Patent Application
20250214167
The present disclosure generally relates to an adapter to couple a wire to a solder joint.
Aspects of the present disclosure relate to an adapter to couple a wire to a solder joint. Various issues may exist with conventional solutions for adapters to couple a wire to a solder joint. In this regard, conventional systems and methods for an adapter to couple a wire to a solder joint may be costly, cumbersome, and/or inefficient.
Limitations and disadvantages of conventional systems and methods will become apparent to one of skill in the art, through comparison of such approaches with some aspects of the present methods and systems set forth in the remainder of this disclosure with reference to the drawings.
Shown in and/or described in connection with at least one of the figures, and set forth more completely in the claims is an adapter to couple a wire to a solder joint.
These and other advantages, aspects and novel features of the present disclosure, as well as details of illustrated embodiments thereof, will be more fully understood from the following description and drawings.
The various features and advantages of the present disclosure may be more readily understood with reference to the following detailed description taken in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements.
The following discussion provides various examples of an adapter to couple a wire to a solder joint. Such examples are non-limiting, and the scope of the appended claims should not be limited to the particular examples disclosed. In the following discussion, the terms “exemplary”, “example” and “e.g.” are non-limiting.
The figures illustrate the general manner of construction, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the present disclosure. In addition, elements in the drawing figures are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the examples discussed in the present disclosure. The same reference numerals in different figures denote the same elements.
The term “and/or” means any one or more of the items in the list joined by “and/or”. As an example, “x and/or y” means any element of the three-element set {(x), (y), (x, y)}. In other words, “x and/or y” means “one or both of x and y”. As another example, “x, y, and/or z” means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, “x, y and/or z” means “one or more of x, y and z”.
The terms “comprises,” “comprising,” “includes,” and/or “including,” are “open ended” terms and specify the presence of stated features, but do not preclude the presence or addition of one or more other features.
The terms “first,” “second,” etc. may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, for example, a first element discussed in this disclosure could be termed a second element without departing from the teachings of the present disclosure.
Unless specified otherwise, the term “coupled” may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements. For example, if element A is coupled to element B, then element A can be directly contacting element B or indirectly connected to element B by an intervening element C. Similarly, the terms “over” or “on” may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements.
Referring now to
In some embodiments, the solder joint may be a cone, a truncated cone, a triangular prism, or a pyramid shape. The pyramid shape may be triangular, square, hexagonal, or octagonal. In some embodiments, the solder joint may be made of a material with good thermal and electrical conductivity. In some embodiments, the solder joint may be made from copper, brass, bronze, silver, gold, aluminum, nickel, tin, tin alloy, lead or lead alloy.
In some embodiments, the wire attachment terminal 120 may be a threaded hole or a threaded cavity located within the adapter 100. In some embodiments, the wire attachment terminal 120 may be tube-shaped or pipe-shaped, comprising a round, rectangular, square, or oval cross-section. In some embodiments, the wire attachment terminal 120 may be made of a material suitable for soldering. In some embodiments, the wire attachment terminal 120 may include an air-escape hole. In some embodiments, the wire attachment terminal 120 may be operable to form a crimp upon crimping.
In some embodiments, the adapter may be at least partly made of a material with good electrical conductivity.
The adapter 100 may be operable to couple a wire 130 to a solder joint 150. The solder joint receiving hole 110 may be operable to receive a solder joint 150. The wire attachment terminal 120 may be operable to couple a wire 130 to the adapter 100.
The crimping connector 160 may be operable to couple a wire 130 to a ring terminal that may be attached to the adapter 100 using the screw 170. The adapter 100 may be electrically conductive to permit coupling between wire 130 and solder joint 150.
In many instances, it may be advantageous to provide a detachable coupling between a wire 130 and a component 140. As illustrated in
In some instances, the component 140 may not be suitable to comprise threaded holes directly and thus soldering pins 150 may be present, as illustrated. This may be the case when generating the threaded holes might crack the material of component 140. Also, in some instances, tightening a screw 170 in a threaded hole of component 140 may apply excess pressure and also lead to a cracked component 140.
The present disclosure includes reference to certain examples, however, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the disclosure. In addition, modifications may be made to the disclosed examples without departing from the scope of the present disclosure. Therefore, it is intended that the present disclosure not be limited to the examples disclosed, but that the disclosure will include all examples falling within the scope of the appended claims.
