A frequency selective surface or FSS has many useful applications. For example, U.S. Pat. No. 5,208,603, by James S. Yee, entitled: FREQUENCY SELECTIVE SURFACE (FSS), issued May 4, 1993, herein incorporated by reference, shows one possible type and application. Considerable work is being done in making an FSS with switchable or adaptive properties, most notably to switch it from being a band pass to a band-stop device. Typically this is accomplished with the fabrication of multiple MEMS switches into the FSS layer.
Such techniques, while being technologically very impressive, require enormously complex fabrication and testing. The MEMS FSS techniques are also very difficult to scale to frequencies much higher than 50-100 GHz because of the complexity of the MEMS switches.
What is needed is an adaptive FSS that is more easily fabricated. Further, what is needed is device that may be easily fabricated to operate at frequencies higher than 50-100 GHz.
In various embodiments, an adaptive spectral surface apparatus is provided including an upper layer having a frequency selective surface, a lower layer being at least partially reflective, and an active dielectric material layer between the upper layer and the lower layer.
In some embodiments, the active dielectric material includes a dielectric material with an adjustable permittivity and/or permeability of the active dielectric layer or thickness. In some embodiments, the active dielectric material may be a dielectric material adapted to change its dielectric constant in response to an applied electric field, an applied magnetic field, or/and thermal stimulus.
It is possible in some embodiments to shift the resonance of the absorptive/reflective spectrum of the adaptive spectral surface apparatus. Further, it is possible in some embodiments to modify the electromagnetic signature of an adaptive spectral surface apparatus.
The features and advantages of the present invention will be better understood with regard to the following description, appended claims, and accompanying drawings where:
In various embodiments, an adaptive spectral surface includes a frequency selective surface (which may be a frequency selective layer) on a dielectric layer. The adaptive spectral surface alters the spectral properties of a surface. It reflects an incident electromagnetic wave, and/or alters an emitted radiation, according to a frequency response. The resonant frequency of the frequency response is based on the geometry of the frequency-selective surface, and the electromagnetic properties of the dielectric layer, such as the permittivity and the permeability. The resonant frequency can be a frequency of maximum reflection or absorption of electromagnetic radiation. The permittivity of the dielectric layer may be modified to change the frequency response of the adaptive spectral surface by changing the resonant frequency of the frequency response.
The active dielectric layer 115 includes a dielectric material, such as, for example, a ferroelectric or a ferrite. Additionally, the active dielectric layer 115 has properties such as a permittivity, permeability, and a size (e.g., length, width, and thickness), which can be modified in response to a stimulus, such as heat or electromagnetic field. In various embodiments, the active dielectric layer 115 is comprised of a material that is a broadband absorber, which absorbs incident electromagnetic radiation in the spectrum of interest.
The upper layer 105 and the active dielectric layer 115 may be fabricated with conventional printed circuit board techniques, electrochemical etching techniques, or photochemical etching techniques. For example, the active dielectric layer 115 may be a thin dielectric layer, and the spatially-periodic pattern 110 of the upper layer 105 may be created by printing textured metallization onto the active dielectric layer 115. For example, the active dielectric layer 115 may have a thickness of 100-500 nanometers.
The lower layer 120 can include or be, depending on the embodiment, a reflective ground plane, a transmissive medium, a neutral semiconductor substrate, or nonexistent. In some embodiments, the active dielectric layer 115 may be composed of ferroelectric materials such as BATiO3, SRTiO3, BaSrTi3, LiTaO3, LiNbO3, LaSrMnO3 or one of several ferrite compositions. The upper layer 105, the active dielectric layer 115, and the lower layer 120 may be formed by using conventional semiconductor processing techniques. Moreover, the adaptive spectral surface 100 may be a laminated structure of the upper layer 105, the active dielectric layer 115, and the lower layer 120.
In one embodiment, the spatially-periodic pattern 110 includes an arrangement of conductive traces. The shape of the conductive pattern may take many forms. For example, in
The FSS pattern may also be composed of the inverse of any pattern mentioned above; the inverse is defined as being the case where the metal is replaced with empty space and the empty space is replaced with metal. Two major classifications of patterns exist in the state of the art, known as series-resonant and parallel-resonant. The names are derived from analogous resonant electronic circuits. The inverse of a series-resonant FSS pattern is a parallel-resonant FSS pattern and vice versa.
Turning to
Referring to
When the active dielectric layer 115 is laminated with a patterned FSS layer 110 configured as a parallel-resonant FSS such as in
A reflecting groundplane 120 can be laminated to the backside of the dielectric layer 115 in another embodiment. The presence of the backplane does not change the qualitative function of the adaptive spectral surface. However, it can be advantageous because (1) it enhances the resonant character of the spectral surface, (2) it enables making the surface thinner, (3) an voltage can be applied to the groundplane in order to apply an electric field to the active dielectric layer 115 and modify its electrical properties, and (4) it enables the spectral surface to be fabricated in a stand-alone sheet that can be applied to existing structures.
The adaptive spectral surface modifies the spectrum of the electromagnetic radiation reflected from the surface. It also modifies the spectrum of blackbody radiation emitted by the surface by modifying the surface's emissivity with respect to frequency.
Shown in
Shown in
In one embodiment, the resonant frequency 215 (
In another embodiment, the resonant frequency 215 is selected in the infrared spectrum of electromagnetic radiation. In this embodiment, changing the resonant frequency of the adaptive spectral surface 100 changes an infrared signature of the adaptive spectral surface 100. Thus, in some embodiments, the surface 100 may be a variable selective emitter, which has an emissivity that changes with frequency. As such, in some embodiments, blackbody/gray-body radiation may be controlled.
In still another embodiment, the resonant frequency 215 is selected in the microwave spectrum of electromagnetic radiation. In this embodiment, changing the resonant frequency changes a microwave signature of the adaptive spectral surface 100. For example, the reflective properties of the adaptive spectral surface 100 can be controlled.
In general, changing the resonant frequency changes the electromagnetic signature of the adaptive spectral surface 100. Although specific frequency ranges are discussed for in the examples above, embodiments are not limited to those frequencies.
In some embodiments, the permittivity of the active dielectric layer 115 (
In other embodiments, thermal plates may be used to change the temperature of the active dielectric layer to shift the resonant frequency as discussed above. In yet other embodiments, a magnetic field may be generated to shift the resonant frequency of the active dielectric layer. In still other embodiments, the active dielectric layer 115 may be composed of piezoelectric materials whose electrical properties are altered with the application of pressure.
The embodiments described herein are illustrative of the present invention. As these embodiments of the present invention are described with reference to illustrations, various modifications or adaptations of the methods and/or specific structures described may become apparent to those skilled in the art. All such modifications, adaptations, or variations that rely upon the teachings of the present invention, and through which these teachings have advanced the art, are considered to be within the spirit and scope of the present invention. Hence, these descriptions and drawings should not be considered in a limiting sense, as it is to be understood that the present invention is not limited to only the embodiments illustrated.
Number | Name | Date | Kind |
---|---|---|---|
1301473 | Marconi et al. | Apr 1919 | A |
3789404 | Munk | Jan 1974 | A |
4125841 | Munk | Nov 1978 | A |
5208603 | Yee | May 1993 | A |
6025725 | Gershenfeld et al. | Feb 2000 | A |
6054947 | Kosowsky | Apr 2000 | A |
6927745 | Brown et al. | Aug 2005 | B2 |
7212147 | Messano | May 2007 | B2 |