Described are methods and apparatus for biasing integrated circuit devices to extract desired performance range.
In a typical Complementary Metal Oxide Semiconductor (CMOS) circuit having an input stage comprising negative-channel MOS (NMOS) devices or positive-channel MOS (PMOS) devices, the maximum or minimum input common mode voltage is determined by the threshold voltage of the NMOS or PMOS.
In the case of an NMOS input pair, to achieve a high common mode input range, the body of the NMOS input pair is typically connected to Ground (GND) or the lowest voltage (VSS) in order to raise the threshold voltage through body effect. The body effect is the change in threshold voltage of a transistor due to the voltage difference between the source and bulk (substrate) of the transistor device. Connecting the body of the input pair NMOS devices to Ground has a negative impact in that the low common mode input range is sacrificed and the NMOS devices will turn off earlier as the input common mode voltage is decreased.
In the case of a PMOS input pair, to achieve a low common mode input range, the body of the PMOS input pair is typically connected to Supply or highest voltage (VCC) in order to raise the threshold voltage through body effect. This has a negative impact in that the high common mode input range is sacrificed and the PMOS devices will turn off earlier as the input common mode voltage is increased.
A biasing scheme is required in NMOS and PMOS input devices to counter the known problem of early turn-off described above so that devices can be operated in a wider operating range of common mode voltage. Additionally, the biasing scheme should be such that small signal source-body voltage of the NMOS or PMOS devices would not detrimentally affect the input device's gain.
In order to get the best of both high and low common mode ranges, an adaptive body biasing method using a pair of replica devices is implemented. Each replica device corresponds to a NMOS (or PMOS) device that constitutes the input pair used in an integrated circuit, such as differential pair circuit, operational amplifier, comparator, amplifying gain stages etc. The replica device is chosen so that the intrinsic device parameters and dimensions of the replica device match as closely as possible with the parameters and dimensions of the corresponding NMOS (or PMOS) device. In order to bias the input device's body independently of the source and substrate potentials, the device is built in an isolated well structure of the process. The replica device will also use an isolated well structure to closely match the input device electrical behavior. The body bias applied to the NMOS (or PMOS) device helps in adapting the threshold voltage to the operating condition. Embodiments of this disclosure help to increase the threshold voltage of the device, utilizing body effect, at high input common mode voltage, as desired for NMOS, and at low input common mode voltage, as desired for PMOS. At the same time, the embodiments scale the threshold back to normal at low input common mode voltages, thereby countering the negative impact of body effect.
These and other aspects and features of the present disclosure will become apparent to those ordinarily skilled in the art upon review of the following description of specific embodiments of the disclosure in conjunction with the accompanying figures, wherein:
Embodiments of the present disclosure will now be described in detail with reference to the drawings, which are provided as illustrative examples of the disclosure so as to enable those skilled in the art to practice the disclosure. Notably, the figures and examples below are not meant to limit the scope of the present disclosure to a single embodiment, but other embodiments are possible by way of interchange of some or all of the described or illustrated elements.
Moreover, where certain elements of the present disclosure can be partially or fully implemented using known components, only those portions of such known components that are necessary for an understanding of the present disclosure will be described, and detailed descriptions of other portions of such known components will be omitted so as not to obscure the disclosure.
In the present specification, an embodiment showing a singular component should not be considered limiting; rather, the disclosure is intended to encompass other embodiments including a plurality of the same component or nested stages, and vice-versa, unless explicitly stated otherwise herein. Moreover, applicants do not intend for any term in the specification or claims to be ascribed an uncommon or special meaning unless explicitly set forth as such. Further, the present disclosure encompasses present and future known equivalents to the known components referred to herein by way of illustration.
Referring to
In
Vth=VTO+γ(√{square root over (VSB+2ϕF)}−√{square root over (2ϕF)}) (Eq 1), where
γ=√{square root over (2εsqNA)}/Cox (Eq 2)
In the first equation above, VTO indicates threshold voltage when VSB is zero, γ indicates the body effect coefficient set by material parameters, and F is a constant whose value depends on the manufacturing process doping concentration of device bulk region and temperature. In the second equation above, q indicates electric charge, εS indicates dielectric constant of semiconductor, NA indicates acceptor concentration, and Cox indicates oxide capacitance per unit area. It is to be noted that since M1A_R is a replica device of M1A, the device parameters, such as VTO, γ etc. match between M1A_R and M1A. In general, the replica device is chosen so that the intrinsic device parameters and dimensions of the replica device match as closely as possible with the parameters and dimensions of the corresponding main NMOS (or PMOS) device in the circuit. The only parameter that is changing is the source-body voltage VSB of M1A in order to control threshold voltage via change in VSB. Therefore, over process and temperature variation, the matching between M1A_R and M1A remains substantially intact. In general, the replica device is built using commonly used layout matching techniques to replicate the geometry, layer stack, surrounding environment and electrical behavior of the input device as closely as possible when bias-points voltages at terminals match. The replica device is commonly placed in immediate vicinity of the input device in order to reduce the effect of the silicon material parameters variation across space between devices. Both input device and replica device are built in isolated well structures in order to enable bulk region biasing independent of substrate potential.
The gates of M1A_R and M1A are connected to the same input voltage. In this schematic, the gates are connected to a common mode voltage of VCM. M1A_R is biased as a source follower with a constant current source. IS is the DC bias current. Body effect on M1A_R is utilized on purpose to have VS1 change non-linearly as VCM changes.
At low VCM, source voltage VS1 of the replica device will be closer to VCM. As shown in
In short, the advantage of adaptive body biasing for large signal is that, at low VCM, threshold increase of M1A is minimized by driving its body to be close to its source, i.e. keeping (VS2−VB2) small, thereby improving low VCM range. At high VCM, since body of M1A_R is at GND, VS1 diverges from VS2, increasing (VS2−VB2) and increasing the threshold of M1A, thereby improving high common mode voltage range.
Referring to
In
For small signal, the ideal condition is to make vsb of M1A equal to zero. To make body bias vsb of M1A small, [i.e., to meet the condition vsb (M1A)=(vs2−vs1)˜small], the following condition has to be met:
Here, transconductances gm and gmb are respectively the front-gate transconductance and back gate transconductance of M1A. RGM is the load. In the equations above, μ indicates mobility, W indicates width of transistor M1A, L indicates length of transistor M1A, Cox, and γ are already defined above.
When vsb (M1A)=(vs2−vs1) is small, (gmb−vsb) current source in the small signal model has almost no effect. This means the applied vac effectively falls across RGM, making the following approximation true, where Gm is the total gain of the stage.
Persons skilled in the art would appreciate that the disclosure is not limited to the example circuit shown in
vac=(SENSE+−SENSE−) (Eq 8)
Therefore
Hence, total gain of the stage,
The gain calculation formula of Eq. 10 holds true for the circuits shown in
Although the present disclosure has been particularly described with reference to the preferred embodiments thereof, it should be readily apparent to those of ordinary skill in the art that changes and modifications in the form and details may be made without departing from the spirit and scope of the disclosure. It is intended that the appended claims encompass such changes and modifications.
This patent application is a continuation of application Ser. No. 15/474,791 filed on Mar. 30, 2017, now U.S. Pat. No. 10,103,728 which is hereby incorporated herein by reference in its entirety.
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6281735 | Page | Aug 2001 | B1 |
7728649 | Webb | Jun 2010 | B1 |
10103728 | Jayaraj | Oct 2018 | B1 |
20100165607 | Russo | Jul 2010 | A1 |
20140002144 | Hatakeyama | Jan 2014 | A1 |
Number | Date | Country | |
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20190052261 A1 | Feb 2019 | US |
Number | Date | Country | |
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Parent | 15474791 | Mar 2017 | US |
Child | 16160552 | US |