Active 3D Packaging Architecture

Information

  • NSF Award
  • 9301913
Owner
  • Award Id
    9301913
  • Award Effective Date
    7/15/1993 - 31 years ago
  • Award Expiration Date
    12/31/1995 - 29 years ago
  • Award Amount
    $ 299,984.00
  • Award Instrument
    Standard Grant

Active 3D Packaging Architecture

Laptop and notebook computers are two examples of the many applications that require low-power, low-volume mass storage. A prior SBIR Phase I research grant examined the feasibility of replacing hard disk drives with 3D packaged solid state memory. Specifically, this effort verified that a two inch by three inch by one-fifth inch PCMCIA type 2 memory card can provide 256 megabytes of memory with less than one microsecond access time and negligible power consumption. This capability can be provided cost effectively both as a standard hard drive and as main memory. This Phase II project develops and demonstrates a laboratory prototype of a 256 megabyte memory card that includes the active components required for data formatting, input-output drivers, and control logic, such that the memory card can be interfaced directly to existing laptop and notebook computers.

  • Program Officer
    Paul T. Hulina
  • Min Amd Letter Date
    7/16/1993 - 31 years ago
  • Max Amd Letter Date
    6/30/1997 - 27 years ago
  • ARRA Amount

Institutions

  • Name
    Irvine Sensors Corporation
  • City
    COSTA MESA
  • State
    CA
  • Country
    United States
  • Address
    3001 REDHILL AVE, B3-108
  • Postal Code
    926264506
  • Phone Number
    7144448700

Investigators

  • First Name
    John
  • Last Name
    Carson
  • Email Address
    jcarson@irvine-sensors-com
  • Start Date
    7/15/1993 12:00:00 AM

FOA Information

  • Name
    Industrial Technology
  • Code
    308000