Patent Application
20240085118
The present teachings relate to oscillating heat pipe (OHP) devices, and more particularly to OHP devices manufactured using additive manufacturing and methods of manufacturing devices such that the OHP microchannels can be flush free of powder residue resulting from the additive manufacturing.
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Additive manufacturing (e.g., SLS (selective laser sintering), MBJ (metal binder jet), EBAM (electron beam AM), etc.) of oscillating heat pipe (OHP) devices has been attempted but has resulted in the OHP microchannels of the devices (e.g., microchannels between 0.005 inches and 0.100 inches in wall thickness, depth, and width) containing powder residue (e.g., powder left over from printing remains in channels). If this residual powder is not removed from the OHP microchannels, it can cause obstructions, blockages and increased viscous losses that will negatively affect the operation and functionality of the OHP device. For instance, the residual powder can trap or block the working fluid such that the working fluid will be prevented from flowing through a portion of the OHP channels, reduce or stop flow and/or increase the pressure gradient with the OHP channel, thereby reducing cooling efficiency and functionality or preventing operation of the OHP device.
The present disclosure provides an OHP device that is fabricated using additive manufactures, and manufacturing methods thereof. Generally, the OHP device of the present disclosure comprises a plurality of OHP channels that are open on one end to allow for the channels to be flushed to clear out the channels. Another term for the removal of powder from these flush ports may be depowdering the channel field. Furthermore, in order to be able to seal the OHP channels after flushing, the channels are constructed to have a weldable geometry. For example, in various embodiments the OHP device of the present disclosure comprises a chamfer feature (with regard to a cross-sectional view) of the exit ports to enable welding thereof. The chamfer feature can be formed in the exterior wall of the open ends of the channels to allow for easy TIG or laser welding to create a final seal of the channels.
For example, in various embodiments the present disclosure provides an oscillating heat pipe (OHP) device that comprise a body having a top face, a bottom face and at least one side face, a plurality of hollow OHP channels formed internally within the body, and an oscillating heat pipe (OHP) flushing duct system. The flushing duct system is formed in at least one of a body top face, a bottom face and at least one side face of an OHP device. The flushing duct system fluidly connects one or more of a plurality of OHP channels formed internally within the OHP device to an ambient environment of the device. The flushing duct system comprising at least one welding receptacle.
This summary is provided merely for purposes of summarizing various example embodiments of the present disclosure so as to provide a basic understanding of various aspects of the teachings herein. Various embodiments, aspects, and advantages will become apparent from the following detailed description taken in conjunction with the accompanying drawings which illustrate, by way of example, the principles of the described embodiments. Accordingly, it should be understood that the description and specific examples set forth herein are intended for purposes of illustration only and are not intended to limit the scope of the present teachings.
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present teachings in any way
Corresponding reference numerals indicate corresponding parts throughout the several views of drawings.
The following description is merely exemplary in nature and is in no way intended to limit the present teachings, application, or uses. Throughout this specification, like reference numerals will be used to refer to like elements. Additionally, the embodiments disclosed below are not intended to be exhaustive or to limit the invention to the precise forms disclosed in the following detailed description. Rather, the embodiments are chosen and described so that others skilled in the art can utilize their teachings. As well, it should be understood that the drawings are intended to illustrate and plainly disclose presently envisioned embodiments to one of skill in the art, but are not intended to be manufacturing level drawings or renditions of final products and may include simplified conceptual views to facilitate understanding or explanation. As well, the relative size and arrangement of the components may differ from that shown and still operate within the spirit of the invention.
As used herein, the word “exemplary” or “illustrative” means “serving as an example, instance, or illustration.” Any implementation described herein as “exemplary” or “illustrative” is not necessarily to be construed as preferred or advantageous over other implementations. All of the implementations described below are exemplary implementations provided to enable persons skilled in the art to practice the disclosure and are not intended to limit the scope of the appended claims.
Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a”, “an”, and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises”, “comprising”, “including”, and “having” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps can be employed.
When an element, object, device, apparatus, component, region or section, etc., is referred to as being “on”, “engaged to or with”, “connected to or with”, or “coupled to or with” another element, object, device, apparatus, component, region or section, etc., it can be directly on, engaged, connected or coupled to or with the other element, object, device, apparatus, component, region or section, etc., or intervening elements, objects, devices, apparatuses, components, regions or sections, etc., can be present. In contrast, when an element, object, device, apparatus, component, region or section, etc., is referred to as being “directly on”, “directly engaged to”, “directly connected to”, or “directly coupled to” another element, object, device, apparatus, component, region or section, etc., there may be no intervening elements, objects, devices, apparatuses, components, regions or sections, etc., present. Other words used to describe the relationship between elements, objects, devices, apparatuses, components, regions or sections, etc., should be interpreted in a like fashion (e.g., “between” versus “directly between”, “adjacent” versus “directly adjacent”, etc.).
As used herein the phrase “operably connected to” will be understood to mean two are more elements, objects, devices, apparatuses, components, etc., that are directly or indirectly connected to each other in an operational and/or cooperative manner such that operation or function of at least one of the elements, objects, devices, apparatuses, components, etc., imparts or causes operation or function of at least one other of the elements, objects, devices, apparatuses, components, etc. Such imparting or causing of operation or function can be unilateral or bilateral.
As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. For example, A and/or B includes A alone, or B alone, or both A and B.
Although the terms first, second, third, etc. can be used herein to describe various elements, objects, devices, apparatuses, components, regions or sections, etc., these elements, objects, devices, apparatuses, components, regions or sections, etc., should not be limited by these terms. These terms may be used only to distinguish one element, object, device, apparatus, component, region or section, etc., from another element, object, device, apparatus, component, region or section, etc., and do not necessarily imply a sequence or order unless clearly indicated by the context.
Moreover, it will be understood that various directions such as “upper”, “lower”, “bottom”, “top”, “left”, “right”, “first”, “second” and so forth are made only with respect to explanation in conjunction with the drawings, and that components may be oriented differently, for instance, during transportation and manufacturing as well as operation. Because many varying and different embodiments may be made within the scope of the concept(s) taught herein, and because many modifications may be made in the embodiments described herein, it is to be understood that the details herein are to be interpreted as illustrative and non-limiting.
As described above, in various embodiments the flushing process can comprise forcing a flushing fluid through the OHP channel system 14 to flush out and remove any debris and/or any residual fabrication dust or particles. In such instances, the flushing fluid can be any suitable flushing fluid such as acetone, isopropyl alcohol (IPA), or deionized water. Alternatively, it is envisioned that the OHP channel system 14 can be flushed, via the flushing duct system 18, using any other suitable flushing method, for example, gas flushing with pressurized nitrogen dioxide (N2), feeding a wire or micro-size brush through OHP channel system 14, using an acid etching process, using a thermal shock method, using a vibration method, etc. Furthermore, although the body 22 of OHP device 10 is exemplarily illustrated throughout the various figures to generally have a 3D rectangular cuboid shape, the OHP device body 22 can have any desired shape. More specifically, in various embodiments the OHP device 10 comprising the OHP channel system 14 and the flushing duct system 18 is exemplarily described and illustrated herein as being an OHP electronics device for use in applications where ventilation and/or ambient air cooling of the OHP device 10 are unavailable or restricted. For example, the OHP device 10 as described herein can be utilized for aircraft electronics, wherein the body 22 is a flat rectangular cuboid electronics substrate (e.g., a circuit board) having the OHP channel system 14 and the flushing duct system 18 integrally formed therein. However, it is envisioned that the OHP device 10 can be utilized in any complex geometry in which an OHP device 10 will well serve the respective thermal needs. For example, the OHP device 10 can have any shape and geometry needed to suit any configuration and application, such as electronics boards for aircraft battery banks that have curved edge regions (e.g., contour to the shape of each battery cell). Furthermore, the OHP device 10 can be something other than a substrate for electronics. Wherein the OHP device 10 can have a variety of complex geometries configured to suit a particular need. For example, it is envisioned that OHP device 10 can be a contoured panel configured as a leading edge of an aircraft wing.
Referring now to
The OHP channels 26 can comprise one or more closed loop OHP channel 26 and/or one or more open loop OHP channel 26. Additionally, in various embodiments, the body 22 OHP device 10 can comprise one or more two-dimensional (2D) planar layer of OHP channels 25, wherein each OHP channel 26 lies within a respective 2D planar layer. That is, each OHP channel 26 lies within a respective two-coordinate plane (i.e., within a respective X and Y coordinate plane). Alternatively, in various embodiments, the body 22 OHP device 10 can comprise one or more three-dimensional (3D) OHP channel 26 that is formed within the body 22 to lie within a three-coordinate space (i.e., within an X, Y and Z coordinate space). In all embodiments, each OHP channel 26 is fluidly connected to a respective one of the flushing duct system 18. In various embodiments, the OHP channels 26 are micro-sized channels (i.e., micro-channels) having maximum cross-sectional height and width between 0.001 inch and 1.0 inch (e.g., between 0.005 inch and 0.100 inch). Additionally, the OHP channels can have any cross-sectional shape. For example, the cross-sectional shape of the OHP channels 26 square, rectangular, triangular, teardrop, trapezoidal, pentagonal, hexagonal, polygonal, chamfered roof shape or any other desired cross-sectional shape and remain within the scope of the present disclosure. In addition to the flushing duct system 18 fluidly connecting each OHP channel 26 to the ambient environment so that each OHP channel 26 can be flushed to remove all debris and/or sintering powder residue the flushing duct system 18 is structured and operable to provide a means for each OHP channel 26 to be hermetically sealed after flushing.
Generally, the OHP device 10 is a passive heat transfer device that transports heat using a saturated two-phase working fluid hermetically sealed within the capillary-sized OHP channels 26 (e.g., micro-channels). The hydraulic diameter of the OHP channels 26 is small enough and the surface tension of the working fluid is great enough such that the OHP channels 26 have a capillary effect on the working fluid causing the working fluid to disperse itself throughout the interior area of the OHP channels 26 in discrete liquid “plugs” and vapor “bubbles”. As described above, the OHP channels 26 have a meandering path traveling between areas of the body 22 in thermal contact with one or more heat source (e.g., as an electronic device such as an integrated circuit semiconductor device, or other heat generating device that is provided, disposed, integrally formed with, or fabricated on the body 22) and areas of the body 22 in thermal contact with one or more heat sink or cooling zone. When heat from a heat source is absorbed by the working fluid, the resulting working fluid evaporation and condensation process, as described below, creates pressure imbalances within the OHP channels 26 that, coupled with the random distribution of liquid plugs and vapor bubbles, generates motion of the two-phase mixture within the OHP channels.
More specifically, the OHP channels 26 are integrally formed within the body 22 and pass near and/or adjacent and in close proximity (e.g., within approximately one to hundreds of microns) to one or more heat source and the capillary dimensions of the OHP channels 26 (e.g., from hundreds of nanometers to tens of thousands of microns, and in some instances up to approximately 1.0 ince) force the working fluid into a train of liquid plugs and vapor bubbles. As heat is absorbed from the heat source(s) by the working fluid within the OHP channels 26, evaporation and condensation of the working fluid occurs that cause a pressure imbalance from heat absorption region(s) (also known as evaporator region(s)) of the OHP channels 26 to heat rejection region(s) (also known as condenser region(s)) of the OHP channels 26. The heat absorption regions/evaporator regions of the OHP channels 26 are areas OHP channels 26 where the OHP channels 26 pass within the body 22 near and/or adjacent and close proximity to one or more heat source regions of the body 22. The heat source regions of the body 22 are regions of the body 22 having one or more heat generating device disposed on or integrally formed with the body 22 (e.g., one or more electronic device such as an integrated circuit semiconductor device, or other heat generating device that is provided, disposed, integrally formed with, or fabricated on the body 22). The heat rejection region(s)/condenser region(s) of the OHP channels 26 are the regions of the OHP channels 26 that pass within the body 22 near and/or adjacent a cooling zone of the body 22. The cooling zone of the body 22 is a region of the body 22 not occupied by a heat generating device and/or near and/or adjacent and/or in close proximity to and in thermally conductive contact with one or more heat sink. For example, the cooling zone(s) of the body 22 is/are region(s) of the body 22 where the OHP channels 26 pass within the body 22 near and/or adjacent a region of top face 22A, the bottom face 22B, or a side face 22C that is not occupied by a heat generating device and is/are exposed to ambient air, and/or is/are in thermally conductive contact with one or more heat sink.
This pressure imbalance forces the working fluid to move within the OHP channels 26, transferring heat (e.g., both latent and sensible heat) from the heat absorption region(s)/evaporation regions(s) of the OHP channels 26 to the heat rejection region(s) 22/condenser regions(s) of the OHP channels 26, thereby removing heat from, and cooling, the respective heat generating devices, and the overall body 26. More specifically, when heat is absorbed at the heat absorption region(s) of the OHP channels 26, bubbles are formed by partial vaporization of the working fluid within the channels in the heat source region(s). The bubbles' expansion is limited radially by the fixed diameter of the OHP channels 26 and thus, the bubbles expand axially (i.e., along the length of the OHP channels 26). The axial-wise expansion dislodges neighboring plugs/bubbles in the OHP channels 26 and forces them away from the heat source region(s) of the body 22. The dislodged vapor phase working fluid moves through the OHP channels 26 to the heat rejection region(s) adjacent the cooling zones of the body 22 where the heat of the vapor phase working fluid is rejected into the ambient air and/or heat sink such that the vapor phase working fluid converts back to liquid phase, which then moves back to the heat absorption region(s) of the OHP channels 26 to repeat the vaporization-condensation cycle to continuously remove heat from, and cool, the respective heat generating devices, and the OHP device 10 overall.
As described above, the pattern of OHP channels 26 can form a closed-loop (e.g., circulating), or they can be sealed at each end to form an open-loop (e.g. serpentine or linear). Furthermore, the pattern of OHP channels 26 can travel in two dimensions (i.e., in x-y plane or in a r-θ plane) or in all three physical dimensions (i.e., x-y-z and/or r-θ-h). The cross-sectional geometry of the OHP channels 26 can have generally any desired shapes and OHP channel lengths can vary (e.g., from less than 1 cm to greater than 10 m) so long as the OHP channels 26 maintain the capillary effect where the working fluid inside the channel volume is dispersed in discrete liquid “plugs” and vapor “bubbles”. The working fluid can be any desired working fluid selected based on its thermophysical properties (e.g., vapor pressures, latent heats, specific heats, densities, surface tensions, critical temperatures, pour points, viscosities, etc.) and compatible with the material(s) used to form the body and channels.
As also described above, the OHP device 10, can be made from a wide range of material and/or fluid combinations and in generally any shape and size desired in order to meet the specifications of a given application's heat source(s) and heat sink(s) or rejection regions(s) (e.g. the respective sizes, heat loads, heat fluxes, locations, temperatures, gravitational fields, coefficients of thermal expansion requirements, etc., of the OHP device 10). More particularly, the OHP device 10 can be formed using any desired manufacturing or fabrication process. As exemplarily described herein, in various embodiments the OHP device 10 comprising the OHP channel system 14 and the flushing duct system 18 disclosed herein is ideally suited for fabrication utilizing additive manufacturing techniques to inherently form the OHP channels 26 within the body 22 such as SLS (selective laser sintering), SLM (selective laser melting), DMLM (direct metal laser melting), PBF (powder bed fusion), MBJ (metal binder jet), Cold Spray, Electrochemical additive manufacturing (ECAM), EBAM (electron beam additive manufacturing), or any other powder based directed energy deposition technique.
Generally, any suitable material can be used with such additive manufacturing techniques such as steels, cobalt chromes, precious metals such as gold, silver platinum, etc., or other suitable materials including but not limited to AlSi10Mg, Al6061, and other aluminum alloys; aluminum metal matrix composites; 316SS, 17-4PH, 316L, and other Fe-based printed alloys; Inconel 625, Inconel 718, Hastelloy X, and other Ni super alloys; C103, Niobium alloys, Tungsten alloys, Molybdenum alloys, specifically high Rhenium alloys, Ti6Al4V and other Titanium alloys; 99%+Cu, GRCop-84, GRCop-42, Cu110, and other copper alloys; ceramic printed with binder jet, or alternatively various not-metals such as polymers, composites, glass, etc. When the OHP device 10 is fabricated using such additive manufacturing techniques, the OHP channel system 14 and the flushing duct system 18 can be directly printed in place, or alternatively the flushing duct system 18 can be cut into the OHP device 10 with a ball endmill or other milling operation.
Although the OHP device 10 comprising the flushing duct system 18 disclosed herein is ideally suited for devices fabricated using additive manufacturing techniques, it is envisioned that alternatively, in various other embodiments, the OHP device 10 can be fabricated or manufactured using other fabricating or manufacturing methods or processes, for example the OHP channel system 14 (comprising the OHP channels 26) and the flushing duct system 18 can be formed using bulk micromachining, surface micromachining, deep reactive ion etching, LIGA (lithography, electroplating, and molding), hot embossing, micro-EDM (electrical discharge machining), XeF2 Dry Phase Etching, focused ion beam micromachining, CVD (chemical vapor deposition), and/or PVD (physical vapor deposition) and then sealing the OHP channels 26 with a lid or cover; welding, laminating brazing or diffusion bonding multiple layers together, or any other suitable known or unknown manufacturing or fabricating process.
Referring now to
The angle of the tapered/beveled/chamfered/angled linear welding trough sidewall(s) 34 relative to the outer surface of the one or more top, bottom and/or side face 22A, 22B and/or 22C can be any desired angle, e.g., 25°, 30°, 35°, 40°, 45°, 50°, etc. The tapered/beveled/chamfered/angled sidewall(s) 34 ‘open up’ or widen the elongated linear welding trough(s) 301 at the outer surface of the one or more top, bottom and/or side face 22A, 22B and/or 22C to aid in the efficacy of hermetically sealing the OHP channels 26. Particularly, the tapered/beveled/chamfered/angled sidewall(s) 34 provide increased surface area for the sealant (e.g., laser welding material or TIG welding material or other weld filler alloy) to contact and adhere to the sidewall(s) 34 (e.g., provides better mechanical bond with the sidewall(s) 34 and avoids voids in the weld and provides a hermetic seal). Additionally, the widened elongated linear welding trough(s) 301 provide(s) a larger target zone in which to apply the sealant (e.g., laser welding material or TIG welding material or other weld filler alloy). Additionally, in various embodiments wherein the sealant is a laser welding alloy and the OHP channels 26 is/are hermetically sealed using a laser welding process, the widened elongated linear welding trough(s) 301 provide(s) a broader field of view for the welding laser.
Referring now to
In various embodiments, the flushing duct system 18 comprises at least one flush port 38 and the one or more welding receptacle 30. In various instances the welding receptacle(s) 30 comprises one or more elongated linear welding trough 302 disposed within one or more of the top, bottom and/or side faces 22A, 22B and/or 22C. Each flush port 38 is fluidly connected to a corresponding one of the plurality of OHP channels 26 and the linear welding trough 302 fluidly connects with the plurality of OHP channels 26 via the flush port(s) 38. Each of the elongated linear welding trough(s) 302 extend(s) linearly across at least a portion of the respective top, bottom and/or side face 22A, 22B and/or 22C. For example, as exemplarily illustrated in
In various embodiments, the flush port(s) 38 and the elongated linear welding trough(s) 302 is/are disposed within the plane P of the OHP channels 26. That is, as exemplarily illustrated in
In various embodiments, the elongated linear welding trough(s) 302 comprise(s) one or more tapered, beveled, chamfered, or angled sidewall 42. For example, as exemplarily illustrated in
Additionally, in various embodiments, the mouth 38B of each flush port 38 comprises one or more tapered, beveled, chamfered, or angled sidewall 46. For example, as exemplarily illustrated in
Referring now to
In various embodiments, the welding receptacles/flush port mouths 30/50B comprise one or more tapered, beveled, chamfered, or angled sidewall 54. For example, as exemplarily illustrated in
Furthermore, it is envisioned that in various embodiments the dimensions of the OHP channels 26 (e.g., the depth and/or width of the OHP channels 26) can be larger than the dimensions of the flush port neck (e.g., flush port neck 38B and/or 50B). In such instances, it is envisioned that each OHP channel 26 can be formed to have a tapered geometry in the area where the flush port neck 38B/50B extends from the OHP channel 26, as exemplarily illustrated in
Referring now to
In various embodiments, the OHP flushing duct system 18 comprises a plurality of flushing conduits 58 that are fluidly connected to one or more OHP conduit 26 out-of-plane with OHP channels 26. That is, the flushing conduits 58 are integrally formed with, fluidly connected to and extend from the OHP channels 26 at any desired angle. For example, the flushing conduits 58 are integrally formed with, fluidly connected to and extend from the OHP channels 26 at a 20°, 30°, 40°, 50°, 60°, 70°, 70°, 90°, etc. angle. The flushing conduits 58 comprise a proximal end 58A and a distal end 58B. In various embodiments, as exemplarily illustrated in
In various embodiments, as exemplarily illustrated in
The method or process of fabricating, flushing and hermetically sealing the OHP device 10 is generally as follows. Initially, the OHP device 10 is fabricated utilizing any desired fabrication method (e.g., SLS (selective laser sintering), MBJ (metal binder jet), EBAM (electron beam AM), etc.) having the OHP channel system 14 (comprising the OHP channels 26) and the flushing duct system 18 (comprising the welding receptacle(s) 30) integrally formed within the body 22 as in the various embodiments described above. Subsequently, the OHP channels are flushed out or depowdered and cleaned to remove any debris and/or any residual fabrication dust, powder or particles disposed within the OHP channels 26 by forcing a flushing fluid through the respective OHP channel system 14, via the flushing duct system 18. The flushing fluid can be any suitable flushing fluid such as acetone, isopropyl alcohol (IPA), or deionized water. Alternatively, it is envisioned that the OHP channel system 14 can be flushed, via the flushing duct system 18, using any other suitable flushing method, for example, gas flushing with pressurized nitrogen dioxide (N2), feeding a wire or micro-size brush through OHP channel system 14, using an acid etching process, using a thermal shock method, using a vibration method, etc. Once the OHP channels 26 have been flushed, the OHP channels can be hermetically sealed utilizing the welding receptacle(s) 30. Particularly, the welding receptacle(s) 30 is/are structured and operable to receive a sealant (e.g., a welding material for use with laser welding or tungsten inert gas (TIG) welding) to hermetically seal the OHP channels 26 from the ambient environment after the OHP channels 26 have been flushed. Thereafter, the OHP channels are at least partially filled with a saturated two-phase working utilizing a filler port (not shown) as is generally known in the art. It is envisioned that in various embodiment one or more of the flush ports 38/50 can be utilized as a filler port.
Although various embodiments of the welding receptacle 30 have been described herein to comprise one or more tapered, beveled, chamfered, or angled sidewall, edge or rim, it is envisioned that in various embodiments the welding receptacle 30 can be milled into the respective top, bottom and/or side faces 22A, 22B and/or 22C using a ball end mill. In such embodiments, the respective welding receptacle 30 sidewall, edge or rim will have an arcuate, filleted or radiused surface, as opposed to the flat tapered, beveled, chamfered, or angled surface described above. However, the The arcuate/filleted/radiused sidewalls, edges or rims will provide substantially the same benefits and advantages. Particularly, the arcuate/filleted/radiused sidewalls, edges or rims will. ‘open up’ or widen the respective welding receptacle(s) 30 to aid in the efficacy of hermetically sealing the OHP channels 26. More particularly, the arcuate/filleted/radiused sidewalls, edges or rims provide increased surface area for the sealant (e.g., laser welding material or TIG welding material or other weld filler alloy) to contact and adhere to the arcuate/filleted/radiused sidewalls, edges or rims (e.g., provides better mechanical bond with the arcuate/filleted/radiused sidewalls, edges or rims and avoids voids in the weld and provides a hermetic seal). Additionally, the widened welding receptacle(s) 30 provide a larger target zone in which to apply the sealant (e.g., laser welding material or TIG welding material or other weld filler alloy). Additionally, in various embodiments wherein the sealant is a laser welding alloy and the OHP channels 26 is/are hermetically sealed using a laser welding process, the widened welding receptacle(s) 30 provide a broader field of view for the welding laser.
It should be noted that the diameter of the flush port necks described above (e.g., flush port necks 38B and 50B) and the flushing conduits described above (e.g., flushing conduits 58) can be based on the diameter of the residual powder resulting from the respective additive manufacturing process and material. However, empirical testing has shown that flush port necks described above (e.g., flush port necks 38B and 50B) and the flushing conduits described above (e.g., flushing conduits 58) having a diameter of 0.040 inches or greater, and/or a hydraulic diameter of between 0.020 and 0.250 inches is generally suitable to thoroughly flush, depowder, and clean the OHP channels 26 of the OHP devices 10 described herein utilizing the flushing features and functions describe herein.
The description herein is merely exemplary in nature and, thus, variations that do not depart from the gist of that which is described are intended to be within the scope of the teachings. Moreover, although the foregoing descriptions and the associated drawings describe example embodiments in the context of certain example combinations of elements and/or functions, it should be appreciated that different combinations of elements and/or functions can be provided by alternative embodiments without departing from the scope of the disclosure. Such variations and alternative combinations of elements and/or functions are not to be regarded as a departure from the spirit and scope of the teachings.
This invention was developed in the course of work under National Aeronautics and Space Administration (NASA) Contract 80NSSC21C0339. The U.S. government may possess certain rights in the invention.
| Number | Date | Country | |
|---|---|---|---|
| 63404800 | Sep 2022 | US |
