the mass element may be connected (e.g., elastically connected) to the piezoelectric structure at the second position of the piezoelectric structure. The first position and the second position may be different positions in a length direction of the piezoelectric structure (e.g., the beam structure). The mass element elastically connected to the piezoelectric structure may reduce the amplitude difference between a resonance peak and a resonance valley of the vibration response of the piezoelectric structure at the first position in a target frequency range (e.g., 50 Hz-5000 Hz), thereby increasing the sound quality of the sound signal. At the same time, the elastic connection may produce a damping effect on the piezoelectric structure, so that a vibration response curve of the acoustic output apparatus in the target frequency range is relatively smooth, thereby further improving the sound quality of the sound signal generated by the acoustic output apparatus.
In some embodiments, the acoustic output apparatus 100 may include a dynamic acoustic output apparatus, an electrostatic acoustic output apparatus, a piezoelectric acoustic output apparatus, a balanced armature acoustic output apparatus, a pneumatic acoustic output apparatus, an electromagnetic acoustic output apparatus, or the like, or any combination thereof. In some embodiments, the acoustic output apparatus 100 may include a piezoelectric ceramic acoustic output apparatus. In some embodiments, the acoustic output apparatus 100 may be implemented as a pair of glasses, a smart bracelet, a headphone, a hearing aid, a smart helmet, a smart watch, a smart clothing, a smart backpack, a smart accessory, or the like, or any combination thereof. For example, the acoustic output apparatus 100 may be a pair of functional myopia glasses, a pair of reading glasses, a pair of cycling glasses or a pair of sunglasses, etc., and may also be a pair of intelligent glasses (e.g., a pair of audio glasses with earphone function). As another example, the acoustic output apparatus 100 may also be a head-mounted apparatus such as a helmet, an Augmented Reality (AR) apparatus, a Virtual Reality (VR) apparatus, etc. In some embodiments, the augmented reality apparatus or virtual reality apparatus may include a virtual reality headset, a pair of virtual reality glass, an augmented reality helmet, a pair of augmented reality glasses, or the like, or any combination thereof, for example, the virtual reality apparatus and/or the augmented reality apparatus may include a Google Glass, an Oculus Rift, a Hololen, a Gear VR, etc.
The vibration assembly 110 may be configured to convert a signal containing sound information into a sound signal. In some embodiments, the signal containing acoustic information may include an electrical signal, an optical signal, or the like. In some embodiments, the sound signal may include bone conduction sound waves or air conduction sound waves, which may be delivered to the human ear by means of bone conduction or air conduction. For example, the vibration assembly 110 may receive an electrical signal, generate mechanical vibrations, and output sound waves. In some embodiments, the vibration assembly 110 may include a conversion structure for converting a signal containing acoustic information into mechanical vibrations. Exemplary conversion structure may include a dynamic structure, an electrostatic structure, a piezoelectric structure, a balanced armature structure, a pneumatic structure, an electromagnetic structure, or the like, or any combination thereof. In some embodiments, the vibration assembly 110 may include a vibration element (e.g., a diaphragm, a vibration plate) for converting mechanical vibrations into a sound signal. For example, the vibration assembly 110 may include a piezoelectric structure and a vibration element connected to the piezoelectric structure at a first position of the piezoelectric structure. The piezoelectric structure may be configured to convert a signal containing acoustic information into mechanical vibrations, and the vibration element may be configured to receive the mechanical vibrations to generate an acoustic signal. More descriptions of the vibration assembly may be found elsewhere in the present disclosure, see, e.g.,
The mass element 120 may be configured to provide mass to the mechanical vibrations of the vibration assembly 110, thereby changing an amplitude difference between a resonance peak and a resonance valley of the mechanical vibrations generated by the vibration assembly 110. Taking a piezoelectric structure as an example, the mass element 120 may be connected to the piezoelectric structure at a second position of the piezoelectric structure. In some embodiments, the piezoelectric structure may have a beam structure (e.g., a cantilever beam). The first position and the second position may be different positions in a length direction of the beam structure. In some embodiments, the beam structure may include a fixed end. The fixed end may refer to a position on the beam structure where a vibration acceleration or acceleration level is less than a vibration acceleration threshold. For example, the vibration acceleration level of the fixed end may be less than 5 dB, 3 dB, 1 dB, 0.8 dB, 0.6 dB, 0.4 dB, 0.2 dB, 0.05 dB, or the like. In some embodiments, a difference between a vibration acceleration level of the beam structure at the first position and a vibration acceleration level of the fixed end may be larger than 5 dB, 10 dB, 20 dB, 30 dB, 40 dB, or 50 dB, etc. In some embodiments, the vibration response of the piezoelectric structure at the first position may have a resonance peak and a resonance valley in a target frequency range. The mass element 120 may reduce the amplitude difference between the resonance peak and the resonance valley. For example, the target frequency range may include 50 Hz-5000 Hz, 100 Hz-5000 Hz, 200 Hz-4000 Hz, 500 Hz-4000 Hz, 500 Hz-3000 Hz, 500 Hz-2000 Hz, 1000 Hz-2000 Hz, etc.
In some embodiments, the second position may be configured such that in a target frequency range, the mass element 120 may reduce the magnitude difference between the resonance peak and the resonance valley. For example, a ratio of a distance between the second position and the fixed end to a length of the beam structure may be larger than ⅓, ⅖, ⅔, etc. In some embodiments, the mass of the mass element 120 may be configured such that in a target frequency range, the mass element 120 may reduce the amplitude difference between the resonance peak and the resonance valley. In some embodiments, the mass of the mass element 120 may be distributed centrally at the second position or distributed uniformly around the second position. In some embodiments, the mass of mass element 120 may be in a target mass range. For example, the target mass range may include 0.01 g-50 g, 0.0.2 g-40 g, 0.03 g-30 g, 0.04 g-20 g, 0.05 g-10 g, 0.07 g-8 g, 0.09 g-6 g, 0.1 g-6 g, 0.2 g-6 g, 0.5 g-6 g, 1 g-5 g, etc. In some embodiments, the mass of the mass element 120 may be related to the mass of the vibration assembly 110. The mass of the vibration assembly 110 may refer to the total mass of the piezoelectric structure and the vibration element. For example, when the mass of the vibration element is constant, a ratio of the mass of the mass element 120 to the mass of the vibration assembly 110 may be in a preset ratio range. For example, the mass of the vibration element may be in a range of 0.1 g-0.9 g, and the ratio of the mass of the mass element 120 to the mass of the vibration assembly 110 may be less than 5. As another example, the mass of the vibration element may be in a range of 0.9 g-1.8 g, and the ratio of the mass of the mass element 120 to the mass of the vibration assembly 110 may be less than 2. As another example, the mass of the vibration element may be in a range of 1.8 g-5 g, and the ratio of the mass of the mass element 120 to the mass of the vibration assembly 110 may be less than 1.
In some embodiments, the connection between the mass element 120 and the piezoelectric structure may include an elastic connection. For example, the acoustic output apparatus 100 or the mass element 120 may include an elastic member (not shown) through which the mass element 120 may be elastically connected to the piezoelectric structure at the second position of the piezoelectric structure. As another example, at least a portion of the mass element 120 may have an elastic structure, and the mass element 120 may be elastically connected to the piezoelectric structure at the second position of the piezoelectric structure through the elastic structure. In some embodiments, a first elastic coefficient between the mass element 120 and the piezoelectric structure may be configured such that in the target frequency range, the mass element 120 may reduce the amplitude difference between the resonance peak and the resonance valley. For example, the first elastic coefficient between the mass element 120 and the piezoelectric structure may be in a range of 9 N/m-6×106 N/m, 50 N/m-6×106 N/m, 100 N/m-6×106 N/m, 1000 N/m-6×106 N/m, 104 N/m-6×106 N/m, 5×104 N/m-6×106 N/m, 5×105 N/m-6×106 N/m, 9'105 N/m-6×106 N/m, 106 N/m-6×106 N/m, etc.
In some embodiments, the mass element 120 may be connected to a housing of the acoustic output apparatus 100. The connection may include an elastic connection. For example, the acoustic output apparatus 100 or the mass element 120 may include an elastic member (not shown) through which the mass element 120 may be elastically connected to the housing of the acoustic output apparatus 100. As another example, at least a portion of the mass element 120 may have an elastic structure, and the mass element 120 may be elastically connected to the housing of the acoustic output apparatus 100 through the elastic structure. The elastic connection between the mass element 120 and the housing may have a second elastic coefficient. In some embodiments, the first elastic coefficient may be less than the second elastic coefficient. In some embodiments, a ratio of the second elastic coefficient to the first elastic coefficient may be less than a preset threshold. For example, the ratio of the second elastic coefficient to the first elastic coefficient may be less than 10.
In some embodiments, the mass element 120 may have any shape, such as a cylinder, a cuboid, a cone, a truncated cone, a sphere and other regular structures or irregular structures. In some embodiments, the material of the mass element 120 may include, but is not limited to, any rigid material such as a plastic, a wood, and a metal. In some embodiments, the material of the mass element 120 may further include various metamaterials that is beneficial to expand the audio frequency bandwidth of the acoustic output apparatus 100, such as a negative stiffness material, a cubic stiffness material, etc. In some embodiments, the mass element 120 may also be configured to provide damping to the mechanical vibrations of the vibration assembly 110. The damping may be configured to smooth response curves of the acoustic output apparatus 100 in the low frequency band. For example, the mass element 120 itself may provide damping to the vibration assembly 110. As another example, the mass element 120 may include a damping portion that may provide damping to the vibration assembly 110. In some embodiments, the mass element 120 may provide damping to the mechanical vibrations of the vibration assembly 110 by elastically connecting to the vibration assembly 110. More descriptions of the mass element 120 may be found elsewhere in the present disclosure, see, e.g.,
It should be understood that the descriptions of the acoustic output apparatus 100 shown in
The piezoelectric structure 211 may be configured to convert an electrical signal into mechanical vibrations. In some embodiments, the piezoelectric structure may include a piezoelectric material. Exemplary piezoelectric materials may include a piezoelectric crystal, a piezoelectric ceramic, a piezoelectric polymer, or the like. As shown in
The beam structure may include a fixed end 2113 and a free end 2114. The fixed end may refer to a position on the beam structure where a vibration acceleration or acceleration level is less than a vibration acceleration threshold. For example, the vibration acceleration level of the fixed end 2113 may be less than 5 dB, 3 dB, 1 dB, 0.8 dB, 0.6 dB, 0.4 dB, 0.2 dB, or 0.05 dB, etc. In some embodiments, the fixed end 2113 may be connected to a fixed position or structure of the acoustic output apparatus. The fixed position or structure may refer to a position or a structure on the acoustic output apparatus where the vibration acceleration or acceleration level is less than the vibration acceleration threshold. For example, the acoustic output apparatus may include a housing (not shown in
The vibration element 212 may be configured to receive mechanical vibrations and convert the mechanical vibrations into a sound signal to output. In some embodiments, the vibration element 212 may be connected to the piezoelectric structure 211 (or beam structure) at a first position of the piezoelectric structure 211 (or beam structure) to receive mechanical vibrations generated by the piezoelectric structure 211. In some embodiments, the first position may be a position on the beam structure where the amplitude of mechanical vibration is relatively large. A difference between the vibration acceleration level of the beam structure at the first position and the vibration acceleration level of the fixed end 2113 may be larger than a difference threshold. For example, the difference between the vibration acceleration level of the first position and the vibration acceleration level of the fixed end 2113 may be larger than 5 dB, 10 dB, 20 dB, 30 dB, 40 dB, 50 dB, etc. For example, the first position to which the vibration element 212 may be connected may be the free end 2114. In some embodiments, when the acoustic output apparatus is an air conduction acoustic output apparatus, the vibration element 212 may be a diaphragm. The diaphragm may receive the mechanical vibrations generated by the piezoelectric structure 211 and further push the air to vibrate to generate a sound signal. In some embodiments, when the acoustic output apparatus is a bone conduction acoustic output apparatus, the vibration element 212 may be a vibration plate, and the vibration plate may be in contact with the human body to transmit vibrations, thereby generating a sound signal.
A mass element (not shown in
The principle that the mass element changes the vibration mode of the piezoelectric structure may be exemplarily described below with reference to
As shown in
wherein, m1 represents the mass of the beam structure at the second position (i.e., the antinode region), k1 represents an equivalent elastic coefficient at the second position, ξ represents a vibration displacement at the second position, F represents an exciting force, ω represents an angular frequency of the exciting force, and F cos ωt represents a component force of the exciting force along a vibration direction of the second position. A special solution of equation (1) may be:
wherein, ω0 (ω0=√{square root over (k1/m1)}) represents a natural angular frequency at the second position. Disregarding the damping, when the angular frequency co of the exciting force is equal to the natural angular frequency ω0 of the second position, resonance may occur at the second position, and the amplitude (displacement ξ) may be infinite. In view of the effect of the damping, the amplitude peaks at the second position, that is, the second position (or the antinode region) may be a position with the largest displacement on the beam structure in the direction perpendicular to the length direction.
In some embodiments, the mass element may be elastically connected to the piezoelectric structure. For example, the mass element may be elastically connected to the piezoelectric structure through an elastic element (e.g., an elastic element disposed independently of the mass element). As another example, the mass element may be elastically connected to the piezoelectric structure through an elastic structure thereof (e.g., an elastic structure integrated with the mass element). In some embodiments, the mass element may be elastically connected to the beam structure at the second position. The vibrations of the beam structure at the second position when the mass element is connected to the beam structure may be equivalent to forced vibrations of a two-degree-of-freedom system as shown in
wherein, ξ2 represents a vibration displacement of the mass element, and the meanings of other symbols may be found in equation (1) and related descriptions thereof (wherein μ1 is the same as ξ). A special solution of equation (3) may be:
wherein, ωr (ωr2=k2/m2) represents a natural angular frequency of the mass element, and α=m2/m1 is a mass ratio of the mass element to the second position. Accordingly, the natural angular frequency ωr of the mass element may be adjusted to be equal to the angular frequency co of the exciting force, so that the vibration displacement μ1 of the second position may be zero. In such cases, a vibration equation of the mass element may be:
Equation (5) may be written as:
k
2·ξ2|ωr=ω+F cos ωt=0. (6)
According to equation (6), a resultant force of the elastic coefficient k2 of the mass element and the exciting force F cos ωt at the second position of the beam structure is zero. Disregarding the damping, the vibrations of the antinode may be transferred to the mass element by adding a mass element at the second position of the beam structure, which may reduce the large vibrations of the beam structure at the second position. In view of the effect of the damping, the vibration mode of the beam structure at the second position may be significantly suppressed or destroyed by adding a mass element at the second position of the beam structure. In such cases, the mechanical vibrations generated by the beam structure may be transmitted to the first position, so that the vibration amplitude of the first position may be increased, and the vibration mode may be smoother, thereby improving the sound quality output by the acoustic output apparatus effectively.
In some embodiments, the natural angular frequency ωr of the mass element may be written as ωr2=k2/m2. Thus, the elastic coefficient between the mass element and the piezoelectric structure and/or the mass of the mass element may be configured to set the natural angular frequency ωr of the mass element, so that the mass element may reduce the amplitude difference between the resonance peak and the resonance valley at the first position at the target frequency. For example, the elastic coefficient and/or the mass of the mass element may be configured such that the natural angular frequency ωr of the mass element is the same as or similar to a preset target frequency, thereby reducing the amplitude difference between the resonance peak and the resonance valley at the first position at the target frequency. Merely by way of example, the target frequency range may be in a range of 50 Hz-5000 Hz. Correspondingly, the elastic coefficient and/or the mass of the mass element may be configured so that a ratio of the elastic coefficient between the mass element and the piezoelectric structure to the mass of the mass element is in the range of (100π)2-(10000π)2. In some embodiments, the mass of the mass element may be in a target mass range. For example, the target mass range may include 0.01 g-50 g, 0.0.2 g-40 g, 0.03 g-30 g, 0.04 g-20 g, 0.05 g-10 g, 0.07 g-8 g, 0.09 g-6 g, 0.1 g-6 g, 0.2 g-6 g, 0.5 g-6 g, 1 g-5 g, etc. Correspondingly, to reduce the amplitude difference between the resonance peak and the resonance valley in the target frequency range, the elastic coefficient between the mass element and the piezoelectric structure may be in a range of 9 N/m-6×106 N/m.
It should be noted that the above descriptions about the vibration assembly and the mass element are only for examples and illustration, and do not limit the scope of application of the present disclosure. For those of ordinary skill in the art, various variations and modifications to the vibration assembly and the mass element may be made under the guidance of the present disclosure. However, these variations and modifications are still within the scope of the present disclosure. For example, the fixed end 2113 shown in
The influence of the mass element on the vibration state of the beam structure may be described below in connection with
The beam structure 411a shown in
The output of the vibrations of the acoustic output apparatus in the middle frequency band may be enhanced by increasing the vibration amplitude at the first position. As shown in
The vibration assembly shown in
In order to improve the second-order valley and the third-order valley, as shown in
In some embodiments, the mass element may include a mass portion having mass and an elastic portion having elasticity. The mass element may be elastically connected to the piezoelectric structure through the elastic portion. In some embodiments, the mass element may further include a damping portion for increasing the vibration damping of the piezoelectric structure, and the damping portion may be configured to smooth a transition of the vibration response curve. In some embodiments, the mass portion may include metallic, non-metallic materials, or the like. The density of the material may be in a preset density range. The preset density range may include 0.01-100 g/cm3, 0.05-80 g/cm3, 0.1-60 g/cm3, 0.2-50 g/cm3, 0.3-40 g/cm3, 0.4-30 g/cm3, 0.5-20 g/cm3, etc. In some embodiments, the damping portion may be implemented as a damping material such as rubber, or the like.
In some embodiments, the elastic portion may be mixed with the mass portion. Alternatively, the elastic portion may be a portion of the mass element. For example, at least a portion of the mass element may be an elastic structure. The mass element may be elastically connected to the piezoelectric structure through the elastic structure. Exemplary elastic structures may include a spring structure. In some embodiments, the elastic structure may be made of an elastic material. Exemplary elastic materials may include a rubber, a latex, a silicone, a sponge, or the like, or any combination thereof. In some embodiments, the elastic structure may be used as both the elastic portion and the mass portion. For example, the elastic structure may include a metal rubber of higher mass and/or density. As another example, a higher quality material may be incorporated into the elastic structure, such as a metallic powder incorporated into a sponge. In some embodiments, the elastic structure may include a damping part. For example, an elastic structure may be made of a damping material (e.g., nitrile). As another example, the damping material may be added to the elastic structure, such as damping paint coated on the surface of the elastic structure or penetrated into an interior of the elastic structure.
For example,
As shown in
As shown in
As shown in
In some embodiments, the elastic portion may be separated from the mass portion. For example, the elastic portion may include an elastic member through which the mass element may be elastically connected to the piezoelectric structure. Exemplary elastic members may include a foam, a silicone, spring, a compression spring, or the like, or any combination thereof. In some embodiments, the mass portion may be implemented as a metallic, a non-metallic material, or the like. The density of the material may be in a preset density range. The preset density range may include 0.01 g/cm3-100 g/cm3, 0.05 g/cm3-80 g/cm3, 0.1 g/cm3-60 g/cm3, 0.2 g/cm3-50 g/cm3, 0.3 g/cm3-40 g/cm3, 0.4 g/cm3-30 g/cm3, 0.5 g/cm3-20 g/cm3, etc. In some embodiments, the mass portion may be implemented as a metal (e.g., an iron, a copper, or a metal alloy, etc.) block, an encapsulating liquid, etc., or a device such as a battery, a circuit board, etc. of the acoustic output apparatus. In some embodiments, the mass portion may be connected to the elastic member. Exemplary connections may include a bolt connection, a riveting, an interference fit, a snap connection, a bonding, an injection molding, a welding, a magnetic attraction, or the like, or any combination thereof. In some embodiments, both the mass portion and the elastic member may have any shape, such as a regular structure such as a cylinder, a cuboid, a cone, a truncated cone, and a sphere, or an irregular structure.
It should be understood that the examples provided in
In some embodiments, the mass of the mass element may be centrally distributed at the second position of the piezoelectric structure. The mass element being centrally distributed may refer to that the mass of the mass element is concentrated in a region where the second position is located (e.g., a region with the second position as a geometric center). In some embodiments, a size (e.g., an area, a side length, a diameter, etc.) of the region may be less than a preset value. For example, the region may be a square region and a side length of the square region may be less than 25 mm, 20 mm, 18 mm, 16 mm, 12 mm, or the like. As another example, the region may be a circular region, and a diameter of the circular region may be less than 25 mm, 20 mm, 18 mm, 16 mm, 12 mm, or the like.
In some embodiments, the mass of the mass element may be uniformly distributed around the second position. The mass element being uniformly distributed may refer to that the mass is uniformly distributed in a region around the second position. In some embodiments, an area of the region may be in a preset area range. For example, the preset area range may include 0.1*0.1 mm2-50*50 mm2, 0.5*0.5 mm2-40*40 mm2, 0.5*1 mm2-35*35 mm2, 1*1 mm2-30*30 mm2, 1*2 mm2-30*20 mm2, 2*2 mm2-30*15 mm2, 3*3 mm2-30*10 mm2, etc.
In some embodiments, the mass element may be connected to other assemblies of the acoustic output apparatus (e.g., a battery, a housing, etc.) to achieve fixation of the mass element. In some embodiments, the fixation of the mass element may prevent the vibration mode of the vibrating assembly from being affected by the vibrations of the mass element. In some embodiments, the connection between the mass element and the acoustic output apparatus may be an elastic connection. The elastic connection may reduce vibrations of the acoustic output apparatus affecting the vibrations of the vibration assembly through the mass element, and reduce the connection between the mass element and the acoustic output apparatus from affecting the vibrations of the mass element. In some embodiments, the mass element may be elastically connected to the housing of the acoustic output apparatus. In some embodiments, the elastic connection between the mass element and the housing may be similar to the elastic connection between the mass element and the piezoelectric structure, which may not be repeated here.
In some embodiments, the adjustment of the mass element to the vibration mode of the piezoelectric structure at the first position may be realized by adjusting the elasticity between the mass element and the piezoelectric structure and the elasticity between the mass element and the housing. In some embodiments, an elastic coefficient between the mass element and the piezoelectric structure (i.e., a first elastic coefficient) may be less than an elastic coefficient between the mass element and the housing (i.e., a second elastic coefficient), so that the amplitude difference between the resonance peak and the resonance valley of the vibrations at the first position in the target frequency range may be reduced, and the vibration response curve of the first position may be smoother.
In some embodiments, a mass ratio mr of the mass element to the vibration assembly may be adjusted such that the mass element may reduce the amplitude difference between the resonance peak and the resonance valley of the vibration response curve at the first position in the target frequency range. In some embodiments, the mass ratio mr of the mass element to the vibration assembly may also be adjusted such that the vibration response curve in frequency bands outside the target frequency range (e.g., a region after the resonance peak corresponding to the mass element) may be smooth, thereby improving the sound quality of the corresponding frequency bands. The mass of the vibration assembly may refer to the total mass of the piezoelectric structure and the vibration element.
It should be noted that different embodiments may have different beneficial effects. In different embodiments, the possible beneficial effects may be any one or a combination of the beneficial effects described above, or any other beneficial effects. For example, the sound quality of the acoustic output device may be optimally optimized by simultaneously adjusting the mass ratio mr of the mass element to the vibration assembly and the distribution manner of the mass of the mass element at the second position.
Having thus described the basic concepts, it may be rather apparent to those skilled in the art after reading this detailed disclosure that the foregoing detailed disclosure is intended to be presented by way of example only and is not limiting. Various alterations, improvements, and modifications may occur and are intended to those skilled in the art, though not expressly stated herein. These alterations, improvements, and modifications are intended to be suggested by this disclosure and are within the spirit and scope of the exemplary embodiments of this disclosure.
Moreover, certain terminology has been used to describe embodiments of the present disclosure. For example, the terms “one embodiment,” “an embodiment,” and/or “some embodiments” mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Therefore, it is emphasized and should be appreciated that two or more references to “an embodiment,” “one embodiment,” or “an alternative embodiment” in various portions of this disclosure are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined as suitable in one or more embodiments of the present disclosure.
In addition, unless explicitly stated in the claims, the order in which the present disclosure deals with elements and sequences, the use of numbers and letters, or the use of other names, is not intended to limit the order of the procedures and methods of the present disclosure. While the foregoing disclosure discusses by way of various examples some embodiments of the invention presently believed to be useful, it is to be understood that such details are for purposes of illustration only and that the appended claims are not limited to the disclosed embodiments, but rather the claims are intended to cover all modifications and equivalent combinations that come within the spirit and scope of the embodiments of the present disclosure For example, although the system components described above may be implemented by hardware devices, they may also be implemented by software-only solutions, such as installing the described systems on existing servers or mobile devices.
Similarly, it should be noted that, in order to simplify the expression disclosed in the present disclosure, thereby helping the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of the present disclosure, various features are sometimes merged into one embodiment, drawing or description thereof. However, this method of disclosure does not imply that the subject matter of the application requires more features than those mentioned in the claims. Indeed, there are fewer features of an embodiment than all of the features of a single embodiment disclosed above.
In some embodiments, the numbers expressing quantities or properties used to describe and claim certain embodiments of the application are to be understood as being modified in some instances by the term “about,” “approximate,” or “substantially.” For example, “about,” “approximate,” or “substantially” may indicate ±20% variation of the value it describes, unless otherwise stated. Accordingly, in some embodiments, the numerical parameters set forth in the written description and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by a particular embodiment. In some embodiments, the numerical parameters should be construed in light of the count of reported significant digits and by applying ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of some embodiments of the application are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable
Each of the patents, patent applications, publications of patent applications, and other material, such as articles, books, specifications, publications, documents, things, and/or the like, referenced herein is hereby incorporated herein by this reference in its entirety for all purposes, excepting any prosecution file history associated with same, any of same that is inconsistent with or in conflict with the present document, or any of same that may have a limiting affect as to the broadest scope of the claims now or later associated with the present document. By way of example, should there be any inconsistency or conflict between the descriptions, definition, and/or the use of a term associated with any of the incorporated material and that associated with the present document, the description, definition, and/or the use of the term in the present document shall prevail.
In closing, it is to be understood that the embodiments of the application disclosed herein are illustrative of the principles of the embodiments of the application. Other modifications that may be employed may be within the scope of the application. Thus, by way of example, but not of limitation, alternative configurations of the embodiments of the application may be utilized in accordance with the teachings herein. Accordingly, embodiments of the present application are not limited to that precisely as shown and described.
This application is a continuation of International Application No. PCT/CN2022/081409, filed on Mar. 17, 2022, the contents of which are hereby incorporated by reference in its entirety.
Number | Date | Country | |
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Parent | PCT/CN2022/081409 | Mar 2022 | US |
Child | 18064282 | US |