Claims
- 1. A noise attenuation assembly for use in a vehicle air intake arrangement, comprising:
a housing that at least partially defines an air passageway; an electronics module supported by the housing; and a metal cooling member supported by the housing at least partially in the air passageway and coupled with the electronics module such that heat in the electronics module is dissipated by the cooling member.
- 2. The assembly of claim 1, wherein the cooling member comprises brass.
- 3. The assembly of claim 1, wherein the cooling member includes a body portion and a plurality of ribs extending radially outwardly from the body portion.
- 4. The assembly of claim 3, wherein the cooling member body portion includes an opening extending through the body portion and wherein the opening is aligned with an air flow path through the air passageway.
- 5. The assembly of claim 1, wherein the cooling member includes a body portion that has an exterior surface that is knurled.
- 6. The assembly of claim 1, wherein the cooling member is at least partially received into a portion of the housing.
- 7. The assembly of claim 1, wherein the electronics module includes a printed circuit board and a connector portion and including a connecting member coupling the connector portion to the cooling member.
- 8. The assembly of claim 7, wherein the connecting member extends through an opening in the connector portion and through a portion of the housing such that the connecting member secures the printed circuit board to the housing.
- 9. The assembly of claim 1, wherein the cooling member extends across the entire air passageway.
- 10. The assembly of claim 1, wherein the cooling member only extends across a portion of the air passageway.
- 11. A method of controlling a temperature of an electronics module in a noise attenuation device that is used in a vehicle air intake system, comprising the steps of:
forming a housing that at least partially defines an air passageway; supporting a cooling member on a portion of the housing at least partially within the air passageway; and coupling the cooling member with the electronics module to thereby allow heat in the electronics module to be dissipated by the cooling member.
- 12. The method of claim 11, including hot pressing at least a portion of the cooling member into a portion of the housing.
- 13. The method of claim 11, wherein the electronics module comprises a printed circuit board and including securing the printed circuit board to the housing and coupling the printed circuit board to the cooling member using a single connecting member.
- 14. The method of claim 13, including securing the cooling member to the housing, placing the circuit board into a desired position and then inserting the connecting member through a portion of the circuit board and the portion of the housing until the connecting member couples the portion of the circuit board to the cooling member.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Provisional Application No. 60/209,752, which was filed on Jun. 6, 2000.
Provisional Applications (1)
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Number |
Date |
Country |
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60209752 |
Jun 2000 |
US |