Patent Application
20140370727
The present disclosure relates generally to electrical adapters and methods related to such adapters. More particularly, the present disclosure pertains to adapters for packaged integrated circuit devices, e.g., ball grid array packages.
Certain types of integrated circuit packages are becoming increasingly popular due to their occupancy area efficiency. In other words, they occupy less area on a target board on which they are mounted while providing a high density of contact terminals. For example, one such high density package type is a ball grid array package (e.g., a micro ball grid array package). Generally, such packages contain an integrated circuit having its die bond pads electrically connected to respective conductive contact elements (e.g., spheres/balls) that are distributed on a surface of the package (e.g., the bottom surface of the package, for example, in an array).
A target printed circuit board upon which the package is to be mounted typically has formed on its surface a corresponding array of conductive pads which are aligned with the conductive contact elements of the packaged device for electrically mounting the package on the target board. The target board typically includes other conductive traces and elements which lead from the array of conductive pads used for mounting the package to other circuitry on the board for connecting various components mounted thereon. To mount such a package to a target board, for example, the package may be positioned with the contact elements thereof adjacent to the corresponding array of conductive pads on the target board and, for example, the resulting structure may be heated until solder melts and fuses the contact elements of the package to the conductive pads of the target board.
Such area efficient packaging, e.g., micro ball grid array packages, provides a high density of terminals at a very low cost. Also, this packaging provides for limited lead lengths (e.g., short leads). The limited lead lengths may reduce the risk of damage to such leads of the package, may provide for higher speed product, etc.
Generally, circuit boards and/or components mounted thereon are tested by designers as the circuit boards are being developed. For example, for a designer to test a circuit board and/or a package mounted thereon, the designer must first electrically connect the package to the target circuit board.
As described herein, this may include mounting the package on the target board and heating to fuse the contact elements of the package to the conductive pads of the target board. Therefore, the package may be prevented from being used again. It is desirable for various reasons to use package adapters for mounting the packages and reuse such packages after testing. For example, such device packages may be relatively expensive. Further, for example, once attached, the contacts may not be accessible for testing. In addition, it is often difficult to rework the circuit board with the packages soldered thereon.
Various adapters are available to electrically connect a package to a target printed circuit board without requiring that the contact elements on the package be fused to the target board. However, the high density of terminals for certain packages, e.g., micro ball grid array packages, leads to various interconnect problems for adapters being used with such packages. For example, alignment of the contact elements of the packaged device to the contact pads of the target board may be problematic when an electrical adapter is used. Further, providing effective contact with minimal adaptive structure may be difficult. Various adapters have been described for electrically connecting high density packaged devices to a target printed circuit board, such as, for example, U.S. Pat. No. 6,877,993 to Palaniappa et al., issued 12 Apr. 2005, entitled “Packaged Device Adapter Assembly with Alignment Structure and Methods Regarding Same,” and U.S. Pat. No. 6,394,820 to Palaniappa et al., issued 28 May 2002, entitled “Packaged Device Adapter Assembly and Mounting Apparatus,” describe adapter apparatus that use a conductive elastomer layer to provide electrical contact.
The disclosure herein provides packaged device adapter assemblies useable for high density integrated circuit packages, e.g., micro ball grid array packages, etc.
One exemplary adapter apparatus disclosed herein for receiving a packaged device having a plurality of contact elements disposed on a surface thereof may include a conductive elastomer interconnect. The conductive elastomer interconnect may include a carrier having a plurality of openings defined therethrough from a first side to a second side thereof (e.g., the plurality of openings may be arranged to align with the plurality of contact elements of the packaged device) and conductive elastomer suspended in each of the plurality of openings to contact a contact element of a plurality of contact elements of a packaged device when positioned adjacent the second side of the carrier. Further, the adapter apparatus may include one or more adapter wall members along an adapter axis between a first end region of the adapter apparatus and a second end region of the adapter apparatus. The conductive elastomer interconnect may be positioned at the first end region of the adapter apparatus orthogonal to the adapter axis and the one or more adapter wall members and the conductive elastomer interconnect may define a socket cavity adapted to receive the packaged device with the plurality of contact elements thereof adjacent the conductive elastomer suspended in each of the plurality of openings.
Another exemplary adapter apparatus for use in an adapter configured to receive a packaged device having a plurality of contact elements disposed on a surface thereof may include a conductive elastomer interconnect that includes a carrier having a plurality of openings defined therethrough from a first side to a second side thereof (e.g., the plurality of openings are arranged to align with the plurality of contact elements of the packaged device) and conductive elastomer suspended in each of the plurality of openings to contact a contact element of a plurality of contact elements of a packaged device when positioned adjacent the second side of the carrier.
One or more embodiments of such adapter apparatus may include one or more of the following features: the first and second sides of the carrier may be free of conductive elastomer; the packaged device may include a ball grid array having a plurality of balls; each opening of the plurality of openings defined through the carrier may be a cylindrical opening having a diameter sized to receive a ball of the plurality of balls of the ball grid array; the conductive elastomer suspended in each of the plurality of openings may include a curable conductive elastomer material (e.g., a curable conductive elastomer material that includes a plurality of conductive particles); the conductive elastomer suspended in each of the plurality of openings may include a concave surface at the second side of the carrier for electrical contact with the contact elements of the packaged device; the conductive elastomer suspended in each of the plurality of openings may include a contact projection extending beyond the first side of the carrier for electrical contact with a contact pad of a plurality of contact pads of a target board when the target board is positioned adjacent the first side of the carrier; the one or more wall members may include alignment structure positioned at the first end region to align the packaged device within the socket cavity (e.g., the alignment structure may include at least an alignment plate positioned orthogonal to the adapter axis; the alignment plate may include a plurality of openings arranged to align with the plurality of contact elements of the packaged device and adapted to allow contact elements of the packaged device to be in electrical contact with the conductive elastomer suspended in each of the plurality of openings defined in the carrier layer, etc.); and an actuator apparatus including a floating member movable in the socket cavity and an actuator element (e.g., the actuator element may be operable to provide a force on the floating member resulting in a corresponding force being distributed to the packaged device when received in the socket cavity such that the plurality of contact elements are in electrical contact with the suspended conductive elastomer in each of the plurality of openings defined in the carrier, the suspended conductive elastomer in each of the plurality of openings defined in the carrier may be flexed towards the first side of the carrier when the force is applied, etc.).
One exemplary embodiment of a method of providing an adapter apparatus adapted to receive a packaged device having a plurality of contact elements disposed on a surface thereof (e.g., the adapter apparatus mountable to a target board to electrically connect the plurality of contact elements to a plurality of contact pads of the target board) may include providing a conductive elastomer interconnect such as described herein including, for example, a carrier and conductive elastomer suspended in each of a plurality of openings defined therethrough. The method may further include providing one or more adapter wall members along an adapter axis between a first end region and a second end region of the adapter apparatus and positioning the conductive elastomer interconnect at the first end region of the adapter apparatus orthogonal to the adapter axis to define a socket cavity of the adapter apparatus adapted to receive a packaged device such that the plurality of contact elements of the packaged device are adjacent the conductive elastomer suspended in each of the plurality of openings.
In one embodiment of the exemplary method, providing a conductive elastomer interconnect may include positioning the first side of the carrier adjacent a formation surface to close the plurality of openings defined through the carrier, providing conductive elastomer at least within the plurality of openings defined through the carrier, and curing the conductive elastomer within the plurality of openings to provide the suspended conductive elastomer in each of the plurality of openings. For example, the formation surface may be a planar surface or a nonplanar surface (e.g., a formation surface having at least one surface deformation defined therein corresponding to each of the plurality of openings defined through the carrier, wherein the at least one surface deformation forms a contact projection of the suspended conductive elastomer extending beyond the first side of the carrier for electrical contact with a contact pad of a plurality of contact pads of a target board when the target board is positioned adjacent the first side of the carrier).
In another embodiment of the exemplary method, the method may further include providing an actuator apparatus that includes a floating member movable in the socket cavity and an actuator element (e.g., the actuator element may be operable to provide a force on the floating member such that a corresponding force is distributed to a packaged device when received in the socket cavity) and providing electrical contact between the plurality of contact elements of the packaged device and the suspended conductive elastomer in each of the plurality of openings defined in the carrier via the force provided on the floating member (e.g., the suspended conductive elastomer in each of the plurality of openings defined in the carrier may be flexed towards the first side of the carrier when the force is applied).
The above summary of the present disclosure is not intended to describe each embodiment or every implementation thereof. Advantages, together with a more complete understanding of the disclosure, will become apparent and appreciated by referring to the following detailed description and claims taken in conjunction with the accompanying drawings.
In the following detailed description of illustrative embodiments, reference is made to the accompanying figures of the drawing which form a part hereof, and in which are shown, by way of illustration, specific embodiments which may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from (e.g., still falling within) the scope of the disclosure presented hereby.
Generally, packaged device adapter assemblies for use with packaged devices, e.g., high density devices, such as ball grid array packages, along with methods of using and forming such assemblies or portions thereof, shall be described herein. An illustrative packaged device adapter assembly 10 according to the present invention shall be described with reference to illustrative
In other words, exemplary adapter apparatus and methods for providing and using such adapters shall generally be described with reference to
The packaged device adapter assembly 10 further includes a conductive elastomer interconnect 30. In at least one embodiment, the conductive elastomer interconnect 30 includes a carrier 31 including a plurality of openings 33 defined therethrough from a first side 131 to a second side 133 thereof. The plurality of openings 33 are arranged to align with a plurality of contact elements 86 of the packaged device 80. In one or more embodiments, conductive elastomer 35 may be suspended in each of the plurality of openings 33 to contact a contact element of the plurality of contact elements 86 of the packaged device 80 when the packaged device 80 is positioned adjacent the second side 133 of the carrier 31.
The one or more wall members 12 (e.g., various structure along the adapter axis 13 between the first end region 14 and second end region 16 of the adapter assembly 10) and the conductive elastomer interconnect 30 (e.g., positioned at the first end region 14 of the adapter assembly 10 orthogonal to the adapter axis 13) may define a socket cavity 15 sized or otherwise configured to receive the packaged device 80. The socket cavity 15 is adapted to receive the packaged device 80 with each contact element of the plurality of contact elements 86 adjacent a corresponding conductive elastomer 35 suspended in an opening of the plurality of openings 33.
In one or more embodiments, for example, as shown in
The packaged device 80 may be any packaged device having a plurality of contact elements 86 disposed on a surface thereof suitable for electrical connection with conductive elastomer 35 suspended within the plurality of openings 33 of the conductive elastomer interconnect 30. In one or more embodiments, the packaged device may be a device having a high density of contact terminals, e.g., lands, solder spheres, bumps, contact pads, leads, etc., disposed on a surface thereof. For example, the high density packaged device may be a micro lead frame package, a micro lead chip carrier, a quad flat no lead package, a micro ball grid array package, or any other type of package such as a ball grid array package, a chip scale package, a flip chip package, a flat package, a quad flat package, a small outline package, a land grid array package, or any other package having contact elements disposed on a surface thereof suitable for electrical connection with conductive elastomer 35 suspended within the plurality of openings 33 of the conductive elastomer interconnect 30.
In at least one embodiment, the packaged device 80 includes a ball grid array package device having contact elements 86 in the form of spheres or balls on the lower surface 84. However, adapter assemblies and adapter concepts described herein may be used with any other packaged device having contact elements disposed on a surface thereof which would benefit from the use of the conductive elastomer interconnect 30. Further, any number of different sizes and/or configurations of packaged devices may benefit from features described herein (e.g., packaged devices with only one planar surface having contact elements disposed thereon, packaged devices having upper and lower surfaces that are parallel to one another, packaged devices having upper and lower surfaces that are not parallel to one another, etc.).
Further, the packaged device adapter assembly 10 may include a cover member 60 positioned at the second end 16 of the one or more wall members 12 (e.g., adjacent the socket base member 17 along axis 13) to close the socket cavity 15. The cover member 60 may be movable, e.g., removable via fastening devices 69 as shown in
The one or more wall members 12 may include any number of different structures (e.g., along the adapter axis 13) between the first end region 14 and second end region 16 of the adapter assembly 10. For example, the one or more wall members 12 may include a socket base member 17 extending from a first end located towards the first end region 14 of the adapter assembly 10 to a second end location towards the second end region 16. For example, in one or more embodiments, such a socket base member 17 may define an opening therethrough along axis 13 (e.g., providing, at least in part, the inner surface region 18 of adapter assembly 10) to form at least a part of the defined socket cavity 15 sized or otherwise configured to receive the packaged device 80.
Further, for example, the one or more wall members 12 may include one or more types of alignment structure positioned at the first end region 14 (e.g., adjacent the first end of socket base member 17) to align the packaged device 80 within the socket cavity 15. For example, in one or more embodiments, the alignment structure may include an alignment plate 48 positioned orthogonal to the adapter axis 13. For example, the alignment plate 48 may define an opening therethrough along axis 13 (e.g., providing, at least in part, the inner surface region 18 of adapter assembly 10) to form at least a part of the defined socket cavity 15 sized or otherwise configured to receive the packaged device 80. For example, the alignment plate 48 may include an inner surface 49 defining the opening along axis 13 (e.g., the opening being sized to align the packaged device 80 within the socket cavity 15 for effective electrical contact of the plurality of contact elements 86 of the packaged device 80 and the conductive elastomer 35 suspended in each of the plurality of openings 33; each opening 33 of the conductive elastomer interconnect 30 corresponding to a particular contact element 86). Such alignment structure may be of any configuration suitable to provide alignment within the socket cavity 15. For example, alignment structure may include a single surface defining an opening to provide the alignment function or may be as described in U.S. Pat. No. 6,877,993 B2 to Palaniappa et al., issued 12 Apr. 2005, and entitled “Packaged Device Adapter Assembly Alignment Structures and Methods Regarding Same.”
One will recognize that the one or more wall members 12 may use any number of structures to provide an opening into which the packaged device 80 is received. Such structures may take any shape and/or form suitable to provide a socket cavity for receiving the packaged device 80 and the present disclosure is not limited to any particular configuration of such one or more wall members 12 (e.g., not limited to any number and/or shape described herein).
The packaged device adapter assembly 10 further includes actuator apparatus, such as, for example, a floating member 40 (e.g., a compression plate for providing a force on the packaged device 80) as shown in
At least in one embodiment, the floating member 40 includes an upper surface 41 that is generally planar and orthogonal to the adapter axis 13 when the floating member 40 is positioned in the socket cavity 15. Further, at least in one embodiment, the floating member 40 includes a lower surface 42 that is configured as a function of the upper surface 82 of the packaged device 80. For example, as shown in
The actuator element 70 may be any actuator element operable to apply a force on the upper surface 41 of the floating member 40. As a force is applied by the actuator element 70 to the upper surface 41 of the floating member 40, the force is distributed generally equally along the upper surface 82 of the packaged device 80. As such, an equivalent force is provided at each contact element 86, e.g., ball or sphere, for effective contact between each contact element 86 and the suspended conductive elastomer 35 within a corresponding opening of the plurality of openings 33 defined in carrier 31 of the conductive elastomer interconnect 30. Such a distributed force across the entire packaged device 80 reduces the potential application of excessive force on one part of the packaged device 80 versus another part thereof, e.g., the center versus the perimeter.
Generally, in one or more embodiments, the actuator element 70 is an element associated with the cover member 60. For example, the actuator element may be a spring element, a leaf spring, or any other flexible element capable of applying a force to the floating member 40 via the association with the cover member 60. Further, the cover member 60 itself may be used to apply a force to the floating member 40 such as by tightening the cover member directly down on the floating member 40 by fastening elements, e.g., screws.
At least in one embodiment as shown in
With the packaged device 80 in the socket cavity 15, the planer surface 75 is placed in direct contact with the upper surface 41 of the floating member 40 by turning the actuator element 70. As such, the actuator element 70 is adjustable to provide an effective force to the upper surface 41 of floating member 40 such that the distributed force is applied for effective electrical coupling of the contact elements 86 to the suspended conductive elastomer 35 of conductive elastomer interconnect layer 30. With use of the actuator element 70 and the floating member 40, a suitable distributed force on the packaged device 80 can be achieved. The minimized load applied to the packaged device 80 and thus to the conductive elastomer 35 suspended in the openings 33 of the conductive elastomer interconnect 30 allows for operation of the adapter assembly 10 over many insertion cycles as the conductive elastomer interconnect 30 is not unnecessarily damaged by the force applied to the packaged device 80 to achieve contact between all of the contact elements 86 and suspended conductive elastomer 35.
In one or more embodiments, the floating member 40 may be formed of a heat conductive material, e.g., aluminum, to provide heat sinking capability. Further, actuator element 70 and the one or more wall members 12 and cover 60 may be formed of such heat sinking material. In such a manner, the elements that form the socket cavity 15 which provide electrical coupling of the packaged device 80 to a target board 90 also function to dissipate heat away from the packaged device 80 when the packaged device 80 is operable. This is particularly beneficial for high density packaged devices in that such packaged devices tend to operate with greater heat output.
As can be seen from
It will be recognized that various elements or portions of the adapter assembly 10 may be formed of multiple layers or components or as single piece elements. For example, it will be recognized that the one or more wall members 12 may include multiple pieces or it may be formed as a single piece element. Further, for example, the floating member 40 may be formed of one or more layers or components.
The adapter assemblies as described herein may be mounted relative to various target boards as illustrated generally in
The target board 90 may be any substrate including contact pads or other conductive elements arranged thereon for electrical connection with the adapter assembly 10. For example, the target board may be a printed circuit board including various other components mounted thereon or may be a surface mountable substrate (e.g., an interconnect board that may be used with printed circuit boards that do not have mounting holes therein or when it is undesirable to provide mounting holes in the target board 90).
As shown in
It will be recognized that the adapter assemblies as described herein may be mounted relative to various configurations of target boards, including but clearly not limited to those described herein (e.g., a surface mountable board, a printed circuit board, etc.). Further, such mounting of the adapter assemblies relative to such target boards may be accomplished in any manner, including but clearly not limited to those described herein (e.g., adhesive, fastening devices including bolts and nuts, threaded inserts, etc.).
The adapter assembly 10, as shown in
As described herein, the cover member 60 of the packaged device adapter assembly 10 may be configured in various manners. The cover member 60 is used to close the socket cavity 15 and may include various other elements associated therewith for facilitating other functionality. For example, as previously described herein, in one embodiment as shown in
However, in another embodiment, the cover member 60 may also be configured as a latchable hinge cover as shown and described in U.S. Pat. No. 6,394,820, e.g., a ZIF type or clam-type lid. Although several cover members are described herein, the present invention is not limited to only such configurations as various other configurations may provide suitable closure function for the adapter.
Further, with reference to
Further, the carrier 31 may be formed of one or more layers and/or portions of any suitable material. For example, the carrier may be formed of one or more polymers, non-conductive high temperature material that can be exposed to reflow temperatures, etc. Further, for example, the carrier may be formed of Kapton polyimide, cirlex, FR4, etc.
The plurality of openings 33 defined through the carrier 31 are arranged such that each opening aligns with a corresponding contact element 86 (e.g., ball or sphere of a ball grid array) of the packaged device 80. As such, for example, the plurality of openings 33 may be arranged and/or distributed in an array along x and y axes orthogonal to the adapter axis 13 to correspond to contact elements 86 distributed in such a manner or the plurality of openings 33 may be arranged and/or distributed along a region distal from the center of the carrier 31 to correspond to contact elements 86 distributed in such a manner at the perimeter of the package device 80. However, any arrangement of contact elements 86 may be accommodated according to the present disclosure with use of an arrangement of the plurality of openings 33 which are aligned therewith.
Further, in one or more embodiments, each opening of the plurality of openings 33 defined through the carrier 31 is sized for contact with a corresponding contact element 86. For example, where the packaged device 80 includes a ball grid array having a plurality of balls or spheres 86 at the lower surface 84 thereof, each of the plurality of openings 33 defined through the carrier 31 may be a cylindrical opening having a diameter sized to receive a ball/sphere of the packaged device 80. For example, the diameter of such openings 33 may be in the range of about 0.006 inches to about 0.045 inches depending on the pitch of the openings (i.e., the distance between adjacent openings). In other words, at least in one embodiment, the conductive elastomer 35 is a flexible cylindrical suspended pad within the opening 33.
Within each of the plurality of openings 33, conductive elastomer 35 is suspended therein. For example, in one or more embodiments, the conductive elastomer 35 is suspended such that the first and second sides 131, 133 are free of any conductive elastomer. In other words, the conductive elastomer 35 is attached (e.g., by thermal bonding, UV curing, atmospheric curing, etc.) to the inner walls 36 defining the openings 33 as shown, for example, in
The conductive elastomer 35 may be any suitable conductive elastomer material including, for example, any conductive polymer, any conductive flowable material having a plurality of conductive particles distributed therein, silver particle conductive epoxy, gold particle conductive epoxy, etc. In at least one embodiment, the conductive elastomer material may include a flexible epoxy having a plurality of conductive particles distributed therein (e.g., silver particles or balls, gold particles or balls, etc.; having a particle size in the range of about 3 microns to about 10 microns), electrically conductive RTV silicone, or any like conductive epoxy having a certain degree of flexibility (e.g., to provide certain degree of movement from its normal state when suspended in the opening).
Further, in one or more embodiments, the conductive elastomer 35 suspended in each of the plurality of openings 33 may include a curable conductive elastomer material. For example, the elastomer material may be flowable such that it can be provided within each of the plurality of openings 33 and then cured therein (e.g., such as by thermal, chemical, or other curing processes). Such curing may result in the suspended conductive elastomer 35 having a concave surface at the second side 133 of the carrier 31 (e.g., which may more effectively receive a sphere/ball of a ball grid array).
At least in one embodiment, conductive elastomer 35 suspended in each of the plurality of openings 33 is a flexible conductive material such that the suspended conductive elastomer 35 in each of the plurality of openings 33 is flexed towards the first side 131 of the carrier 31 when a force is applied to the packaged device 80 (e.g., such as with use of floating member 40). In other words, at least in one embodiment, when the contact element 86 (e.g., a ball/sphere) is in contact with the suspended conductive elastomer 35 as shown in
Further, as shown in
Providing such a ball guide 50 may prevent too large of a compression force being applied to the suspended conductive elastomer 35 in the openings 33 of the carrier 31. For example, as shown in
The plurality of openings 51 defined through the ball guide 50 are arranged such that each opening aligns with a corresponding contact element 86 (e.g., ball or sphere of a ball grid array) of the packaged device 80. As such, for example, the plurality of openings 51 may be arranged and/or distributed in an array along x and y axes orthogonal to the adapter axis 13 to correspond to contact elements 86 distributed in such a manner or the plurality of openings 51 may be arranged and/or distributed along a region distal from the center of the ball guide to correspond to contact elements 86 distributed in such a manner at the perimeter of the package device 80. However, any arrangement of contact elements 86 may be accommodated according to the present disclosure with use of an arrangement of the plurality of openings 51 which are aligned therewith.
In at least one embodiment, the ball guide 50 may take form of the carrier 31 without the conductive elastomer suspended in the openings thereof. Further, for example, in one or more embodiments, each opening of the plurality of openings 51 defined through the ball guide 50 may be sized for allowing a corresponding contact element 86 to pass therethrough and contact the suspended conductive elastomer 35 in the opening 33 of the carrier 31. For example, where the packaged device 80 includes a ball grid array having a plurality of balls or spheres 86 at the lower surface 84 thereof, each of the plurality of openings 51 defined through the ball guide 50 may be a cylindrical opening having a diameter sized to allow a ball/sphere of the packaged device 80 to pass therethrough. For example, the diameter of such openings 51 may be in the range of about 0.005 inches to about 0.045 inches.
As described herein, the conductive elastomer interconnect 30 for the adapter assembly 10, at least in one embodiment, may be positioned at the first end region 14 of the adapter assembly 10 orthogonal to the adapter axis 13 to define the socket cavity 15 with the one or more wall numbers 12. The conductive elastomer interconnect 30 may be formed in any suitable manner before being assembled to form the socket cavity 15. In one embodiment, as shown in
At least in one embodiment, silver particles are dispersed in silicone paste to provide the conductive elastomer (e.g., a two part composition including a base material and a catalyst). When the material is to be provided into the openings 33 in the carrier 31, the base material and catalyst are added together and mixed (e.g., with centrifugal movement) to make a consistent paste. The paste may then be provided onto the carrier 31 (e.g., screened onto the carrier 31). For example, a flexible member (e.g., a rubber member or squeegee) may be used to force the paste into the openings 33 such that they are filled equally. The flexible member may be moved left to right and top to bottom several times to provide the fill in the openings 33 and to remove any excess paste. The carrier 31 may then be cured (e.g., thermally cured in an oven, for example, at 150 degrees C. for 30 minutes; or at room temperature, for example, for one day).
One will recognize that various processing steps may be used in the formation of the conductive elastomer interconnects described herein. For example, overfilling holes may be permitted with subsequent planarization or other processes to remove undesirable material, varies masking and etching processes may be used to form openings and or deformations in surfaces, openings may be formed by mechanical drilling or laser drilling, etc.
All patents, patent documents, and references cited herein are incorporated in their entirety as if each were incorporated separately. This disclosure has been described with reference to illustrative embodiments and is not meant to be construed in a limiting sense. As described previously, one skilled in the art will recognize that various other illustrative adapter assembly embodiments may be provided which utilize various combinations of the elements described herein. Various modifications of the illustrative embodiments, as well as additional embodiments of the disclosure and combinations of various elements herein, will be apparent to persons skilled in the art upon reference to this description. It is therefore contemplated that the patented claims will cover any such modifications or embodiments that may fall within the scope of the present disclosure as defined by the accompanying claims.
