Claims
- 1. A method of using a polymer as an adhesive comprising applying said polymer to a substrate to form a first polymer coated substrate, then applying a second substrate to said first polymer coated substrate wherein said polymer is prepared by, first, forming a slurry by cooling a solution which contains a solvent and from 1 to less than 50 percent by weight of a synthetic wax monomer of formula I: whereinR1 is selected from H and CH3, R2 is selected from H and C1-C5 alkyl, R3 is selected from H and CH3, n=9-115, and m=0-1370; second, adding from 50 to 99 percent by weight of at least one second monomer; and finally, polymerizing the reaction mixture in the presence of an initiator.
Parent Case Info
This is a divisional application of U.S. application Ser. No. 09/388,882, filed Sep. 2, 1999, now U.S. Pat. No. 6,437,070, which claims the benefit of Provisional application Ser. No. 60/101,415, filed Sep. 22, 1998.
US Referenced Citations (8)
Foreign Referenced Citations (12)
Number |
Date |
Country |
0 003 235 |
Aug 1979 |
EP |
0 013 836 |
Aug 1980 |
EP |
0 570 093 |
Nov 1993 |
EP |
0 768 385 |
Apr 1997 |
EP |
62-240584 |
Apr 1986 |
JP |
05-171101 |
Dec 1991 |
JP |
07-145289 |
Jun 1995 |
JP |
09-255727 |
Sep 1997 |
JP |
09-292675 |
Nov 1997 |
JP |
WO 9502003 |
Jan 1995 |
WO |
WO 9626249 |
Jan 1996 |
WO |
WO 9825710 |
Dec 1997 |
WO |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/101415 |
Sep 1998 |
US |