This application is based upon and claims the benefit of priority from British Patent Application Number 1310762.8 filed 17 Jun. 2013, the entire contents of which are incorporated by reference.
1. Field of the Disclosure
The present invention relates to an additive layer manufacturing (ALM) method, and more particularly relates to an ALM for the production of a three-dimensional product via successive fusion of parts of a powder bed, said parts corresponding to successive cross-sections of the product.
2. Description of the Related Art
Additive layer manufacturing has become more widely used over recent years in order to produce three-dimensional products. Electron Beam Melting (EBM) is a particular type of ALM technique which is used to form fully dense metal products (such as component parts for gas turbine engines in the aerospace industry). The technique involves using an electron beam in a high vacuum to melt metal powder in successive layers within a powder bed. Metal products manufactured by EBM are fully dense, void-free, and extremely strong.
During operation, the electron beam column 8 is energised under the control of the computer to focus the electron beam onto the powder bed 7 and to scan the beam across the powder bed to melt a predetermined area of the top layer of the powder bed 7 and thereby form a cross-section of the three-dimensional product 2.
The three-dimensional product 2 is built up by the successive laying down of powder layers on the powder bed 7 and melting of the powder in predetermined areas of the layers to form successive cross-sections of the product 2. During a work cycle the work platform 4 is lowered successively relative to the electron beam column 8 after each added layer of powder has been melted, ready for the next layer to be laid down on top. This means that the work platform 4 starts in an initial position which is higher than the position illustrated in
When the electron beam 9 impinges on the top layer of powder within the powder bed 7, the kinetic energy of the electrons is transformed into heat which melts the powder to form the respective cross-section of the product 2. The layer previously scanned usually serves as a rigid support for the next layer above. However, when the product has a shape which defines an overhanging or downwardly facing surface 10 such as is illustrated in
If no support is provided beneath downwardly facing surfaces 10 of the product 2 as it is formed, then localised overheating can occur during melting of the powder by the beam 9 which can result in poor surface finish to the product. Also, distortion of the product can occur and so it has been proposed previously to provide some means of mechanically fixing the product in place relative to a metallic substrate or base plate 11 on which the product is formed.
Previously proposed support structures 12 designed to avoid the problems mentioned above in relation to unsupported downwardly facing surfaces generally consist of an array of thin walls that are manufactured at the same time as the product and from the powder via the same EBM technique. These thin walls are created so as to extend between the downwardly facing surface 10 and another solid surface. The other solid surface can either be a base plate 11 on which the product is formed, or a previously formed upwardly facing surface of the product in the case where the downwardly facing surface 10 is formed above such a surface. These structures 12 are typically referred to as ‘wafers’, and are illustrated schematically in
As illustrated most clearly in
It has often been found that the wafer supports 12 produced by prior art methods can be difficult to remove from some intricately shaped products during subsequent finishing processes.
The deposition of wafer supports 12 must start on a solid substrate, which as mentioned above can either be an area of the component being manufactured, or an underlying base plate. The surface finish and geometrical tolerance of the component in contact with the wafers is also reduced and the total foot print of the supported component is increased. Both reduce the manufacturing efficiency for the component
Distortion of the downwardly facing surface 10 represents another problem that can arise when utilising wafer supports 12. This distortion typically arises from the formation of concave regions 14 on the supported surface in the area between each wafer support, as illustrated schematically in
It is a preferred object of the present invention to provide an improved ALM method for the production of a three-dimensional product.
According to the present invention, there is provided an additive layer manufacturing (ALM) method for the production of a three-dimensional product via successive fusion of parts of a powder bed, said parts corresponding to successive cross-sections of the product, the method comprising the steps of: a) laying down a powder layer on said powder bed, and b) focussing energy on a predetermined area of said powder layer to fuse said area of the powder layer and thereby form a cross-section of the product; wherein steps a) and b) are repeated to form successive cross-sections of the product, and wherein at least one of said steps b) involves focussing said energy on an area of the respective powder layer which is at least partially unsupported by a previously formed cross-section of the product to thereby form a downwardly facing surface of the product, the method being characterised in that at least some of said successive steps b) involve focussing energy on a support area of the respective powder layer which is spaced from the predetermined area of the powder layer, to fuse the support area and thereby form successive cross-sections of a support pin within the powder bed, the support pin extending outwardly from the downwardly facing surface of the product when it is formed, so as to support the downwardly facing surface.
Preferably, at least some of said successive steps in which energy is focussed on a support area of a respective powder layer also involve focussing energy on a said predetermined area of the powder layer to fuse said area of the powder layer and thereby form a cross-section of the product, the support area and the predetermined area being spaced apart.
Said support pin preferably extends generally downwardly from said downwardly facing surface of the product.
Said successive steps in which energy is focussed on a support area of the respective powder layer may involve focussing energy on a plurality of said support areas in spaced relation to one another, to thereby form successive cross-sections of a plurality of said support pins, the support pins being formed in a spaced array within the powder bed.
Preferably, said support pins are parallel to one another. Alternatively, however, the pins may be non-parallel to one another.
In preferred embodiments the or each support pin is approximately cylindrical, and may optionally have a diameter in the range 0.2 mm to 2 mm. It should be noted, however, that the pins can have alternative cross-sectional profiles such as, for example, square or hexagonal.
In some embodiments of the invention the or each said support area is circular, and energy is focussed on successive said support areas of respective powder layers which are in alignment to one another to form successive circular cross-sections of the or each support pin which is thus cylindrical. In such an embodiment, the or each support pin may thus be formed so as to extend vertically within the powder bed.
Alternatively, the or each said support area is approximately elliptical, and energy is focussed on successive said support areas of respective powder layers which are imbricated to form successive elliptical cross-sections of the or each support pin which is thus cylindrical. In such an embodiment, the or each support pin may thus be formed so as to extend non-vertically within the powder bed.
In preferred embodiments of the method, the or each support pin has a free end which is formed within the powder bed.
Preferably, the free end of the or each said support pin is spaced from any other surface of the product, and is also spaced from any base plate used to support the powder bed.
The free end of the or each said support pin may be formed by focussing energy on an initial support area which is supported only by underlying unfused powder in the powder bed, to fuse said initial support area and thereby form the free end.
Preferably, the method involves Electron Beam Melting and is used to manufacture metal products. Accordingly, said powder is preferably metal powder, and said steps of focussing energy on said areas of the powder layers preferably involves the use of an electron beam to melt said areas of the powder layers.
According to another aspect of the present invention, the above-defined method may be used to manufacture a component of a gas turbine engine, and involves the step of removing the or each said support pin from said product to form said component.
So that the invention may be more readily understood, and so that further features thereof may be appreciated, embodiments of the invention will now be described by way of example with reference to the accompanying drawings in which:
Turning now to consider the drawings in more detail, the method of the present invention will now be described in detail, with particular reference to
The technical effect of the present invention can most easily be understood with regard to
As illustrated most clearly in
A supporting structure for the downwardly facing surface 21 which is formed from support pins 22 of the type illustrated has been found to be quicker and less expensive to produce than the prior art wafer structures 12, which makes their use very significant in a commercial ALM context.
It has been found that the supporting pins 22 do not trap un-melted powder feedstock between them to the same degree as prior art wafer structures, and they thus permit more efficient recycling of powder. It has also been found that the supporting pins 22 actually use less powder in their manufacture, which further reduces wastage of powder feedstock. The supporting pins 22 can also provide better control and reduction of distortion on the downwardly facing surface 22 and are also more easily removed during subsequent finishing of the product. As will become apparent from the following description of the method, the support pins 22 can be formed so as to have free ends formed within a powder bed, rather than needing to be built up from lower rigid surfaces such as might be defined by other parts of the product, or by a metal base plate inserted within the powder bed.
The method of the present invention can be performed using apparatus generally similar to the apparatus shown in
The table 4 is then lowered and another layer of powder is laid on top of the first layer 24, thereby adding to the powder bed 25, whereupon the electron beam 9 is again focussed on and scanned across an identically sized and positioned predetermined area of the top layer, thereby forming the next cross-section of the product, on top of the first cross-section.
The steps of laying down a layer of powder and then focussing/scanning the electron beam over a predetermined area of the layer are repeated to form successive cross-sections of the product 20, thereby gradually building the product from the bottom up. During the initial stages of the method, these steps are repeated to form identical and vertically aligned cross-sections of the product, thereby building up the lower part of the product having the vertical surface 23. It is to be noted that during this stage of the method, the respective predetermined areas 26 of each successive layer of powder are thus all aligned with one another.
As will be appreciated, focussing the electron beam 9 on each of the support areas 27 melts the powder in those areas, thereby fusing the powder. The fused support areas 27 of the top layer of powder thus form initial cross-sections of respective support pins 22 similar to those illustrated in
It is to be noted that the free ends 28 of the support pins 22 are thus formed in the top layer of the powder bed 25 (at the stage illustrated in
A series of further successive layers of powder then continue to be laid on the powder bed 25. When each layer has been laid, the electron beam 9 is focussed on correspondingly shaped and positioned support areas 27 to melt the powder material in the support areas and thereby steadily build up successive cross-sections of the support pins 22, as shown schematically in
As will also be evident from
As will also be noted from
The subsequent cross-sections of the relatively wide upper region of the product 20 are then formed by melting substantially identical predetermined regions 26 of successive powder layers in a generally conventional manner.
As will be appreciated, when the product 20 has been fully formed via the method described above, it may be removed from the EBM apparatus and from the powder bed 25, whereupon the support pins 22 can be removed during a subsequent finishing process. As indicated above, the support pins 22 have been found to be significantly easier, and less wasteful, to remove than prior art wafer structures.
As will be appreciated, the invention has been described above with specific reference to an embodiment in which the support pins 22 are parallel to one another and are formed such that they extend substantially vertically within the powder bed. This is achieved by melting support areas 27 of successive layers which are substantially circular and which are arranged in alignment with one another, such that respective cross-sections of the pins 22 are built up vertically. However,
As will be noted from
When used in this specification and claims, the terms “comprises” and “comprising” and variations thereof mean that the specified features, steps or integers are included. The terms are not to be interpreted to exclude the presence of other features, steps or integers.
The features disclosed in the foregoing description, or in the following claims, or in the accompanying drawings, expressed in their specific forms or in terms of a means for performing the disclosed function, or a method or process for obtaining the disclosed results, as appropriate, may, separately, or in any combination of such features, be utilised for realising the invention in diverse forms thereof.
While the invention has been described in conjunction with the exemplary embodiments described above, many equivalent modifications and variations will be apparent to those skilled in the art when given this disclosure. Accordingly, the exemplary embodiments of the invention set forth above are considered to be illustrative and not limiting. Various changes to the described embodiments may be made without departing from the spirit and scope of the invention.
Number | Date | Country | Kind |
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1310762.8 | Jun 2013 | GB | national |