The present application claims priority from Japanese Patent Application No. 2016-189995, which was filed on Sep. 28, 2016, the disclosure of which is herein incorporated by reference in its entirety.
The following disclosure relates to an actuator device, a connection structure of a wire member, a liquid ejector, and a method of manufacturing the actuator device.
There is known a liquid ejector including: a passage definer having pressure chambers respectively communicating with nozzles; and a piezoelectric actuator configured to apply ejection energy to ink in the pressure chambers.
The piezoelectric actuator includes piezoelectric elements respectively corresponding to the pressure chambers. Contacts are respectively drawn out from individual electrodes of the respective piezoelectric elements. A flexible wire member (a COD on which drive circuits are mounted) is joined to a portion of the piezoelectric actuator at which the contacts of the piezoelectric elements are arranged. The contacts of the piezoelectric actuator and the contacts of the wire member are electrically connected to each other at this joint portion.
Common flexible wire members are configured such that a multiplicity of wires are patterned on an insulated substrate (e.g., base film) formed of polyimide, for example. Some manufactures of the wire members include a step of cutting the substrate so as to separate each wire after the wires are formed on the substrate. In this case, the wires may be crushed at an area where the substrate is cut, so that the wires may respectively have wide portions having a larger wire width at an edge portion of the substrate formed by cutting.
In the case where the wide portions of the wires are formed at the edge portion of the substrate, the larger wire width reduces a distance between the wire and another adjacent wire or a conductive pattern. This reduced distance increases a possibility of occurrence of shorts between the wire having the wide portion and another adjacent wire when the edge portion of the substrate is joined to the actuator.
Accordingly, an aspect of the disclosure relates to a technique for preventing occurrences of shorts between (i) a wire having a wide portion at an edge portion of a wire member and (ii) another wire or the like located adjacent to the wire having the wide portion.
In one aspect of the disclosure, an actuator device includes: an actuator including at least one drive element and at least one first element contact respectively drawn from the at least one drive element; and a wire member including (a) at least one first contact respectively connected to the at least one first element contact and (b) at least one first wire configured to respectively conduct with the at least one first contact. Each of the at least one first wire includes a distal end portion disposed at an edge portion of the wire member. A first wide portion is formed at the distal end portion. The first wide portion has a wire width greater than that of a portion of said each of the at least one first wire other than the distal end portion thereof. The first wide portion of each of the at least one first wire is disposed beyond a corresponding one of the at least one first element contact in a wire direction in which said each of the at least one first wire extends, in a state in which the actuator and the wire member are joined to each other. Each of the at least one first contact is disposed at a basal end portion of a corresponding one of the at least one first wire. The basal end portion is located further from the edge portion of the wire member than the first wide portion. Each of the at least one first contact is connected to a corresponding one of the at least one first element contact.
Another aspect of the disclosure relates to a connection structure of a wire member configured to connect at least one first element contact and at least one first contact to each other. The at least one first contact is configured to respectively conduct with at least one first wire of the wire member. Each of the at least one first wire includes a distal end portion disposed at an edge portion of the wire member. A first wide portion is formed at the distal end portion. The first wide portion has a wire width greater than that of a portion of said each of the at least one first wire other than the distal end portion thereof. The first wide portion of each of the at least one first wire is disposed beyond a corresponding one of the at least one first element contact in a wire direction in which said each of the at least one first wire extends, in a state in which the at least one first element contact and the at least one first contact are respectively joined to each other. Each of the at least one first contact is disposed at a basal end portion of a corresponding one of the at least one first wire. The basal end portion is located further from the edge portion of the wire member than the first wide portion. Each of the at least one first contact is connected to a corresponding one of the at least one first element contact.
In another aspect of the disclosure, a liquid ejector includes: a passage definer defining therein at least one pressure chamber; an actuator including (i) at least one piezoelectric element disposed on the passage definer so as to overlap the at least one pressure chamber and (ii) at least one first element contact drawn from the at least one piezoelectric element; and a wire member including (a) at least one first contact respectively connected to the at least one first element contact and (b) at least one first wire configured to respectively conduct with the at least one first contact. Each of the at least one first wire includes a distal end portion disposed at an edge portion of the wire member. A first wide portion is formed at the distal end portion. The first wide portion has a wire width greater than that of a portion of said each of the at least one first wire other than the distal end portion thereof. The first wide portion of each of the at least one first wire is disposed beyond a corresponding one of the at least one first element contact in a wire direction in which said each of the at least one first wire extends, in a state in which the actuator and the wire member are joined to each other. Each of the at least one first contact is disposed at a basal end portion of a corresponding one of the at least one first wire. The basal end portion is located further from the edge portion of the wire member than the first wide portion. Each of the at least one first contact is connected to a corresponding one of the at least one first element contact.
In another aspect of the disclosure, a method of manufacturing an actuator device includes: a wire forming step of forming at least one first wire and at least one test contact on a base of a wire member, the at least one test contact being respectively connected to the at least one first wire; a testing step of performing a conduction test of the at least one first wire using the at least one test contact; a cutting step of cutting the base along an area between the at least one first wire and the at least one test contact after the testing step; and a joining step of joining the wire member to the actuator in a state in which a portion of each of the at least one first wire which is further from a cut edge of the base than a first wide portion formed in the cutting step overlaps the at least one first element contact of the actuator.
The objects, features, advantages, and technical and industrial significance of the present disclosure will be better understood by reading the following detailed description of the embodiment, when considered in connection with the accompanying drawings, in which:
Hereinafter, there will be described an embodiment by reference to the drawings. First, there will be explained an overall configuration of an ink-jet printer 1 with reference to
As illustrated in
The carriage 3 is mounted on guide rails 10, 11 extending in the right and left direction (hereinafter may also be referred to as “scanning direction”). The carriage 3 is joined to a carriage driving motor 15 via an endless belt 14. The carriage 3 is driven by the motor 15 and reciprocated in the scanning direction over the recording sheet 100 conveyed on a platen 2.
The ink-jet head 4 is mounted on the carriage 3. Inks of four colors, namely, black, yellow, cyan, and magenta, are supplied to the ink-jet head 4 respectively via tubes, not illustrated, from four ink cartridges 17 held by a holder 7. While moving in the scanning direction with the carriage 3, the ink-jet head 4 ejects the inks from a multiplicity of nozzles 24 (see
The conveying mechanism 5 includes two conveying rollers 18, 19 configured to convey the recording sheet 100 on the platen 2 in the front direction (hereinafter may also be referred to as “conveying direction”).
The controller 6 controls devices including the ink-jet head 4 and the carriage driving motor 15 to print an image on the recording sheet 100 based on a print instruction received from an external device such as a personal computer (PC).
There will be next explained a configuration of the ink-jet head 4 with reference to
In the present embodiment, the ink-jet head 4 ejects the inks of the four colors (black, yellow, cyan, and magenta). As illustrated in
The nozzle plate 20 is formed of silicon, for example. The nozzle plate 20 has the nozzles 24 arranged in the conveying direction.
More specifically, as illustrated in
In the following explanation, one of suffixes k, y, c, and m may be selectively added to the reference numbers of components of the ink-jet head 4 to indicate their respective correspondences with one of the black, yellow, cyan, and magenta inks. For example, the wording “nozzle groups 27k” indicates the nozzle group 27 for the black ink.
The passage definer 21 is a base plate formed of silicon single crystal. As illustrated in
A vibration layer 30 of the piezoelectric actuator 22, which will be described below, is disposed on an upper surface of the passage definer 21 so as to cover the pressure chambers 26. The vibration layer 30 is not limited in particular as long as the vibration layer 30 is an insulating layer covering the pressure chambers 26. In the present embodiment, the vibration layer 30 is formed by oxidation or nitriding of a surface of the base plate formed of silicon. The vibration layer 30 has ink supply holes 30a at areas each covering an end portion of a corresponding one of the pressure chambers 26 in the scanning direction (which end portion is located on an opposite side of the pressure chamber 26 from the nozzle 24).
For each ink color, the ink is supplied from a corresponding one of four reservoirs 23b formed in the protector 23, which will be described below, to the pressure chambers 26 through the respective ink supply holes 30a. When ejection energy is applied to the ink in each of the pressure chambers 26 by a corresponding one of piezoelectric elements 31 of the piezoelectric actuator 22 which will be described below, an ink droplet is ejected from the nozzle 24 communicating with the pressure chamber 26.
The actuator device 25 is disposed on the upper surface of the passage definer 21. The actuator device 25 includes: the piezoelectric actuator 22 including the piezoelectric elements 31; the protector 23; and the two COFs 50.
The piezoelectric actuator 22 is disposed on the entire upper surface of the passage definer 21. As illustrated in
The protector 23 is disposed on an upper surface of the piezoelectric actuator 22 so as to cover the piezoelectric elements 31. Specifically, the protector 23 includes eight recessed protecting portions 23a respectively covering the eight piezoelectric element rows 38. As illustrated in
Each of the COFs 50 illustrated in
The piezoelectric actuator 22 includes: the vibration layer 30 formed on the upper surface of the passage definer 21; and the piezoelectric elements 31 disposed on an upper surface of the vibration layer 30. For simplicity,
As illustrated in
Each of the piezoelectric elements 31 includes a first electrode 32, a piezoelectric layer 33, and a second electrode 34 disposed in this order from a lower side over the vibration layer 30.
As illustrated in
The piezoelectric layer 33 is formed of a piezoelectric material such as lead zirconate titanate (PZT), for example. The piezoelectric layer 33 may be formed of a non-lead piezoelectric material not containing lead. The thickness of the piezoelectric layer 33 is ranged between 1.0 μm and 2.0 μm, for example.
As illustrated in
The second electrodes 34 are disposed on upper surfaces of the respective piezoelectric layers 33. Each of the second electrodes 34 has a rectangular shape in plan view which is one size smaller than each of the pressure chambers 26. The second electrodes 34 respectively overlap central portions of the respective pressure chambers 26. Unlike the first electrodes 32, the second electrodes 34 of the respective piezoelectric elements 31 are separated and spaced apart from each other. That is, the second electrodes 34 are individual electrodes provided for individually for the respective piezoelectric elements 31. The second electrodes 34 are formed of iridium (Ir) or platinum (Pt), for example. The thickness of each of the second electrodes 34 is 0.1 μm, for example.
As illustrated in
As illustrated in
The insulating layer 41 is formed on an upper side of the protecting layer 40. A material of the insulating layer 41 is not limited in particular. For example, the insulating layer 41 is formed of silicon dioxide (SiO2). This insulating layer 41 is provided for increasing insulation between the common electrode 36 and the driving wires 42 connected to the respective second electrodes 34.
The driving wires 42 are formed on the insulating layer 41. The driving wires 42 are drawn out from the respective second electrodes 34 of the piezoelectric elements 31. Each of the driving wires 42 is formed of aluminum (Al), for example. As illustrated in
Each of the driving wires 42 corresponding to the respective piezoelectric elements 31 extends rightward or leftward. Specifically, as illustrated in
Each of the driving contacts 46 is provided on an end portion of a corresponding one of the driving wires 42, which end portion is located on an opposite side of the driving wire 42 from its portion on which the second electrode 34 is disposed. The driving contacts 46 are arranged in a row in the conveying direction at each of a right end portion and a left end portion of the piezoelectric actuator 22. In the present embodiment, the nozzles 24 forming the nozzle group 27 of each color are arranged at intervals of 600 dpi (=42 μm). Also, each of the driving wires 42 extends rightward or leftward from the piezoelectric element 31 corresponding to the nozzle groups 27 associated with corresponding two colors. Accordingly, at each of the right end portion and the left end portion of the piezoelectric actuator 22, the driving contacts 46 are arranged at very short intervals of a half of those of the nozzles 24 of each nozzle group 27, that is, the driving contacts 46 are arranged at the intervals of about 21 μm.
The two ground contacts 47 are respectively disposed in front of and at a rear of the driving contacts 46 arranged in a row in the front and rear direction. Each of the ground contacts 47 has a larger contacting area than each of the driving contacts 46. Each of the ground contacts 47 is connected to the common electrode 36 via a corresponding one of conductive portions 65 (see
The driving contacts 46 and the ground contacts 47 disposed on the right end portion and the left end portion of the piezoelectric actuator 22 are exposed from the protector 23. The two COFs 50 are respectively joined to the right end portion and the left end portion of the piezoelectric actuator 22. Each of the driving contacts 46 is connected to a corresponding one of the driver ICs 51 via a corresponding one of the individual wires 52 of the COFs 50. A drive signal is supplied from the driver IC 51 to the driving contacts 46. Each of the ground contacts 47 is connected to a corresponding one of the ground wires 53 of the COFs 50. A ground potential is applied from the ground wire 53 to the ground contact 47. Joint portions of the piezoelectric actuator 22 and the COFs 50 will be explained later in detail.
As illustrated in
As illustrated in
There will be next explained a detailed construction of the joint portion of the piezoelectric actuator 22 and each of the COFs 50 with reference to
As described above, the driving contacts 46 and the two ground contacts 47 are provided at each of the right and left end portions of the piezoelectric actuator 22. The driving contacts 46 are drawn out from the second electrodes 34 of the respective piezoelectric elements 31 and arranged in the front and rear direction. The two ground contacts 47 are disposed respectively on opposite sides of the driving contacts 46 in the front and rear direction. Each of the COFs 50 is joined to the corresponding end portion of the piezoelectric actuator 22 with a conductive adhesive 60.
The conductive adhesive 60 is formed by mixing conductive particles into thermosetting resin such as epoxy resin. The conductive adhesive 60 is generally used in the form of a film or a paste. One example of the film is an anisotropic conductive film (ACF), and one example of the paste is an anisotropic conductive paste (ACP). The driving contacts 46 and the ground contacts 47 of the piezoelectric actuator 22 are respectively connected to the individual contacts 54 and the ground contact 55 provided on the COFs 50 by the conductive particles of the conductive adhesive 60.
First, the configuration of the contacts of the piezoelectric actuator 22 will be described. As illustrated in
Base layers 64 are disposed on the insulating layer 41 at positions located on an outer side of the driving contacts 46. Each of the base layers 64 is formed of the same material as the driving wires 42. For example, each base layer 64 is formed of aluminum (Al). Each base layer 64 is connected to the common electrode 36 via a corresponding one of the conductive portions 65 which extends through the protecting layer 40 and the insulating layer 41 located just under the base layer 64. The ground contacts 47 are formed on the respective base layers 64. Each of the ground contacts 47 is formed of the same material as the driving contacts 46. For example, each ground contact 47 is formed of gold (Au). More specifically, each of the ground contacts 47 includes: three small contacts 68 spaced apart from each other in the front and rear direction; and a connecting portion 69 connecting left end portions (in
As illustrated in
The configuration of the wires provided on the COF 50 will be described next. As illustrated in
At each of the right and left end portions of the piezoelectric actuator 22, two dummy wires 58 each extending along the wires 52, 53 are disposed between the ground wire 53 and the individual wires 52. The dummy wires 58 are independent wires not connected to any of the individual wires 52 and the ground wire 53. The dummy wires 58 prevent shorts between the ground wire 53 connected to the first electrodes 32 and the individual wires 52 connected to the respective second electrodes 34. The wire width of each of the dummy wires 58 is the same as that of each of the individual wires 52.
As illustrated in
As illustrated in
As illustrated in
As illustrated in
The width of each ground contact 55 of the COF 50 in the front and rear direction, in particular, the width of the wide portion 62 is larger than that of each of the small contacts 68 of the ground contact 47 of the piezoelectric actuator 22. The wide portion 62 of the ground contact 55 is disposed over the three small contacts 68 of the ground contact 47.
Like the wide portions 61 of the respective individual wires 52, as illustrated in
The contacts 46, 47 of the piezoelectric actuator 22 and the contacts 54, 55 of the COF 50 are electrically connected to each other via the conductive particles contained in the conductive adhesive 60. Thermosetting resin, which is a main component of the conductive adhesive 60, has flowed out to areas around these contacts. Hardening of the thermosetting resin mechanically joins the piezoelectric actuator 22 and the base 56 of the COF 50 to each other.
The density of the conductive particles of the conductive adhesive 60 around the contacts is considerably lower than that of the conductive particles of the conductive adhesive 60 between the contact 46 and the contact 54 and between the contact 47 and the contact 55. In other words, when the conductive adhesive 60 is compressed between each of the contacts 46, 47 of the piezoelectric actuator 22 and a corresponding one of the contacts 54, 55 of the COF 50, the thermosetting resin as the main component of the conductive adhesive 60 flows out to the area around the contacts in advance of the conductive particles, resulting in increase in the density of the conductive particles between the contacts. In
In the present embodiment as described above, the wide portions 61, 62, 63 are respectively formed at the distal end portions of the respective wires 52, 53, 58 which are located at the edge portion 70 of the COF 50. In this construction, each of the individual wires 52 arranged by a short distance has a long wire width at the wide portion 61. Accordingly, the distance between the individual wires 52 is short at the edge E. Thus, if the individual wire 52 is connected to the driving contact 46 of the piezoelectric actuator 22 at the wide portion 61, shorts occur with a higher possibility between the individual wires 52 next to each other or between the individual wire 52 and the driving contact 46 to be connected to another individual wire 52.
For example, when the COF 50 is joined to the piezoelectric actuator 22, even slight misalignment of a position of the COF 50 with respect to the piezoelectric actuator 22 may cause shorts between the individual wire 52 and the driving contact 46 that is located next to the individual wire 52 and that is not intended to be connected thereto. Also, in the case where the COF 50 is joined to the driving contact 46 with the conductive adhesive 60 as in the present embodiment, and the conductive particles of the conductive adhesive 60 has flowed out to the area around the driving contact 46, a possibility of occurrence of shorts increases with decrease in the distance between the individual wires 52 next to each other.
In the present embodiment, however, the wide portion 61 of each of the individual wires 52 of the COF 50 is disposed beyond the corresponding driving contact 46 so as to protrude from the driving contacts 46 in the longitudinal direction of the individual wire 52. In other words, the wide portion 61 is located nearer to the edge E of the COF 50, which edge E is connected to the piezoelectric actuator 22, than the driving contact 46 in the right and left direction. The individual contacts 54 to be connected to the respective driving contacts 46 are located nearer to the basal ends of the respective individual wires 52 than the respective wide portions 61. That is, the width of a portion of the individual wire 52 which is connected to the driving contact 46 is less than that of the wide portion 61. Accordingly, a distance between (i) each of the individual wires 52 and (ii) another individual wire 52 or the driving contact 46 disposed next to said each of the individual wires 52 is not large, thereby preventing shorts.
From the viewpoint of more reliably preventing shorts, a distance L between the driving contact 46 and a distal end of the wide portion 61, i.e., an amount of protrusion (protruding amount) of the individual wire 52 from the driving contact 46 is preferably greater than or equal to twice the width W of the individual wire 52. However, if the protruding amount (the distance L) is too large, a large area is required for a portion of the piezoelectric actuator 22 which is joined to the COF 50, leading to increase in size of the piezoelectric actuator 22. From this viewpoint, the distance L is preferably less than or equal to twenty times the width W of the individual wire 52.
As illustrated in
The ground contact 47 and the ground contact 55 are connected to the common electrode 36. Since a large amount of current flows in the common electrode 36 when many piezoelectric elements 31 are driven at the same time, a resistance of paths connected to the common electrode 36 needs to be small in order to prevent a drop in voltage. From this viewpoint, the resistance between the ground contact 47 and the ground contact 55 at the joint portion therebetween is preferably small.
In this regard, the ground contact 55 of the COF 50 includes the wide portion 62 of the ground wire 53 in the present embodiment. The ground contact 47 of the piezoelectric actuator 22 is disposed nearer to the edge E of the COF 50 than the driving contact 46. With this construction, the ground contact 47 is connected to the ground contact 55 including the wide portion 62. This connection reduces the resistance at the joint portion of the ground contact 47 and the ground contact 55.
As illustrated in
In the present embodiment, as illustrated in
As illustrated in
There will be next explained manufacturing of the ink-jet head 4, focusing mainly on a step of producing the COF 50 of the actuator device 25 and on a step of joining the COF 50 to the piezoelectric actuator 22.
There will be explained the step of producing the COF 50 with reference to
After the wire pattern is formed on the base 56, the insulating layer 57 in the form of the solder resist is formed substantially the entire surface of the base 56 except an area on which distal end portions of the wires 52, 53, 58 and the test contacts 71, 72, 73 are disposed. Also, the driver IC 51 is mounted on the base 56.
A Probe, not illustrated, is brought into contact with the test contacts 71, 72, 73 to perform conduction tests for the respective wires 52, 53, 58. It is noted that the dummy wires 58 are independent wires not connected to the driver ICs 51 or the ground, but, like the individual wires 52 and the ground wires 53, the conduction tests are performed for the respective dummy wires 58 for checking that the dummy wire 58 does not conduct with the individual wire 52 or the ground wire 53 disposed next to the dummy wires 58.
After the completion of the conduction tests, the test contacts 71, 72, 73 are no longer needed. Thus, as illustrated in
The COF 50 manufactured in the above-described steps are then joined to the piezoelectric actuator 22. In this joining step, the conductive adhesive 60 (ACF or ACP) is first applied to the individual wires 52 and the ground wires 53 exposed from the insulating layer 57 at the edge portion 70 of the COF 50.
In the joining using the conductive adhesive 60, as described above, in the case where the conductive particles contained in the adhesive 60 have flowed out to the areas around the contacts with the thermosetting resin, unnecessary conductions (shorts) may be caused at positions different from conduction-required positions. In the present embodiment, to solve this problem, the conductive adhesive 60 is applied not to the entire area of the base 56 which is exposed from the insulating layer 57 but mainly to an area on which conduction is required. For example, as illustrated in
As illustrated in
This pressing of the heater plate 67 heats and compresses the conductive adhesive 60 between the piezoelectric actuator 22 and the COF 50. During this operation, the thermosetting resin contained in the adhesive 60 flows out to the areas around the contacts at the areas between each driving contact 46 and the corresponding individual contact 54 and between each ground contact 47 and the corresponding ground contact 55, whereby the contacts conduct with each other by the conductive particles. Furthermore, the thermosetting resin having flowed out to the areas around the contacts are hardened, so that the piezoelectric actuator 22 and the COF 50 are mechanically joined to each other.
It is noted that the conductive adhesive 60 is not applied to the wide portions 61 of the individual wires 52 and the wide portions 63 of the dummy wires 58 before the joining as illustrated in
In the embodiment described above, the ink-jet head 4 is one example of a liquid ejector. The piezoelectric actuator 22 is one example of an actuator. The front and rear direction (the conveying direction) is one example of a first direction. The right and left direction (the scanning direction) is one example of a second direction. The right and left direction (the scanning direction) coincides with a direction in which each of the wires 52, 53, 58 on the COF 50 extends, and the right and left direction (the scanning direction) is one example of the wire direction.
Each of the COFs 50 is one example of a wire member. Each of the driver ICs 51 is one example of a drive circuit. Each of the individual contacts 54 of the COFs 50 is one example of a first contact. Each of the individual wires 52 is one example of a first wire. Each of the wide portions 61 is one example of a first wide portion. Each of the ground contacts 55 of the COFs 50 is one example of a second contact. Each of the ground wires 53 is one example of a second wire. Each of the wide portions 62 is one example of a second wide portion. Each of the dummy wires 58 is one example of a third wire. Each of the wide portions 63 is one example of a third wide portion. Each of the driving contacts 46 of the piezoelectric actuator 22 is one example of a first element contact. Each of the three small contacts 68 of the ground contact 47 is one example of a second element contact.
There will be next explained modifications of the embodiment. It is noted that the same reference numerals as used in the above-described embodiment are used to designate the corresponding elements of the modifications, and an explanation of which is dispensed with.
In the above-described embodiment, each of the ground contacts 47 of the piezoelectric actuator 22 includes the plurality of small contacts 68 (see
As illustrated in
In
The construction in
In the above-described embodiment, as illustrated in
In another modification, as illustrated in
In the above-described embodiment, the piezoelectric actuator 22 and the COF 50 are joined to each other with the conductive adhesive 60 (ACF or ACP). In another modification, as illustrated in
In another modification, the wide portions of the wires of the COF may not covered with the adhesive used for joining of the COF. For example, as illustrated in
As illustrated in
It is noted that the wire protecting layer 43F may cover the base layer 64 on which the ground contact 47 is disposed as illustrated in
The arrangement of the driving contacts and the ground contacts in one ink-jet head is not limited to the arrangement in the above-described embodiment (see
The ink-jet head 4 in the above-described embodiment is a serial head configured to eject the ink while moving in the widthwise direction of the recording sheet 100. However, the present disclosure may be applied to a line head having nozzles arranged in the widthwise direction of the sheet.
While the present disclosure is applied to the ink-jet head configured to eject the ink onto the recording sheet to record an image in the above-described embodiment, the present disclosure may be applied to actuator devices used for purposes other than liquid ejection. Also, the actuator is not limited to the piezoelectric actuator including a plurality of piezoelectric elements. For example, the actuator may be an actuator including a heater as a drive element which causes driving by utilizing a heat generated when a current passes through the heater.
Number | Date | Country | Kind |
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2016-189995 | Sep 2016 | JP | national |