This description relates to regulated power supplies, and more particularly, to an adaptive current circuit.
The direct current (DC) output voltage provided by a standard power supply to a load can vary due to any number of factors such as transient conditions, environmental conditions, and changing load conditions. In such cases, a voltage regulator can be coupled between the power supply and the load and used to provide a regulated DC output voltage to the load. In this manner, the output voltage of the voltage regulator remains unaffected by abrupt or otherwise transient changes in the input supply voltage and the load current. There are many types of DC-to-DC voltage regulators, including switching regulators and linear regulators.
The source follower power supply configuration is widely used in DC-to-DC voltage regulator design. For instance, a switching regulator (e.g., buck converter) may use a source follower to charge the boot capacitor of a bootstrap circuit, and a linear regulator (e.g., low dropout voltage regulator, or LDO voltage regulator) may use a source follower to provide the regulated output voltage. A number of non-trivial issues remain with such regulators.
One example includes a power supply circuit that includes an amplifier and first and second transistors. The amplifier has an amplifier output, and is configured to provide a drive potential at the amplifier output. The first transistor is coupled between a voltage supply terminal and an output terminal, and has a first control terminal coupled to the amplifier output. The first transistor is configured to receive at least a portion of the drive potential at the first control terminal. The second transistor is coupled between the first control terminal and the output terminal, and has a second control terminal coupled to the amplifier output. A threshold voltage of the first transistor is lower than a threshold voltage of the second transistor, and the second transistor is configured to adaptively reduce the portion of the drive potential at the first control terminal by the second transistor turning on responsive to a voltage at the output terminal being lower than a voltage level. In one such example configuration, the power supply circuit may be included within an integrated circuit package, and the output terminal is a pin or pad of the integrated circuit package. The output terminal may be, for instance, a boot pin (to which a boot capacitor is coupled) or an output voltage pin.
Another example is a power supply circuit that includes an amplifier along with first, second and third transistors. The amplifier has an amplifier output and a voltage reference input.
The first transistor is coupled between a voltage supply terminal and an output terminal, and has a first control terminal coupled to the amplifier output. The second transistor is coupled between the first transistor and the output terminal, and has a second control terminal coupled to the amplifier output. The third transistor is coupled between the second transistor and the output terminal, and has a third control terminal and a body terminal, wherein the third control terminal is coupled to the amplifier output, and the body terminal is coupled to a reference terminal. In one such example configuration, the power supply circuit may be included within an integrated circuit package, and the output terminal is a pin or pad of the integrated circuit package. The output terminal may be, for instance, a boot pin or an output voltage pin.
Another example is a power supply circuit that includes an amplifier and first and second transistors. The amplifier has an amplifier output and a voltage reference input. The first transistor is coupled between a voltage supply terminal and an output terminal, and has a first control terminal coupled to the amplifier output. The second transistor is coupled between the first control terminal and the output terminal, and has a second control terminal coupled to the amplifier output.
A threshold voltage of the first transistor is lower than a second threshold voltage of the second transistor. In one such example configuration, the power supply circuit may be included within an integrated circuit package, and the output terminal is a pin or pad of the integrated circuit package. The output terminal may be, for instance, a boot pin or an output voltage pin.
Adaptive current limit techniques are described herein. While the techniques can be used in any number of applications, they are particularly useful for limiting the current through a source follower power supply that is coupled to a terminal susceptible to short-circuiting. The techniques are adaptive, in that they can be used to provide both the desired transient response (relatively high current) during normal operation and low power dissipation (relatively low current) during a short-circuit condition. In an example, a power supply circuit includes an amplifier and first and second transistors. The amplifier has an amplifier output, and is configured to provide a drive potential at the amplifier output. The first transistor is coupled between a voltage supply terminal and an output terminal, and has a first control terminal coupled to the amplifier output. The first transistor is configured to receive at least a portion of the drive potential at the first control terminal. In one such example, this first transistor is configured as a source follower power supply. The second transistor is coupled between the first control terminal and the output terminal, and has a second control terminal coupled to the amplifier output. A threshold voltage of the first transistor is lower than a threshold voltage of the second transistor. In operation, the second transistor is configured to adaptively reduce the portion of the drive potential at the first control terminal, for example, by the second transistor turning on responsive to a voltage at the output terminal being lower than a voltage level (e.g., such as a voltage indicative of a short-circuit on the output terminal). The output terminal may be, for example, a pin or pad of an integrated circuit package, such as a pin to which a boot capacitor may be coupled (such as in a switching power supply) or an output voltage pin (such as in an LDO voltage regulator).
As described above, a number of non-trivial issues remain with DC-to-DC voltage regulators that employ a source follower power supply configuration. For example, in a switching regulator that uses a source follower to charge the boot capacitor of a bootstrap circuit, there may be very high power dissipation on the charge path if the boot pin is inadvertently shorted to ground, which may damage the source follower. In more detail, assume the switching regulator has a 12 volt input voltage and a 150 milliamp current, and the source follower is implemented with an n-channel field effect transistor (NFET). In such a case, if the boot pin is shorted to ground, about 1.8 watts of power is discharged on the charge path and across the NFET. Depending on its size, the NFET can easily be damaged by such relatively high power dissipation. One possible solution to this problem is to use a constant current source to limit the available current. For instance, a constant limit of 10 milliamps could be used to limit the power dissipation to about 0.12 watts, given a 12 volt input voltage. However, such a current limit would also limit the transient response current needed to charge the boot capacitor. A similar problem may arise in the context of an LDO regulator, where the pass element (passFET) can be damaged if the output voltage pin is inadvertently shorted to ground.
Thus, current limit circuitry is described herein to adaptively limit current through a power supply (e.g., a source follower power supply) coupled to an output pin or other terminal. Unlike a constant current source, the techniques can be used to provide both the desired transient response (relatively high current) during normal or first mode of operation and low power dissipation (relatively low current) during a short-circuit condition or second mode of operation. The techniques can be implemented in any number of power supply topologies.
The regulating core 51 is configured to generate a drive signal (VDRV) based on a given input voltage (VIN ) and a given reference voltage. In this example case, the reference voltage is generated internal to the regulating core 51, but in other cases the reference voltage may be generated external to the regulating core 51. The switching core 53 receives the drive signal VDRV as well as the input voltage VIN, and is configured to generate the regulated output voltage (VOUT). Each of the regulating core 51 and the switching core 53 can be implemented with any suitable configurations, except that the switching core 53 is further configured with the adaptive current limit circuit 55. In some examples, the regulating core 51 and the switching core 53 are configured to implement a buck converter, a boost converter, a buck-boost converter, or a flyback converter. More generally, the regulating core 51 and the switching core 53 can be any power supply circuitry that includes a terminal (e.g., pin, pad, internal node, or external node) to which power is sourced, and that terminal is susceptible to short-circuit conditions or some other condition that may cause excess current flow to that terminal.
As shown, adaptive current limit circuit 55 is coupled to the VIN terminal, a reference or ground terminal (REF), and the output of the regulating core 51, such that it receives the drive signal VDRV as input. The adaptive current limit circuit 55 is further coupled to a terminal to be protected (TPROT) in the event of a short-circuit condition at that terminal. In an example, the terminal TPROT is coupled to the output of a source follower power supply implemented within the switching power supply 50, such as in a bootstrap circuit. The terminal TPROT may be, for example, a node within switching power supply 50 or a pin or pad of an integrated circuit package in which switching power supply 50 resides. More generally, the terminal TPROT may be any conductor to which power is sourced via a source follower power supply, or any other power supply that might be damaged due to a short-circuit or other high-current condition. In operation, adaptive current limit circuit 55 is configured to limit current flowing to the terminal TPROT during a short-circuit or high-current condition at that terminal. Further details of adaptive current limit circuit 55 are described below with reference to
The V2I circuit 102 is configured to provide a stable bias current (IBIAS) to the VREF 104. In one example, the V2I circuit 102 is implemented with a voltage-to-current converter circuit that includes bandgap voltage reference (BGVR), an operational amplifier, a FET, and a resistor. The BGVR is configured to provide a stable voltage reference to the input of amplifier and can be implemented with any number of standard or proprietary bandgap voltage reference circuit topologies, such as Brokaw, Widlar, and switched capacitor topologies. The amplifier can have a voltage follower configuration, with its inverting input tied to its output, and receives the output voltage of the BGVR at its non-inverting input. The output of the amplifier drives the gate of the FET. The resistor connects the FET source to ground, and the current through that resistor flows from the source to drain of the FET, thereby providing the bias current IBIAS to the VREF circuit 104, to help generate the reference voltage VREF. More generally, V2I circuit 102 can be any number of voltage-to-current converter configurations.
The VREF circuit 104 is configured to generate a reference voltage VREF for the LDO core 108, based on the bias current IBIAS from V2I circuit 102. In an example, the VREF circuit 104 includes an amplifier and a transistor (such as a passFET or other switching element). The transistor is gated or otherwise controlled by an output signal of the amplifier. The amplifier is configured with first and second input resistances on its inverting and non-inverting inputs, respectively, which in conjunction with the bias current IBIAS effectively determine the reference current. The reference current generated by the amplifier is passed through the transistor and a reference resistor (which may be external to the VREF circuit 104), which in turn generates the reference voltage V that is provided to LDO core 108. More generally, VREF circuit 104 can be implemented with any reference voltage generator circuit configurations.
The dropout detection circuit 106 senses a dropout condition and is configured to cause a higher reference current (sometimes called fast soft-start current, IFSS) in VREF circuit 104, so as to reduce the start-up time with a higher ramp rate on a reference capacitor coupled in parallel with a reference resistor, external or internal to VREF circuit 104. Also, the dropout detection circuit 106 is configured to limit the overshoot on the reference voltage VREF while the regulator is coming out of dropout, by disconnecting or otherwise disabling the fast soft-start current IFss responsive to the regulator output voltage VOUT reaching a given voltage threshold, such as 90% of the target output voltage. In an example, dropout detection circuit 106 includes a comparator that outputs a logic low (or other dropout indicator signal) whenever the output voltage VOUT falls out of regulation by more than a given threshold (e.g., ≥5%). The dropout indicator signal can be used to switch the fast soft-start current in and out as needed (e.g., by controlling the value of one of the input resistances on the input of the amplifier of VREF circuit 104). More generally, dropout detection circuit 106 can be implemented with any configuration capable of adjusting the reference current provided by VREF circuit 104 during dropout.
The LDO core 108 is configured to provide a regulated voltage output VOUT based on the input supply voltage VIN and the reference voltage VREF provided by the VREF circuit 104. In an example, the LDO core 108 includes a switching element (also called a pass element) such as a passFET coupled between the input voltage terminal VIN and the output voltage terminal VOUT in a source follower configuration, and an amplifier having a unity gain configuration for gating the switching element, via a drive signal VDRV. More generally, LDO core 108 can be implemented with any LDO core configurations capable of generating a regulated output voltage based on an input supply voltage VIN and a reference voltage VREF provided by a reference voltage generation circuit, except that LDO core 108 is further configured with the adaptive current limit circuit 110.
Thus, each of the V2I circuit 102, VREF circuit 104, dropout detection circuit 106, and LDO core 108 can be implemented with any suitable configurations, except that the LDO core 108 is further configured with the adaptive current limit circuit 110. More generally, LDO voltage regulator 100 can be any low dropout voltage circuitry that includes a terminal (e.g., pin, pad, internal node, or external node) to which power is sourced via a source follower power supply, or any other power supply that might be damaged due to a short-circuit or other high-current condition.
As shown, adaptive current limit circuit 110 is coupled to the VIN terminal, a reference or ground terminal (REF), and the output of VREF circuit 104, such that it receives the reference voltage VREF as input. As described above, the LDO core 108 uses the reference voltage VREF to generate a drive signal VDRV, which current limit circuit 110 also receives as input. The adaptive current limit circuit 110 is further coupled to a terminal to be protected (TPROT) in the event of a short-circuit condition at that terminal. The terminal TPROT is coupled to the output of a source follower power supply implemented within LDO voltage regulator 100, such as a passFET in the LDO core 108. The terminal TPROT may be, for example, a node within LDO voltage regulator 100 or a pin or pad of an integrated circuit package in which LDO voltage regulator 100 resides. In this example, terminal TPROT is the output voltage VOUT terminal. In operation, adaptive current limit circuit 110 is configured to limit current flowing to the terminal TPROT (also the VOUT terminal) during a short-circuit or other high-current condition at that terminal. Further details of adaptive current limit circuit 110 are described below with reference to
The adaptive current limit circuit 55a of this example also includes n-channel FET M1, which is configured as a source follower power supply, so as to source power from the input voltage terminal VIN to terminal TPROT, responsive to the output voltage VDRV of amplifier AMP1. However, unlike the circuit of
As shown, FETs M1 and M2 are arranged in a current mirror configuration and may be a matched pair (e.g., 1:1 ratio, with respect to transistor width and length) and have a similar voltage threshold (VTH, sometimes called VGS), although they need not be so matched. With its back-gate connected to the REF terminal, the threshold voltage VTH of FET M3 is larger than the VTH of M1.
In one example, for instance, R3 and R4 are each in the range of 10 KOhms to 200 KOhms (e.g., R3 is in the range of about 10 KOhms to 100 KOhms; R4 is in the range of about 100 KOhms to 200 KOhms), the threshold voltage VTH of FET M3 is in the range of 2 to 5 volts, and the VTH of each of M1 and M2 is in the range of 0.6 to 1 volt. The source-to-drain on-resistance (RSD_ON) of M3 decreases proportionally with decreasing voltage at terminal TPROT. In this manner, FET M3 acts like a variable resistor and is configured to adaptively reduce the portion of the drive potential VDPV applied at the M1 gate, by M3 turning on responsive to a voltage at the terminal TPROT being lower than it should be (lower than a voltage level). The lower the voltage at terminal TPROT, the lower the RSD_ON of M3 (the more M3 turns on). The lower the RSD_ON of M3, the lower the portion of VDRV applied to the M1 gate.
For example, assume that terminal TPROT is a boot capacitor terminal for a boot strap circuit of switching power supply 50a, and the voltage at terminal TPROT is VBOOT (e.g., about 5 volts) under normal conditions. Further assume VDRV is around 5 to 6 volts, and that VTH of M3 is about 2 to 5 volts. So, in a normal operation mode, VDRV−VBOOT is less than VTH of M3 (e.g., 6 volts−5 volts=1 volt, which is less than 2 volts) and M3 is off or otherwise barely conducting and is thus effectively an open circuit (e.g., RSD_ON of M3≥1 MOhm to infinite, or otherwise very high resistance). As such, no current is conducted by M2, and the M1 gate receives about 100% of VDRV.
However, responsive to VDRV−VBOOT meeting or exceeding VTH of M3, normal operation mode ceases and M2 and M3 begin to conduct and the RSD_ON of M3 is set proportional to VDRV−VBOOT. So, as the value of VDRV−VBOOT further increases past VTH of M3, the more M3 turns on (the current conducted through M2 and M3 increases with increasing values of VDRV−VBOOT). If terminal TPROT is shorted to ground (presumably by accident), then VDRV−VBOOT is the maximum amount it can be and RSD_ON of M1 is the lowest it can be (e.g., 1 Ohm or otherwise very small relative to the impedance at the M1 gate). With M2 and M3 conducting, a variable voltage divider is formed which allows the amount of VDRV applied to the M1 gate to be varied proportionally, relative to the voltage at terminal TPROT. For instance, with terminal TPROT shorted to ground, current sourced from the VDRV potential seeks the lower resistant path through M2 and M3 (relative to the high impedance path to the M1 gate), and the M1 gate thus receives about 0% or an otherwise relatively small amount of VDRV. For non-zero (non-short) voltage values at terminal TPROT, the M1 gate may receive a proportional amount of VDRV (some value between about 0 volts and the full VDRV potential). Thus, an adaptive limit on VIN supply current through M1 is provided.
As further shown in
The adaptive current limit circuit 55b of this example is similar to the adaptive current limit circuit 55a of
For instance, in this example, the current limit circuit 55b further includes resistor R4, R5, R6 and R7 operatively coupled to n-channel FETs M2 through M5, which are connected in a serial fashion between the gate of FET M1 and terminal TPROT. In more detail, resistors R3, R4, R5, R6 and R7 are connected in series with one another between the AMP1 output and the M1 gate, and can be used to fine tune the current flowing through M1. The M2 drain is connected to the M1 gate, and R3 is connected between the gate and drain of M2. The M3 drain is connected to the M2 source, and R5 is connected between the gates of M2 and M3. The M4 drain is connected to the M3 source, and R6 is connected between the gates of M3 and M4. The M5 drain is connected to the M4 source, and R7 is connected between the gates of M4 and M5. The M5 source is connected to terminal TPROT, and the body (or back-gate) of each of M3, M4 and M5 is connected to a reference (REF) terminal (which in this case is connected to ground). R4 is connected between the AMP1 output and the M5 gate.
As described above with reference to
The adaptive current limit circuit 55c of this example is similar to the adaptive current limit circuit 55a of
For instance, in this example, the current limit circuit 55c further includes resistors R3 through R6 operatively coupled to n-channel FETs M2 through M5. M2 is connected in a serial fashion with the parallel combination of M3 through M6 between the gate of FET M1 and terminal TPROT. In more detail, resistors R3, R4, R5 and R6 are connected in series with one another between the AMP1 output and the M1 gate, and can be used to fine tune the current flowing through M1. The M2 drain is connected to the M1 gate, and resistor R4 is connected between the gate and drain of M2. The M3 drain is connected to the M2 source, and resistor R4 is connected between the gates of M2 and M3. The M4 drain is connected to the M3 drain, and resistor R5 is connected between the gates of M3 and M4. The M5 drain is connected to the M4 drain, and resistor R6 is connected between the gates of M4 and M5. The source of each of the M3, M4 and M5 is connected to terminal TPROT, and the body (or back-gate) of each of M3, M4 and M5 is connected to a reference (REF) terminal (which in this case is connected to ground).
As described above with reference to
The adaptive current limit circuit 55d also includes n-channel depletion or low threshold voltage FET M1, which is configured as a source follower power supply, so as to source power from the input voltage terminal VIN to terminal TPROT, responsive to the output voltage VDRV of amplifier AMP1. However, the percentage or proportion of the output voltage VDRV of amplifier AMP1 that is applied to the gate of FET M1 can be varied based on the voltage level at terminal TPROT. For instance, example circuit 55d further includes resistors R3 and R4 operatively coupled to n-channel FET M2, which is connected in a serial fashion between the M1 gate and terminal TPROT. In more detail, resistors R3 and R4 are connected in series with one another between the AMP1 output and the M1 gate, and can be used to fine tune the current flowing through M1. The M2 drain is connected to the M1 gate, and resistor R3 is connected between the gate and drain of M2. The M2 source is connected to terminal TPROT.
FETs M1 and M2 are different in size, with M1 being much larger than M2 (e.g., 1000:1 ratio, or larger, with respect to transistor width and length). Also, the threshold voltage VTH of M2 is greater than the VTH of M1. In some examples: if M1 is a depletion FET its VTH may be in the range of −0.1 to −0.2 volts, and if M1 is a low threshold FET its VTH may be in the range of 0.1 to 0.2 volts; VTH of M1 is in the range of 0.6 to 1 volt; R3 is in the range of about 1 KOhm to 10 KOhms; and R is in the range of about 100 KOhms to 200 KOhms. The source-to-drain on-resistance (RSD-ON) of M2 decreases proportionally with decreasing voltage at terminal TPROT. In this manner, FET M2 acts like a variable resistor and is configured to adaptively reduce the portion of the drive potential VDRV applied at the M1 gate, by M2 turning on responsive to a voltage at the terminal TPROT being lower than it should be (lower than a voltage level). The lower the voltage at terminal TPROT, the lower the RSD of M2 (the more M2 turns on). The lower the RSD of M2, the lower the portion of VDRV applied to the M1 gate.
For example, assume that terminal TPROT is a boot capacitor terminal for a boot strap circuit of switching power supply 50d, and the voltage at terminal TPROT is VBOOT (e.g., about 5 volts) under normal conditions. Further assume VDRV is around 5 volts, and that VTH of M2 is about 0.6 volts. So, in a normal operation mode, VDRV−VBOOT is less than VTH of M2 (e.g., 5 volts −5 volts=0 volts, which is less than 0.6 volts) and M2 is off or otherwise barely conducting and is thus effectively an open circuit (e.g., RSD_ON of M2≥1 MOhm to infinite, or otherwise very high resistance). As such, the M1 gate receives about 100% of VDRV.
However, responsive to VDRV−VDRV meeting or exceeding VTH of M2, normal operation mode ceases and M2 begins to conduct and the RSD_ON of M2 is set proportional to VDRV−VBOOT. So, as the value of VDRV−VBOOT further increases past VTH of M2, the more M2 is turns on (the current conducted through M2 increases with increasing values of VDRV−VBOOT). If terminal TPROT is shorted to ground, then VDRV−VBOOT is the maximum amount it can be and RSD_ON of M2 is the lowest it can be (e.g., <1 Ohm or otherwise very small relative to the impedance at the M1 gate). With M2 conducting, a variable voltage divider is formed which allows the amount of VDRV applied to the M1 gate to be varied proportionally, relative to the voltage at terminal TPROT. For instance, with terminal TPROT shorted to ground, current sourced from the VDRV potential seeks the lower resistant path through M2 (relative to the high impedance path to the M1 gate), and the M1 gate thus receives about 0% or an otherwise relatively small amount of VDRV. For non-zero (non-short) voltage values at terminal TPROT, the M1 gate may receive a proportional amount of VDRV (some value between about 0 volts and the full VDRV potential). Thus, an adaptive limit on VIN supply current through M1 is provided.
As further shown in
The switching core 53 of this example is configured as a buck converter with low-side and high-side switching elements and corresponding driver circuits. In more detail, high-side switching element ML is coupled between the input voltage terminal VIN and the switching node SN, and has its control terminal coupled to the output of high-side driver HSD. The low-side switching element M1 is coupled between the ground terminal and the switching node SN, and has its control terminal coupled to the output of low-side driver LSD. A pulse width modulator (PWM) controller 703 receives as input a reference voltage VREF2 and a feedback voltage VFB representative of the output voltage VOUT, and generates the high-side and low-side drive signals HSDRV and LSDRV which are provided to the high-side driver HSD input and the low-side driver LSD input, respectively. VREF2 may be provided, for example, by a bandgap voltage reference, and feedback voltage VFB is generated by a voltage divider including resistors R7 and R8 serially-connected between the VOUT and ground terminals. Switching elements MH and ML are both implemented with an n-channel power FET, although any number of other transistor technologies can be used. The PWM controller 703 can be implemented with any suitable PWM control scheme and circuitry.
As further shown, the positive supply terminal of the high-side driver HSD is coupled to the boot node and terminal TPROT and the negative supply terminal of the high-side driver HSD is coupled to the switching node SN. Also, a boot capacitor is coupled between the terminal TPROT and the switching node SN. The positive supply rail is provided by the adaptive current limit circuit 55e, which is configured as shown in
As further shown, an inductor L is coupled between the switching node SN and the output voltage terminal, and an output capacitor COUT is coupled between the VOUT and ground terminals. Any number of loads may be connected between the VOUT and ground terminals, for a given power supply application.
Other examples may include additional circuitry not shown in
As further shown in
As further shown in
As further shown in
As shown in
So, in this particular example, terminal TPROT is the VOUT terminal of LDO voltage regulator 100b. Assume the voltage at terminal TPROT is supposed to be about 5 volts under normal conditions. Further assume VDRV is around 5 volts, and that VTH of M2 is about 0.6 volts. So, in a normal operation mode, V1−VBOOT is less than VTH of MTH (e.g., 5 volts−5 volts=0 volts, which is less than 0.6 volts) and M2 is off or otherwise barely conducting and is thus effectively an open circuit (e.g., RSD_ON of M2≥1 MOhm to infinite, or otherwise very high resistance). As such, the M1 gate receives about 100% of V.
However, responsive to VDRV−VBOOT meeting or exceeding VTH of M2, normal operation mode ceases and M2 begins to conduct and the RSD_ON of M2 is set proportional to VDRV−VBOOT. So, as the value of VDRV−VBOOT further increases past VTH of M2, the more M2 is turns on (the current conducted through M2 increases with increasing values of VDRV−V1 BOOT). If terminal TPROT is shorted to ground, then VDRV−VBOOT is the maximum amount it can be and RSD_ON of M2 is the lowest it can be (e.g., <1 Ohm or otherwise very small relative to the impedance at the M2 gate). With M2 conducting, a variable voltage divider is formed which allows the amount of VDRV applied to the M1 gate to be varied proportionally, relative to the voltage at terminal TPROT. For instance, with terminal TPROT shorted to ground, current sourced from the VDRV potential seeks the lower resistant path through M2 (relative to the high impedance path to the M1 gate), and the M1 gate thus receives about 0% or an otherwise relatively small amount of VDRV. For non-zero (non-short) voltage values at terminal TPROT, the M1 gate may receive a proportional amount of VDRV (some value between about 0 volts and the full VDRV potential). Thus, an adaptive limit on VIN supply current through M1 is provided.
At 901 and 903, respectively, the method includes receiving a gate drive signal VDRV from a voltage regulating circuit, and determining whether the difference between VDRV and VTERM (VDRV−VTERM) is greater than or equal to VTH of the second transistor. The voltage regulating circuit may be, for example, regulating core 51 of any of switching power supplies 50a-f, or amplifier AMP1 of LDO voltage regulators 100a-b. More generally, VDRV can be provided by any circuit configured to generate a drive signal for a power supply switching element. In this example, the determination at 903 is made by operation of the second transistor. This determination is indicative of whether there is an over-current (OC) condition on TPROT.
Responsive to the difference of VDRV−VTERM not being greater than or equal to VTH of the second transistor, the second transistor remains in its off or non-conducting state and the method continues at 905 with applying all (or substantially all, such as 90% or more) of VDRV to the gate of the first transistor, to supply voltage VTERM at protected terminal TPROT. Such a determination and corresponding action may be indicative of a normal operation mode, where there is no over-current condition on the terminal TPROT.
In contrast, responsive to the difference of VDRV−VTERM being greater than or equal to VTH of the second transistor, the second transistor turns on or otherwise begins to conduct and the method continues at 907 and 909, respectively, with engaging an adaptive voltage divider to reduce the portion of VDRV applied to the gate of the first transistor, and adjusting the voltage divider to further reduce the portion of VDRV applied to gate of the first transistor (source follower power supply), based on the value of VDRV−VTERM. Such a determination and corresponding action may be indicative of an abnormal operation mode, where there is an over-current condition on the terminal TPROT.
In this example, the adaptive voltage divider is effectively provided by operation of the second transistor having an RSD_ON value that decreases proportionally with decreasing VTERM values. In this manner, the second transistor effectively acts like a variable resistor. The lower the value of VTERM at terminal TPROT, the lower the RSD_ON value of the second transistor (and the more the second transistor turns on). The lower the RSD_ON value of the second transistor, the lower the portion of VDRV applied to the gate of the first transistor. Thus, current through the first transistor is adaptively limited by the adaptive voltage divider provided by the operation of the second transistor, responsive to unusually low values of VTERM at terminal TPROT.
Example 1 is a power supply circuit, comprising: an amplifier having an amplifier output, the amplifier configured to provide a drive potential at the amplifier output; a first transistor coupled between a voltage supply terminal and an output terminal, the first transistor having a first control terminal coupled to the amplifier output, and the first transistor configured to receive at least a portion of the drive potential at the first control terminal; and a second transistor coupled between the first control terminal and the output terminal, the second transistor having a second control terminal coupled to the amplifier output. A threshold voltage of the first transistor is lower than a threshold voltage of the second transistor, and the second transistor is configured to adaptively reduce the portion of the drive potential at the first control terminal by the second transistor turning on responsive to a voltage at the output terminal being lower than a voltage level. The degree to which the second transistor turns on may vary based on the magnitude of the voltage at the output terminal.
Example 2 includes the power supply circuit of Example 1, and further includes one or more resistors coupled between the first control terminal of the first transistor and the second control terminal of the second transistor.
Example 3 includes the power supply circuit of Example 1 or 2, wherein the output terminal is a boot capacitor terminal or an output voltage terminal.
Example 4 includes the power supply circuit of any one of Examples 1 through 3, wherein the amplifier is configured as a unity follower.
Example 5 includes the power supply circuit of any one of Examples 1 through 4, and further includes a switch coupled between the first transistor and the output terminal.
Example 6 includes the power supply circuit of any one of Examples 1 through 5, wherein the second transistor is configured to adaptively reduce the portion of the drive potential at the first control terminal by adaptively changing channel resistance of the second transistor, based on a potential difference between the drive potential and the voltage at the output terminal.
Example 7 includes the power supply circuit of any one of Examples 1 through 6, wherein: the first and second transistors are field effect transistors (FETs); the first transistor is a depletion mode or native transistor having its drain coupled to the voltage supply terminal and its source coupled to the output terminal, and its gate is the first control terminal; and the second transistor is smaller than the first transistor and has its drain coupled to the gate of the first transistor and its source coupled to the output terminal, and its gate is the second control terminal.
Example 8 includes the power supply circuit of any one of Examples 1 through 6, wherein: the first and second transistors are field effect transistors (FET); the first transistor having its drain coupled to the voltage supply terminal and its source coupled to the output terminal, and its gate is the first control terminal; and the second transistor has its source coupled to the output terminal, its body terminal coupled to a reference terminal, and its gate is the second control terminal.
Example 9 includes the power supply circuit of any one of Examples 1 through 8, wherein the power supply circuit is a buck converter circuit or a low dropout (LDO) voltage regulator circuit.
Example 10 is an integrated circuit package comprising the power supply circuit of any one of Examples 1 through 9, wherein the output terminal is a pin or pad of the integrated circuit package.
Example 11 is a power supply circuit, comprising: an amplifier having an amplifier output and a voltage reference input; a first transistor coupled between a voltage supply terminal and an output terminal, the first transistor having a first control terminal coupled to the amplifier output; a second transistor coupled between the first transistor and the output terminal, the second transistor having a second control terminal coupled to the amplifier output; and a third transistor coupled between the second transistor and the output terminal, the third transistor having a third control terminal and a body terminal, the third control terminal coupled to the amplifier output, and the body terminal coupled to a reference terminal.
Example 12 includes the power supply circuit of Example 11, and further includes a first resistor coupled between the first control terminal of the first transistor and the second control terminal of the second transistor; and/or a second resistor coupled between the second control terminal of the second transistor and the third control terminal of the third transistor.
Example 13 includes the power supply circuit of Example 11 or 12, wherein the output terminal is a boot capacitor terminal and the reference terminal is a ground terminal.
Example 14 includes the power supply circuit of any one of Examples 11 through 13, wherein the amplifier is configured as a unity follower.
Example 15 includes the power supply circuit of any one of Examples 11 through 14, and further includes: one or more fourth transistors coupled between the third transistor and the output terminal, each of the one or more fourth transistors having a respective control terminal coupled to the amplifier output and a respective body terminal coupled to the reference terminal;
and a resistor coupled between the third control terminal of the third transistor and the one or more control terminals of the one or more fourth transistors.
Example 16 includes the power supply circuit of any one of Examples 11 through 14, and further includes: one or more fourth transistors coupled in parallel with the third transistor, each of the one or more fourth transistors having a respective control terminal coupled to the amplifier output and a respective body terminal coupled to the reference terminal; and a resistor coupled between the third control terminal of the third transistor and the one or more control terminals of the one or more fourth transistors.
Example 17 includes the power supply circuit of any one of Examples 11 through 16, and further includes a switch coupled between the first transistor and the output terminal.
Example 18 includes the power supply circuit of any one of Examples 11 through 17, wherein: the first, second and third transistors are field effect transistors (FETs); the first transistor having its drain coupled to the voltage supply terminal and its source coupled to the output terminal, and its gate is the first control terminal coupled to the amplifier output; the second transistor having its drain coupled to the gate of the first transistor and its source coupled to the drain of the third transistor, and its gate is the second control terminal coupled to the amplifier output; and the third transistor has its source coupled to the output terminal, and its gate is the third control terminal coupled to the amplifier output, and its back gate is the body terminal coupled to the reference terminal.
Example 19 includes the power supply circuit of Example 18, wherein the first, second and third transistors are n-channel field effect transistors (NFETs), and the power supply circuit further comprises: a first resistor coupled between the gate of the first transistor and the gate of the second transistor; and a second resistor coupled between the gate of the second transistor and the gate of the third transistor.
Example 20 includes the power supply circuit of any one of Examples 11 through 19, wherein the power supply circuit is part of a buck converter circuit or a low dropout (LDO) voltage regulator circuit.
Example 21 is an integrated circuit package comprising the power supply circuit of any one of Examples 11 through 20, wherein the output terminal is a pin or pad of the integrated circuit package.
Example 22 is a power supply circuit, comprising: an amplifier having an amplifier output and a voltage reference input; a first transistor coupled between a voltage supply terminal and an output terminal, the first transistor having a first control terminal coupled to the amplifier output; and a second transistor coupled between the first control terminal and the output terminal, the second transistor having a second control terminal coupled to the amplifier output; wherein a threshold voltage of the first transistor is lower than a second threshold voltage of the second transistor.
Example 23 includes the power supply circuit of Example 22, and further includes: a first resistor coupled between the first control terminal of the first transistor and the second control terminal of the second transistor; and/or a second resistor coupled between the second control terminal of the second transistor and the amplifier output.
Example 24 includes the power supply circuit of Example 22 or 23, wherein the output terminal is a boot capacitor terminal or an output voltage terminal.
Example 25 includes the power supply circuit of any one of Examples 22 through 24, wherein the amplifier is configured as a unity follower.
Example 26 includes the power supply circuit of any one of Examples 22 through 25, and further includes a switch coupled between the first transistor and the output terminal.
Example 27 includes the power supply circuit of any one of Examples 22 through 24, wherein: the first and second transistors are field effect transistors (FETs); the first transistor is a depletion mode or native transistor having its drain coupled to the voltage supply terminal and its source coupled to the output terminal, and its gate is the first control terminal coupled to the amplifier output; and the second transistor is smaller than the first transistor and has its drain coupled to the gate of the first transistor and its source coupled to the output terminal, and its gate is the second control terminal coupled to the amplifier output.
Example 28 includes the power supply circuit of Example 27, wherein the first and second transistors are n-channel field effect transistors (NFETs), and a size ratio of the first transistor to the second transistor is 1000:1 or higher.
Example 29 includes the power supply circuit of any one of Examples 22 through 28, wherein the power supply circuit is part of a buck converter circuit or a low dropout (LDO) voltage regulator circuit.
Example 30 includes an integrated circuit package comprising the power supply circuit of any one of Examples 22 through 29, wherein the output terminal is a pin or pad of the integrated circuit package.
Example 31 is a method for adaptively limiting current in a regulated power supply, the regulated power supply having a terminal (TPROT) to which a voltage (VTERM) is sourced, the regulated power supply further including a first transistor and a second transistor, the first transistor having a first VTH and coupled between a power supply rail and TPROT, and the second transistor having a second VTH greater than the first VTH and coupled between the gate of the first transistor and TPROT. The method includes: receiving a gate drive signal VDRV from a voltage regulating circuit. Responsive to the difference of VDRV−VTERM not being greater than or equal to VTH of the second transistor, the method includes applying substantially all of VDRV to the gate of the first transistor. Responsive to the difference of VDRV−VTERM being greater than or equal to VTH of the second transistor, the method includes: engaging an adaptive voltage divider to reduce the portion of VDRV applied to the gate of the first transistor, and adjusting the voltage divider to further reduce the portion of VDRV applied to gate of the first transistor, based on the value of VDRV−VTERM.
Example 32 includes the method of Example 31, wherein the lower the value of VTERM at terminal TPROT, the more the second transistor turns on.
Example 33 includes the method of Example 32 or 33, wherein: the lower the value of VTERM at terminal TPROT, the lower an RSD_ON value of the second transistor; and the lower the RSD_ON value of the second transistor, the lower the portion of VDRV applied to the gate of the first transistor.
In this description, the term “couple” may cover connections, communications, or signal paths that enable a functional relationship consistent with this description. For example, if device A generates a signal to control device B to perform an action: (a) in a first example, device A is coupled to device B by direct connection; or (b) in a second example, device A is coupled to device B through intervening component C if intervening component C does not alter the functional relationship between device A and device B, such that device B is controlled by device A via the control signal generated by device A.
A device that is “configured to” perform a task or function may be configured (e.g., programmed and/or hardwired) at a time of manufacturing by a manufacturer to perform the function and/or may be configurable (or reconfigurable) by a user after manufacturing to perform the function and/or other additional or alternative functions. The configuring may be through firmware and/or software programming of the device, through a construction and/or layout of hardware components and interconnections of the device, or a combination thereof.
As used herein, the terms “terminal,” “node,” “interconnection,” “pin,” and “lead” are used interchangeably. Unless specifically stated to the contrary, these terms are generally used to mean an interconnection between or a terminus of a device element, a circuit element, an integrated circuit, a device or other electronics or semiconductor component.
A circuit or device that is described herein as including certain components may instead be adapted to be coupled to those components to form the described circuitry or device. For example, a structure described as including one or more semiconductor elements (such as transistors), one or more passive elements (such as resistors, capacitors, and/or inductors), and/or one or more sources (such as voltage and/or current sources) may instead include only the semiconductor elements within a single physical device (e.g., a semiconductor die and/or integrated circuit (IC) package) and may be adapted to be coupled to at least some of the passive elements and/or the sources to form the described structure either at a time of manufacture or after a time of manufacture, such as by an end user and/or a third party.
While the use of particular transistors is described herein, other transistors (or equivalent devices) may be used instead. For example, a p-channel field effect transistor (PFET) may be used in place of an n-channel field effect transistor (NFET) with little or no changes to the circuit. Furthermore, other types of transistors may be used (such as bipolar junction transistors (BJTs)). Furthermore, the devices may be implemented in/over a silicon substrate (Si), a silicon carbide substrate (SiC), a gallium nitride substrate (GaN) or a gallium arsenide substrate (GaAs).
References herein to a field effect transistor (FET) being “ON” means that the conduction channel of the FET is present and drain current may flow through the FET. References herein to a FET being “OFF” means that the conduction channel is not present and drain current does not flow through the FET. A FET that is OFF, however, may have current flowing through the transistor's body-diode.
Circuits described herein are reconfigurable to include additional or different components to provide functionality at least partially similar to functionality available prior to the component replacement. Components shown as resistors, unless otherwise stated, are generally representative of any one or more elements coupled in series and/or parallel to provide an amount of impedance represented by the resistor shown. For example, a resistor or capacitor shown and described herein as a single component may instead be multiple resistors or capacitors, respectively, coupled in parallel between the same nodes. For example, a resistor or capacitor shown and described herein as a single component may instead be multiple resistors or capacitors, respectively, coupled in series between the same two nodes as the single resistor or capacitor.
Uses of the phrase “ground” in the foregoing description include a chassis ground, an Earth ground, a floating ground, a virtual ground, a digital ground, a common ground, and/or any other form of ground connection applicable to, or suitable for, the teachings of this description. In this description, unless otherwise stated, “about,” “approximately” or “substantially” preceding a parameter means being within +/−10 percent of that parameter.
Modifications are possible in the described embodiments, and other embodiments are possible, within the scope of the claims.