1. Technical Field
The present disclosure generally relates to an adhesive bonding assembly and a method for making the same.
2. Description of the Related Art
Generally, two components of an electronic device may be bonded to each other by means such as hot-pressure welding, cold-pressure welding, or rivet jointing. However, if the components are small or a nice appearance is required, the components may be bonded to each other by an adhesive bonding technique to form an adhesive bonding assembly.
Referring to
Therefore, a new adhesive bonding assembly and a method for making the same is desired to overcome the above-described shortcomings.
An adhesive bonding assembly includes a first component, a second embodiment, and an adhesive substance. The first component includes a first bonding surface and an operation surface opposite to the first bonding surface. A channel is defined in the first component extending from the first bonding surface to the operation surface. The second component includes a second bonding surface contacting the first bonding surface. The adhesive substance is received in the channel for bonding the first component and the second component together.
A method for making an adhesive bonding assembly, includes providing a first component including a first bonding surface and an operation surface opposite to the first bonding surface, a second component including a second bonding surface, and an adhesive substance for bonding the first component and the second component together, wherein a channel is defined in the first component extending from the first bonding surface to the operation surface; positioning the first component on the second component such that the first bonding surface contacts the second bonding surface of the second component, and injecting the adhesive substance into the channel of the first component such that the first component is bonded to the second component by the adhesive substance.
Other advantages and novel features will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present adhesive bonding assembly. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views, and all the views are schematic.
Reference will now be made to the drawings to describe various inventive embodiments of the present adhesive bonding assembly in detail.
Referring to
The first component 11 includes a first bonding surface 15 and an operation surface 17 opposite to the first bonding surface 15. The first component 11 defines a plurality of channels 19 extending from the first bonding surface 15 to the operation surface 17. In the first embodiment, the channels 19 are circular through holes. The second component 13 includes a second bonding surface 21 contacting the first bonding surface 15. The first bonding surface 15 is smaller than the second bonding surface 21.
Referring to
Referring to
Referring to
An embodiment of a method for making the above-described adhesive bonding assemblies 10, 20, 30 includes the steps described below. Depending on the embodiment, certain of the steps described below may be removed, others may be added, and the sequence of steps may be altered.
In a first step, a first component 11, 25, 37, a second component 13, 26, 38, and an adhesive substance 14 for bonding the first component 11 and the second component 13 together are provided. In a second step, the first component 11, 25, 37 is positioned on the second component 13, 26, 38 with the first bonding surface 15, 31, 45 abutting a predetermined area of the second bonding surface 21, 35, 47. In a third step, the adhesive substance 14 in a liquid state is injected into the channels 19, 29, 41. The adhesive substance 14 flows into a portion of the predetermined area of the second bonding surface 21. When the adhesive substance 14 in a liquid state solidifies, the first component 11 is bonded to the second component 13 by the adhesive substance 14.
In this method the first component 11 is positioned on the predetermined area on of the second bonding surface 21 of the second component 13 prior to injecting the adhesive substance 14 into the channels 19, so that the first component 11, 25, 37 may be positioned on the predetermined area of the second bonding surface 21, 35, 47. Therefore, an efficiency of making the adhesive bonding assembly 10 is greatly improved.
It may be appreciated that the channels 19, 29, 41 may be other shapes, such as rectangular holes and triangular holes.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being exemplary embodiments of the disclosure.
Number | Date | Country | Kind |
---|---|---|---|
200810300474.2 | Mar 2008 | CN | national |