Active 3D Packaging Architecture

Information

• NSF Award
• 9161045

Owner

• Irvine Sensors Corporation

• Award Id

  9161045

• Award Effective Date

  1/1/1992 - 33 years ago

• Award Expiration Date

  9/30/1992 - 32 years ago

• Award Amount

  $ 49,942.00

• Award Instrument

  Standard Grant

This research is concerned with investigating the use of a 3D packaging architecture along with memory and an active substrate to achieve low-power low-weight mass storage for use in laptop and notebook computers. The effort combines high density 3D packaging of conventional, domestically available SRAM devices with active mounting substrates that control the device power dissipation in the standby mode. A 50-megabyte hard disk replacement will consume .5 cubic inch and have negligible impact on battery run-down time. In addition, access time will reduce from milliseconds to less than 100 nanoseconds. This research effort will analytically verify the concept feasibility, design test articles, and develop an experimental test plan.

• Program Officer

  Ritchie B. Coryell

• Min Amd Letter Date

  1/30/1992 - 32 years ago

• Max Amd Letter Date

  1/30/1992 - 32 years ago

• ARRA Amount

• Name

  Irvine Sensors Corporation

• City

  COSTA MESA

• State

  CA

• Country

  United States

• Address

  3001 REDHILL AVE, B3-108

• Postal Code

  926264506

• Phone Number

  7144448700

• First Name

  John

• Last Name

  Carson

• Email Address

  jcarson@irvine-sensors-com

• Start Date

  1/1/1992 12:00:00 AM

• Name

  Industrial Technology

• Code

  308000

• Name

  Computer Science & Engineering

• Code

  31

• Name

  Engineering-Electrical

• Code

  55