The present disclosure relates to acoustic wave devices.
Japanese Unexamined Patent Application Publication No. 2012-257019 discloses an acoustic wave device.
In the acoustic wave device disclosed in Japanese Unexamined Patent Application Publication No. 2012-257019, the coupling coefficient is determined by a ratio of the thickness of a piezoelectric layer to a pitch between electrode fingers. To manufacture an acoustic wave device having a high coupling coefficient, it is necessary to increase the pitch between the electrode fingers. This may enlarge the size of the acoustic wave device.
Example embodiments of the present invention reduce the size of acoustic wave devices.
An acoustic wave device according to an example embodiment of the present invention includes first and second piezoelectric layers and an interdigital transducer (IDT) electrode. The second piezoelectric layer is located above the first piezoelectric layer in a first direction. The IDT electrode includes first and second busbar electrodes and first and second electrode fingers. The first busbar electrode and the second busbar electrode oppose each other. The first electrode finger is provided to the first busbar electrode and extends toward the second busbar electrode. The second electrode finger is provided to the second busbar electrode and extends toward the first busbar electrode. The first and second electrode fingers are sandwiched between the first piezoelectric layer and the second piezoelectric layer in the first direction. The first and second electrode fingers extend in a second direction which intersects with the first direction and are located to overlap each other as seen in a third direction which is perpendicular or substantially perpendicular to the second direction.
According to example embodiments of the present invention, it is possible to reduce the size of acoustic wave devices.
The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the example embodiments with reference to the attached drawings.
Example embodiments of the present invention will be described below in detail with reference to the drawings. However, the example embodiments are not provided to restrict the present invention. The individual example embodiments described in the disclosure are only examples and the configurations discussed in different example embodiments may partially be replaced by or combined with each other. Regarding modified examples and second and subsequent example embodiments, reference will be given only to the configuration different from that of a first example embodiment while an explanation of the same configuration as the first example embodiment is being omitted. Similar advantages obtained by similar configurations are not repeated every time an example embodiment is explained.
An acoustic wave device 1 of the first example embodiment includes a piezoelectric layer 2 made of LiNbO3, for example. The piezoelectric layer 2 may alternatively be made of LiTaO3, for example. The cut-angles of LiNbO3 or LiTaO3 in the first example embodiment are preferably Z-cut, for example, but may be rotated Y-cut or X-cut. Preferably, for example, the propagation orientation of the cut-angles of LiNbO3 or LiTaO3 is Y-propagation about ±30° and X-propagation about ±30°.
The thickness of the piezoelectric layer 2 is not limited to a particular thickness, but, for example it is preferably about 50 to about 1000 nm to effectively excite the thickness shear primary mode.
The piezoelectric layer 2 includes first and second main surfaces 2a and 2b opposing each other in the Z direction. On the first main surface 2a, electrode fingers 3 and 4 are provided.
The electrode finger 3 is an example of a “first electrode finger”, while the electrode finger 4 is an example of a “second electrode finger”. In
The IDT electrode is defined by first and second comb-shaped electrodes.
The first comb-shaped electrode includes a first busbar electrode 5 and a first electrode finger 3. The first electrode finger 3 extends in a second direction in a plane of a piezoelectric substrate and one end of the first electrode finger 3 is connected to the first busbar electrode 5. If plural first electrode fingers 3 are provided, a conductor to which one end of each of the plural electrode fingers 3 is connected is the first busbar electrode 5. The first busbar electrode 5 may be integrally provided with a connection wiring connected to another element or terminal.
The second comb-shaped electrode includes a second busbar electrode 6 and a second electrode finger 4. The second electrode finger 4 extends in the second direction in a plane of the piezoelectric substrate and one end of the second electrode finger 4 is connected to the second busbar electrode 6. If plural second electrode fingers 4 are provided, a conductor to which one end of each of the plural second electrode fingers 4 is connected is the second busbar electrode 6. The second busbar electrode 6 may be integrally provided with a connection wiring connected to another element or terminal.
The first and second comb-shaped electrodes are at least partially interdigitated with each other. The first and second busbar electrodes 5 and 6 oppose each other in a second direction, which will be discussed later. The first electrode fingers 3 and the second electrode fingers 4 oppose each other in a third direction, which will be discussed later. That is, at least some of the first electrode fingers 3 and at least some of the second electrode fingers 4 are arranged alternately in the third direction. The first electrode fingers 3 and the second electrode fingers 4 which are arranged alternately in the third direction overlap each other in the third direction.
The electrode fingers 3 and 4 have a rectangular or substantially rectangular shape and have a longitudinal direction. An electrode finger 3 and an adjacent electrode finger 4 oppose each other in a direction perpendicular or substantially perpendicular to this longitudinal direction. The longitudinal direction of the electrode fingers 3 and 4 and the direction perpendicular or substantially perpendicular to the longitudinal direction of the electrode fingers 3 and 4 are directions intersecting with the thickness direction of the piezoelectric layer 2. It can thus be said that an electrode finger 3 and an adjacent electrode finger 4 oppose each other in a direction intersecting with the thickness direction of the piezoelectric layer 2. In the following description, an explanation may be given, assuming that the thickness direction of the piezoelectric layer 2 is the Z direction (or a first direction), the longitudinal direction of the electrode fingers 3 and 4 is the Y direction (or a second direction), and the direction perpendicular or substantially perpendicular to the longitudinal direction of the electrode fingers 3 and 4 is the X direction (or a third direction).
The electrode fingers 3 and 4 may extend in a direction perpendicular or substantially perpendicular to the longitudinal direction of the electrode fingers 3 and 4 shown in
“Electrode fingers 3 and 4 adjacent to each other” refers to, not that the electrode fingers 3 and 4 are located to directly contact each other, but that the electrode fingers 3 and 4 are located with a space therebetween. When electrode fingers 3 and 4 are adjacent to each other, an electrode connected to a hot electrode and an electrode connected to a ground electrode, including the other electrode fingers 3 and 4, are not located between the adjacent electrode fingers 3 and 4. The number of pairs of electrode fingers 3 and 4 is not necessarily an integral number and may be 1.5 or 2.5, for example.
The center-to-center distance, that is, the pitch, between the electrode fingers 3 and 4 is, for example, preferably about 1 to about 10 μm. The center-to-center distance between the electrode fingers 3 and 4 is a distance from the center of the width of the electrode finger 3 in the direction perpendicular or substantially perpendicular to the longitudinal direction of the electrode finger 3 to that of the electrode finger 4 in the direction perpendicular or substantially perpendicular to the longitudinal direction of the electrode finger 4.
When at least one of the number of electrode fingers 3 and the number of electrode fingers 4 is plural (when 1.5 or more pairs of electrode fingers 3 and 4, each pair being formed by an electrode finger 3 and an electrode finger 4, are provided), the center-to-center distance between the electrode fingers 3 and 4 is the average value of that between adjacent electrode fingers 3 and 4 of the 1.5 or more pairs.
The width of each of the electrode fingers 3 and 4, that is, the dimension in the facing direction of the electrode fingers 3 and 4, is, for example, preferably about 150 to about 1000 nm. The center-to-center distance between the electrode fingers 3 and 4 is a distance from the center of a dimension (width) of the electrode finger 3 in the direction perpendicular or substantially perpendicular to the longitudinal direction of the electrode finger 3 to that of the electrode finger 4 in the direction perpendicular or substantially perpendicular to the longitudinal direction of the electrode finger 4.
In the first example embodiment, since a Z-cut piezoelectric layer is used, the direction perpendicular or substantially perpendicular to the longitudinal direction of the electrode fingers 3 and 4 is a direction perpendicular or substantially perpendicular to the polarization direction of the piezoelectric layer 2. However, this is not the case if a piezoelectric layer of another cut angle is used as the piezoelectric layer 2. “Being perpendicular” does not necessarily mean being exactly perpendicular, but may mean being substantially perpendicular. For example, the angle between the direction perpendicular to the longitudinal direction of the electrode fingers 3 and 4 and the polarization direction may be in a range of about 90°±10°, for example.
A support substrate 8 is stacked below the second main surface 2b of the piezoelectric layer 2 with an intermediate layer 7 interposed therebetween. The intermediate layer 7 and the support substrate 8 have a frame shape and include cavities 7a and 8a, respectively, as shown in
The space 9 is provided not to interfere with the vibration of an excitation region C of the piezoelectric layer 2. Hence, the support substrate 8 is stacked below the second main surface 2b with the intermediate layer 7 therebetween and is located at a position at which the support substrate 8 does not overlap a region where at least one pair of electrode fingers 3 and 4 is located. The provision of the intermediate layer 7 may be omitted. The support substrate 8 can thus be stacked directly or indirectly below the second main surface 2b of the piezoelectric layer 2.
The intermediate layer 7 is preferably made of silicon oxide, for example. Instead of silicon oxide, another suitable insulating material, such as silicon nitride or alumina, for example, may be used to form the intermediate layer 7 if so desired.
The support substrate 8 is preferably made of Si, for example. The plane orientation of Si on the side of the piezoelectric layer 2 may be (100), (110), or (111). Preferably, high-resistivity Si, such as Si having a resistivity of, for example, about 4 kΩ or higher, is used. A suitable insulating material or semiconductor material may be used for the support substrate 8. Examples of the material for the support substrate 8 are: piezoelectric materials, such as aluminum oxide, lithium tantalate, lithium niobate, and quartz; various ceramic materials, such as alumina, magnesia, sapphire, silicon nitride, aluminum nitride, silicon carbide, zirconia, cordierite, mullite, steatite, and forsterite; dielectric materials, such as diamond and glass; and semiconductor materials, such as gallium nitride.
The above-described plural electrode fingers 3 and 4 and first and second busbar electrodes 5 and 6 are made of a suitable metal or alloy, such as Al or an AlCu alloy, for example. In the first example embodiment, the electrode fingers 3 and 4 and the first and second busbar electrodes 5 and 6 have a structure in which an Al film is stacked on a Ti film, for example. A contact layer made of a material other than Ti may be used.
To drive the acoustic wave device 1, an AC voltage is applied to between the plural electrode fingers 3 and the plural electrode fingers 4. More specifically, an AC voltage is applied to between the first busbar electrode 5 and the second busbar electrode 6. With the application of the AC voltage, resonance characteristics based on a bulk wave of the thickness shear primary mode excited in the piezoelectric layer 2 can be obtained.
In the acoustic wave device 1, for example, d/p is set to about 0.5 or smaller, where d is the thickness of the piezoelectric layer 2 and p is the center-to-center distance between adjacent electrode fingers 3 and 4 defining one of multiple pairs of electrode fingers 3 and 4. This can effectively excite a bulk wave of the thickness shear primary mode and obtain high resonance characteristics. More preferably, for example, d/p is about 0.24 or smaller, in which case, even higher resonance characteristics can be obtained.
As in the first example embodiment, when at least one of the number of electrode fingers 3 and the number of electrode fingers 4 is plural, that is, when 1.5 or more pairs of electrode fingers 3 and 4, each pair being defined by an electrode finger 3 and an electrode finger 4, are provided, the average center-to-center distance between adjacent electrode fingers 3 and 4 of the individual pairs is used as the center-to-center distance between adjacent electrode fingers 3 and 4.
The acoustic wave device 1 of the first example embodiment is configured as described above. Thus, even if the number of pairs of the electrode fingers 3 and 4 is reduced to miniaturize the acoustic wave device 1, the Q factor is unlikely to be lowered. This is because the acoustic wave device 1 is a resonator which does not require reflectors on both sides and only a small propagation loss is incurred. The reason why the acoustic wave device 1 does not require reflectors is that a bulk wave of the thickness shear primary mode is utilized.
In contrast, as illustrated in
Regarding the amplitude direction of a bulk wave of the thickness shear primary mode, as shown in
As discussed above, in the acoustic wave device 1, at least one pair of electrode fingers 3 and 4 is provided. Since a wave does not propagate through the piezoelectric layer 2 of the acoustic wave device 1 in the X direction, plural pairs of electrode fingers 3 and 4 are not required. That is, the provision of at least one pair of electrodes is sufficient, however additional pairs of electrodes can be provided if so desired.
In one example, the electrode finger 3 is an electrode connected to a hot potential, while the electrode finger 4 is an electrode connected to a ground potential. Conversely, the electrode finger 3 may be connected to a ground potential, while the electrode finger 4 may be connected to a hot potential. In the first example embodiment, as described above, at least one pair of electrodes is connected to a hot potential and a ground potential, and more specifically, one electrode forming this pair is an electrode connected to a hot potential, and the other electrode is an electrode connected to a ground potential. No floating electrode is located.
The excitation region C (see
In the first example embodiment, the center-to-center distance of an electrode pair defined by an electrode finger 3 and an electrode finger 4 was set to all be equal or substantially equal among plural pairs. That is, the electrode fingers 3 and 4 were located at equal or substantially equal pitches.
As is seen from
In the first example embodiment, for example, as stated above, d/p is about 0.5 or smaller, and more preferably, d/p is about 0.24 or smaller, where d is the thickness of the piezoelectric layer 2 and p is the center-to-center distance between the electrode fingers 3 and 4. This will be explained below with reference to
Plural acoustic wave devices were made in a manner the same as or similar to the acoustic wave device which has obtained the resonance characteristics shown in
As is seen from
As stated above, at least one pair of electrodes may be only one pair of electrodes. If one pair of electrodes is provided, the center-to-center distance between the adjacent electrode fingers 3 and 4 is used as the above-described center-to-center distance p. If 1.5 or more pairs of electrodes are provided, the average center-to-center distance between the adjacent electrode fingers 3 and 4 of the individual pairs is used as the center-to-center distance p.
Regarding the thickness d of the piezoelectric layer 2, if the piezoelectric layer 2 has variations in the thickness, the averaged thickness value may be used.
In the acoustic wave device 1, the metallization ratio MR of any one pair of adjacent electrode fingers 3 and 4 among the plural electrode fingers 3 and 4 to the excitation region C where this pair of electrode fingers 3 and 4 overlap each other as seen in their facing direction preferably satisfies MR≤about 1.75 (d/p)+0.075. In this case, spurious responses can be effectively reduced. This will be explained below with reference to
The metallization ratio MR will be explained below with reference to
If plural pairs of electrode fingers 3 and 4 are provided, the ratio of the areas of the metallized portions included in the total excitation region to the total area of the excitation region is used as the metallization ratio MR.
Many acoustic wave resonators were formed based on the acoustic wave device of the first example embodiment.
A spurious response is as high as about 1.0 in the region defined by the elliptical portion J in
(0°±10°, 0°to20°,a desirable angle of ψ) Expression (1)
(0°±10°, 20°to80°, 0°to60°(1−(θ−50)2/900)1/2) or (0°±10°, 20°to80°,[180°−60°(1−(θ−50)2/900)1/2]to180°) Expression (2)
(0°±10°,[180°−30°(1−(ψ−90)2/8100)1/2]to180°,a desirable angle of ψ) Expression (3)
When the Euler angles are in the range represented by the above-described expressions (1), (2), or (3), a sufficiently wide fractional bandwidth can be obtained, which is desirable.
As described above, in the acoustic wave devices 1 and 101, a bulk wave of the thickness shear primary mode is utilized. In the acoustic wave devices 1 and 101, the first and second electrode fingers 3 and 4 are adjacent electrodes, for example, and d/p is set to about 0.5 or smaller, where d is the thickness of the piezoelectric layer 2 and p is the center-to-center distance between the first and second electrode fingers 3 and 4. With this configuration, even if the acoustic wave device is reduced in size, the Q factor can be improved.
In the acoustic wave devices 1 and 101, the piezoelectric layer 2 is preferably made of lithium niobate or lithium tantalate, for example. On the first main surface 2a or the second main surface 2b of the piezoelectric layer 2, the first and second electrode fingers 3 and 4 opposing each other in the direction intersecting with the thickness direction of the piezoelectric layer 2 are located. It is preferable that a protection film cover the first and second electrode fingers 3 and 4.
The support portion 80 is a member which supports a support substrate 8. In the acoustic wave device 1A of the first example, the support portion 80 includes an intermediate layer 7, the support substrate 8, a cover substrate 81, and a bonding layer 82. The cover substrate 81 is a silicon substrate. The bonding layer 82 is a layer which bonds the cover substrate 81 to the support substrate 8. That is, the cover substrate 81 is located under the support substrate 8 with the bonding layer 82 interposed therebetween. The intermediate layer 7, the cover substrate 81, and the bonding layer 82 are not essential components, and the first piezoelectric layer 21 may contact the top side of the support substrate 8.
The support portion 80 includes a first space 91. The first space 91 defines a portion of the above-described space 9. In the first example, the first space 91 is a space defined by the cavity 7a of the frame-shaped intermediate layer 7 and the cavity 8a of the frame-shaped support substrate 8. In the example in
The first piezoelectric layer 21 is a layer made of a piezoelectric body. In the first example, the first piezoelectric layer 21 is located to contact the support portion 80 in the Z direction. As shown in
The second piezoelectric layer 22 is a layer made of a piezoelectric body. In the first example, the second piezoelectric layer 22 is located on the side of the first main surface 21a of the first piezoelectric layer 21. As shown in
The first piezoelectric layer 21 and the second piezoelectric layer 22 may be made of a material having the same composition. In the first example, the first and second piezoelectric layers 21 and 22 are made of a Z-cut lithium niobate single crystal. This can improve the coupling coefficient.
The polarization state of dielectric polarization of the first main surface 21a of the first piezoelectric layer 21 and that of the first main surface 22a of the second piezoelectric layer 22 are the same. “The polarization state of dielectric polarization of one main surface is the same as that of the other main surface” means that the orientation of the dielectric polarization of one main surface is the same as the orientation of this main surface and that the orientation of the dielectric polarization of the other main surface is the same as the orientation of this main surface. In the first example, the first main surface 21a of the first piezoelectric layer 21 faces upward and the dielectric polarization DP1 of the first main surface 21a of the first piezoelectric layer 21 faces upward. The first main surface 22a of the second piezoelectric layer 22 faces downward and the dielectric polarization DP2 of the first main surface 22a of the second piezoelectric layer 22 faces downward. In this case, the orientation of the dielectric polarization DP1 is the same or substantially the same as that of the first main surface 21a, and the orientation of the dielectric polarization DP2 is the same or substantially the same as that of the first main surface 22a. It can thus be said that the polarization state of the dielectric polarization of the first main surface 21a of the first piezoelectric layer 21 is the same or substantially the same as that of the first main surface 22a of the second piezoelectric layer 22. With this configuration, a high coupling coefficient of the acoustic wave device 1A can be maintained and spurious responses can be reduced. The orientation of the dielectric polarization DP1 of the first main surface 21a may be the opposite orientation of the first main surface 21a, while the orientation of the dielectric polarization DP2 of the first main surface 22a may be the opposite orientation of the first main surface 22a. That is, the dielectric polarization DP1 of the first main surface 21a of the first piezoelectric layer 21 may face downward, while the dielectric polarization DP2 of the first main surface 22a of the second piezoelectric layer 22 may face upward.
The dielectric state of the dielectric polarization of each of the first main surfaces 21a and 22a of the first and second piezoelectric layers 21 and 22 can be examined with a SPM (Scanning Probe Microscopy). More specifically, the first main surfaces 21a and 22a of the first and second piezoelectric layers 21 and 22 are examined with a PRM (Piezo Response Microscope) to determine the orientation of the dielectric polarization. This can determine whether the orientation of the dielectric polarization of the first main surface 21a and that of the first main surface 22a are the same or different.
One of the thickness d of the first piezoelectric layer 21 and the thickness d2 of the second piezoelectric layer 22 does not exceed a dimension about twice as large as the other one of the thickness d and the thickness d2. That is, the thickness d of the first piezoelectric layer 21 does not exceed a dimension about twice as large as the thickness 2d of the second piezoelectric layer 22, and the thickness 2d of the second piezoelectric layer 22 does not exceed a dimension about twice as large as the thickness d of the first piezoelectric layer 21. In other words, the thickness d of the first piezoelectric layer 21 is about half the dimension of the thickness d2 of the second piezoelectric layer 22 or larger and is smaller than the dimension about twice as large as the thickness d2. This makes it less likely to generate a disparity between the coupling of coefficient the first piezoelectric layer 21 and that of the second piezoelectric layer 22, which would be caused by a large difference between the thickness d of the first piezoelectric layer 21 and the thickness 2d of the second piezoelectric layer 22, thus reducing or preventing the degradation of the frequency characteristics. If the thickness d of the first piezoelectric layer 21 and the thickness 2d of the second piezoelectric layer 22 are equal or substantially equal to each other, it is even less likely to generate a disparity between the coupling coefficient of the first piezoelectric layer 21 and that of the second piezoelectric layer 22, which is preferable.
The function electrode 30 is preferably an IDT electrode including a first electrode finger 3A, a second electrode finger 4A, a first busbar electrode 5, and a second busbar electrode 6. The function electrode 30 is located between the first piezoelectric layer 21 and the second piezoelectric layer 22. In the first example, the first electrode finger 3A and the second electrode finger 4A contact the first main surfaces 21a and 22a of the first and second piezoelectric layers 21 and 22. With this configuration, the first and second piezoelectric layers 21 and 22 are excited. Thus, the acoustic wave device 1A can enhance the capacitance while maintaining the same or substantially the same size as a known acoustic wave device, and with the same capacitance as that of a known acoustic wave device, the size of the acoustic wave device 1A can be reduced. Additionally, the electrode fingers 3A and 4A support the portion between the first piezoelectric layer 21 and the second piezoelectric layer 22, thereby improving the mechanical strength of the acoustic wave device 1A.
The first electrode finger 3A is preferably a multilayer body including multiple metal layers 3a, 3b, and 3c stacked on each other in the Z direction. The metal layer 3a is a metal layer of the first electrode finger 3A located on the side of the first piezoelectric layer 21. The metal layer 3a contacts the first main surface 21a of the first piezoelectric layer 21. The metal layer 3a uses, for example, titanium or chromium as a principal component. In other words, the material of the metal layer 3a includes titanium or chromium more than other components. The metal layer 3b is stacked on the metal layer 3a. The material of the metal layer 3b is not limited to a particular material and may be made of a suitable metal or alloy, such as Al or an AlCu alloy, for example. The metal layer 3c is a metal layer of the first electrode finger 3A located on the side of the second piezoelectric layer 22. The metal layer 3c is stacked on the metal layer 3b. The metal layer 3c is made of a material the same as or similar to that of the metal layer 3a and uses titanium or chromium as a principal component. In the first example, the metal layer 3c contacts the first main surface 22a of the second piezoelectric layer 22. This can improve the mechanical strength of the acoustic wave device 1A.
As in the first electrode finger 3A, the second electrode finger 4A is preferably a multilayer body including multiple metal layers 4a, 4b, and 4c stacked on each other in the Z direction. The metal layer 4a is a metal layer of the second electrode finger 4A located on the side of the first piezoelectric layer 21. The metal layer 4a contacts the first main surface 21a of the first piezoelectric layer 21. The metal layer 4a uses, for example, titanium or chromium as a principal component. The metal layer 4b is stacked on the metal layer 4a. The material of the metal layer 4b is not limited to a particular material and may be made of a suitable metal or alloy, such as Al or an AlCu alloy, for example. The metal layer 4c is a metal layer of the second electrode finger 4A located on the side of the second piezoelectric layer 22. The metal layer 4c is stacked on the metal layer 4b. The metal layer 4c is made of a material the same as or similar to that of the metal layer 4a and uses titanium or chromium as a principal component. In the first example, the metal layer 4c contacts the first main surface 22a of the second piezoelectric layer 22. This can improve the mechanical strength of the acoustic wave device 1A.
The wiring 12 is electrically connected to the function electrode 30. The wiring 12 is located between the first piezoelectric layer 21 and the second piezoelectric layer 22. In the first example, the wiring 12 contacts the first main surfaces 21a and 22a of the first and second piezoelectric layers 21 and 22. The wiring 12 is preferably a multilayer body of gold or a gold alloy and another metal, such as titanium, for example, but is not limited thereto. For example, the wiring 12 may be a multilayer body of metal layers made of materials the same as or similar to those of the first and second electrode fingers 3A and 4A.
The pad 43 is electrically connected to the function electrode 30. In the first example, the pad 43 is preferably stacked on the second main surface 22b of the second piezoelectric layer 22. The pad 43 preferably includes, for example, a material made of at least one of the elements selected from Al, Cu, Ti, Pt, Au, Be, and W. This can lower the contact resistance. The pad 43 is preferably an AlCu alloy layer stacked on a contact layer including Ti, for example. In this case, the contact resistance between the pad 43 and the function electrode 30 can be lowered and the cost can also be reduced.
The support frame 42 is preferably stacked on the pad 43 by plating, for example. The support frame 42 is preferably made of Au or an Au alloy, for example. In the first example, the support frame 42 has a frame shape in a plan view in the Z direction. The second space 92 is located inside the support frame 42 in a plan view in the Z direction. The second space 92 is a space between the second piezoelectric layer 22 and the cover layer 41, which will be discussed below.
The cover layer 41 is a silicon substrate, for example. The cover layer 41 is provided to cover the second space 92. The bump electrode 50 is provided in the cover layer 41 at a position at which the bump electrode 50 overlaps the support frame 42 in a plan view in the Z direction.
The bump electrode 50 is located to pass through the cover layer 41 and the support frame 42 in the Z direction. The bump electrode 50 includes a terminal electrode 57 and a bump 58. The terminal electrode 57 is what is known as a bump metal and is electrically connected to the pad 43. The bump 58 is located on the terminal electrode 57. The bump 58 is what is known as a bump metal and is a BGA (ball grid array) bump. The bump 58 is stacked on the terminal electrode 57 in the Z direction and is electrically connected to the terminal electrode 57. With this configuration, the bump 58, terminal electrode 57, pad 43, and function electrode 30 are electrically connected to each other.
The acoustic wave device 1A according to the first example embodiment has been discussed above. However, the acoustic wave device according to the first example embodiment is not limited to the acoustic wave device 1A of the first example. Acoustic wave devices of other examples will be described below with reference to the drawings. Components having the same configurations as those in the first example are designated by like reference numerals and an explanation thereof will be omitted.
The distance Δd between at least one of the first and second electrode fingers 3A and 4A and the second piezoelectric layer 22 in the gap is smaller than the center-to-center distance p between the first electrode finger 3A and the second electrode finger 4A. The distance Δd is the shortest distance from the surface of the first electrode finger 3A or the second electrode finger 4A on the side of the second piezoelectric layer 22 to the first main surface 22a of the second piezoelectric layer 22. By setting the distance Δd to this range, the capacitance can be made sufficiently high while the degradation of the frequency characteristics is being reduced of prevented.
The individual examples of the acoustic wave device of the first example embodiment have been described above. However, the acoustic wave device according to the first example embodiment is not limited to the acoustic wave devices of the above-described first through third examples.
In one example, in the third example, the electrode fingers 3A and 4A may contact the first main surface 22a of the second piezoelectric layer 22 and may have a gap with the first piezoelectric layer 21. In this case, the shortest distance from the surface of the first electrode finger 3A or the second electrode finger 4A on the side of the first piezoelectric layer 21 to the first main surface 21a of the first piezoelectric layer 21 corresponds to the distance Δd.
In another example, in the third example, it is not necessary that the first piezoelectric layer 21 and the second piezoelectric layer 22 are bonded to each other via the wiring 12. They may be bonded to each other via an intervening layer made of a material other than a conductor. In this case, too, the mechanical strength of the piezoelectric layers 21 and 22 can be maintained.
In another example, in the third example, a dielectric film may be provided on the surfaces of the electrode fingers 3A and 4A on the side of the second piezoelectric layer 22. In this case, too, the distance from the surface of the electrode finger 3A and/or the electrode finger 4A on the side of the second piezoelectric layer 22 to the first main surface 22a of the second piezoelectric layer 22 is defined as the distance Δd between the electrode finger 3A and/or the electrode finger 4A and the second piezoelectric layer 22 in the gap.
As described above, an acoustic wave device 1A according to the first example includes a first piezoelectric layer 21, a second piezoelectric layer 22 located above the first piezoelectric layer 21 in a first direction, and an IDT electrode. The IDT electrode includes first and second busbar electrodes 5 and 6 and first and second electrode fingers 3A and 4A. The first busbar electrode 5 and the second busbar electrode 6 oppose each other. The first electrode finger 3A is provided for the first busbar electrode 5 and extends toward the second busbar electrode 6. The second electrode finger 4A is provided for the second busbar electrode 6 and extends toward the first busbar electrode 5. The first and second electrode fingers 3A and 4A are sandwiched between the first piezoelectric layer 21 and the second piezoelectric layer 22 in the first direction. The first and second electrode fingers 3A and 4A extend in a second direction which intersects with the first direction and are located to overlap each other as seen in a third direction which is perpendicular or substantially perpendicular to the second direction. With this configuration, the first and second electrode fingers 3A and 4A can excite the first and second piezoelectric layers 21 and 22. The acoustic wave device 1A can thus improve the capacitance while maintaining the same size as a known acoustic wave device. With the same or substantially the same capacitance as that of a known acoustic wave device, the size of the acoustic wave device 1A can be reduced.
In a preferable mode, in the first direction, the first and second electrode fingers 3A and 4A contact the first and second piezoelectric layers 21 and 22. With this configuration, the first and second electrode fingers 3A and 4A support the portion between the first piezoelectric layer 21 and the second piezoelectric layer 22 in the Z direction, thereby improving the mechanical strength of the acoustic wave device 1A.
In the first direction, the first and second electrode fingers 3A and 4A may contact the first piezoelectric layer 21 and have a gap with the second piezoelectric layer 22. In this case, too, the first and second electrode fingers 3A and 4A can excite the first and second piezoelectric layers 21 and 22. The acoustic wave device 1A can thus enhance the capacitance while maintaining the same size as a known acoustic wave device. With the same capacitance as that of a known acoustic wave device, the size of the acoustic wave device 1A can be reduced.
In a preferable mode, the distance Δd between at least one of the first and second electrode fingers 3A and 4A and the second piezoelectric layer 22 in the gap is smaller than the center-to-center distance p between the first electrode finger 3A and the second electrode finger 4A. With this configuration, the capacitance can be made sufficiently high while the degradation of the frequency characteristics is reduced or prevent.
In a preferable mode, the first and second piezoelectric layers 21 and 22 are made of the same material. This can improve the coupling coefficient.
In a preferable mode, the first and second piezoelectric layers 21 and 22 are made of a single crystal and the polarization state of dielectric polarization of a main surface of the first piezoelectric layer 21 is the same as that of a main surface of the second piezoelectric layer 22. The main surfaces of the first and second piezoelectric layers 21 and 22 oppose each other. With this configuration, a high coupling coefficient of the acoustic wave device 1A can be maintained and spurious responses can be reduced.
In a preferable mode, one of the thickness d of the first piezoelectric layer 21 and the thickness d2 of the second piezoelectric layer 22 does not exceed a dimension twice as large as the other one of the thickness d and the thickness d2. This makes it less likely to generate a disparity between the coupling coefficient of the first piezoelectric layer 21 and that of the second piezoelectric layer 22, which would be caused by a difference between the thickness of the first piezoelectric layer 21 and that of the second piezoelectric layer 22, thus reducing or preventing the degradation of the frequency characteristics.
In a preferable mode, the first electrode finger 3A is a multilayer body including plural metal layers 3a through 3c, and the second electrode finger 4A is a multilayer body including plural metal layers 4a through 4c. The metal layers 3a and 3c of the first electrode finger 3A and the metal layers 4a and 4c of the second electrode finger 4A contact the first piezoelectric layer 21 or the second piezoelectric layer 22. The metal layers 3a, 3c, 4a, and 4c include titanium or chromium as a principal component. This can improve the mechanical strength of the acoustic wave device 1A.
In a preferable mode, the acoustic wave device 1A also includes a support portion 80. The support portion 80 includes a space (space 91). The first piezoelectric layer 21 is located on the support portion 80 in the first direction. The first piezoelectric layer 21 includes first and second main surfaces 21a and 21b. The first main surface 21a opposes the second piezoelectric layer 22. The second main surface 21b is located on the opposite side of the first main surface 21a in the first direction. The second main surface 21b of the first piezoelectric layer 21 opposes the space. This makes it less likely to interfere with the vibration of the first piezoelectric layer 21 in the excitation region.
In a preferable mode, at least, the thickness of the first piezoelectric layer 21 is 2p or smaller, where p is the center-to-center distance between adjacent first and second electrode fingers 3A and 4A of the first and second electrode fingers 3A and 4A. This can effectively excite a bulk wave of the thickness shear primary mode.
In a preferable mode, the first and second piezoelectric layers 21 and 22 include lithium niobate or lithium tantalate. This makes it possible to provide an acoustic wave device that can exhibit high resonance characteristics.
In a preferable mode, the acoustic wave device is able to use a bulk wave of the thickness shear mode. Using a Lamb wave may affect the frequency characteristics when the function electrode 30 is made thick. Conversely, using a bulk wave of the thickness shear mode does not affect the frequency characteristics considerably even when the function electrode 30 is made thick. The thickness of the function electrode 30 can thus be increased, thus reducing a loss due to series resistance.
In a preferable mode, d/p is about 0.24 or smaller. This can excite a bulk wave of the thickness shear primary mode more effectively.
In a preferable mode, d/p≤ about 0.5 is satisfied, where d is the thickness of the first piezoelectric layer 21 and p is the center-to-center distance between adjacent first and second electrode fingers 3A and 4A of the first and second electrode fingers 3A and 4A. This can effectively excite a bulk wave of the thickness shear primary mode.
In a preferable mode, MR ≤about 1.75 (d/p)+0.075 is satisfied, where MR is a metallization ratio of the area of the first and second electrode fingers 3A and 4A within the excitation region to the area of the excitation region. The excitation region is a region in which the first and second electrode fingers 3A and 4A overlap each other as seen in the third direction. This can reduce spurious responses effectively.
In a preferable mode, the first and second piezoelectric layers 21 and 22 contain lithium niobate or lithium tantalate. The Euler angles (φ, θ, ψ) of lithium niobate or lithium tantalate are in a range represented by expression (1), (2), or (3). This can reliably make the fractional bandwidth be about 17% or lower.
(0°±10°, 0°to20°,a desirable angle of ψ) Expression (1)
(0°±10°, 20°to80°, 0°to60°(1−(θ−50)2/900)1/2) or (0°±10°, 20°to80°,[180°−60°(1−(θ−50)2/900)1/2]to180°) Expression (2)
(0°±10°,[180°−30°(1−(ψ−90)2/8100)1/2]to180°,a desirable angle of ψ) Expression (3)
Tests according to the present disclosure will be described below.
In the tests, acoustic wave devices of first and second test examples and first and second comparative examples were simulated using the finite element method, and admittance characteristics were calculated.
The acoustic wave device of the first test example is the acoustic wave device 1A of the first example. The design parameters of the acoustic wave device of the first test example are as follows.
The acoustic wave device of the second test example is the acoustic wave device of the second example. That is, in the acoustic wave device of the second test example, the orientation of the dielectric polarization of the first main surface 22a of the second piezoelectric layer 22 is different from that in the first test example. The other design parameters of the acoustic wave device of the second test example are similar to those of the first test example.
Additionally, as illustrated in
The above-described example embodiments are provided to facilitate the understanding of the disclosure, but is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Modifications/improvements may be made without departing from the spirit and scope of the disclosure, and equivalents of the disclosure are also encompassed in the disclosure.
While example embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
This application claims the benefit of priority to Provisional Application No. 63/281,101, filed on Nov. 19, 2021, and is a Continuation Application of PCT Application No. PCT/JP2022/042920, filed on Nov. 18, 2022. The entire contents of each application are hereby incorporated herein by reference.
Number | Date | Country | |
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63281101 | Nov 2021 | US |
Number | Date | Country | |
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Parent | PCT/JP2022/042920 | Nov 2022 | WO |
Child | 18667447 | US |