Claims
- 1. A method of preparing an adhesive-backed article, said method comprising:
embossing a release liner to form a microstructured release liner; coating a pressure-sensitive adhesive layer onto the microstructured release liner, wherein the pressure-sensitive adhesive layer has a microstructured surface facing the microstructured release liner; and laminating a compliant film to a surface of the pressure-sensitive adhesive layer that is opposite the release liner, wherein when the release liner is removed to expose the microstructure surface of the pressure-sensitive adhesive layer, said microstructure surface has channels that define exit pathways providing a continuous fluid egress to a periphery of said microstructured surface, said channels having a volume of at least 1×103 μm3 per any 500 μm diameter circular area of the microstructured surface and having an aspect ratio of about 0. 1 to about 20.
- 2. The method of claim 1, wherein the channels have a cross-sectional form of v-grooves, u-grooves, rectangles, trapezoids, or combinations thereof.
- 3. The method of claim 1, wherein the microstructured surface comprises a plurality of structures which at least partially define the channels.
- 4. The method of claim 3, wherein the structures are selected from hemispheres, prisms, pyramids, ellipsoids, or a combination thereof.
- 5. The method of claim 3, wherein the structures are truncated.
- 6. The method of claim 3, wherein the structures are regularly placed about the microstructured surface of the pressure-sensitive adhesive.
- 7. The method of claim 3, wherein the structures are randomly placed about the microstructured surface of said adhesive.
- 8. The method of claim 3, wherein the structures are arranged at a pitch of about 400 μm or less.
- 9. The method of claim 3, wherein the structures have a height of about 3 μm to about 50 μm.
- 10. The method of claim 1, wherein the compliant film comprises a primer layer on a surface laminated to the pressure-sensitive adhesive layer.
- 11. The method of claim 1, wherein the compliant film has a thickness of about 300 μm or less.
- 12. The method of claim 1, wherein the release liner comprises a thermoplastic film.
- 13. The method of claim 1, wherein the release liner comprises a paper laminated or coated with a thermoplastic material.
- 14. The method of claim 1, wherein the release liner comprises a polyethylene coated paper.
- 15. The method of claim 1, wherein the pressure-sensitive adhesive comprises a solvent based acrylic pressure-sensitive adhesive.
- 16. A method of preparing an adhesive-backed article comprising:
providing a compliant film: coating the compliant film with a pressure-sensitive adhesive layer; embossing the pressure-sensitive adhesive layer to form to microstructured surface having channels that define exit pathways providing a continuous fluid egress to a periphery of said microstructured surface, said channels having a volume of at least 1×103 μm3 per any 500 μm diameter circular area of the microstructured surface and having an aspect ratio of about 0.1 to about 20.
- 17. A method of applying an adhesive-backed article to a substrate, said method comprising:
providing an adhesive-backed article comprising a pressure-sensitive adhesive layer having a microstructured surface and an opposite surface bonded to a compliant film, said microstructured surface having channels that define exit pathways providing a continuous fluid egress to a periphery of said microstructured surface, said channels having a volume of at least 1×103 μm3 per any 500 μm diameter circular area of the microstructured surface and having an aspect ratio of about 0.1 to about 20; adhering the microstructured surface of the pressure-sensitive adhesive layer to the surface of a substrate, wherein the pressure-sensitive adhesive has an initial wet out test result of at least 85 percent and the channels are substantially undetectable on an outer surface of the compliant film.
- 18. The method of claim 17, wherein upon initial contact with the substrate, said pressure-sensitive adhesive layer has an initial surface contact area of about 60 percent or less of the total area of the pressure-sensitive adhesive layer.
- 19. The method of claim 17, wherein the compliant film after adherence to the substrate has a surface roughness similar to that of the compliant film itself.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation-in-part of U.S. patent application Ser. No. 09/311,101, filed May 13, 1999, now allowed.
Continuation in Parts (1)
|
Number |
Date |
Country |
| Parent |
09311101 |
May 1999 |
US |
| Child |
10357151 |
Feb 2003 |
US |