Claims
- 1. A hot-melt adhesive composition comprising
- (A) from about 10 to about 90% by weight of at least one thermoplastic polyamide which consists essentially of the polymeric reaction product of:
- (a) from about 10 to about 50 mole percent of at least one dimer fatty acid containing from about 10 to about 20 mole percent dimer fatty acid;
- (b) from about 25 to about 45 mole percent of at least one diamine selected from the group consisting of aliphatic, aromatic and cyclic diamines having a carbon chain length of from 2 to about 40 carbon atoms and which is a diprimary diamine, a diamine containing one or two secondary amino groups having a C.sub.1 -C.sub.8 alkyl group on the N-atom, or a heterocyclic diamine capable of diamide formation;
- (c) from about 5 to about 25 mole percent of at least one aliphatic diamine containing from 2 to about 10 carbon atoms, which is capable of diamide formation, and which has substituted on one or both N-atoms a straight or branched chain alkyl group having from about 10 to about 25 carbon atoms; and
- (d) from 0 to about 40 mole percent of at least one aliphatic dicarboxylic acid having from about 6 to about 22 carbon atoms;
- (B) from about 10 to about 90% by weight of at least one polyamide which consists essentially of the polymeric reaction product of
- (a) from about 20 to about 55 mole percent of at least one dimer fatty acid,
- (b) from 0 to about 25 mole percent of an aliphatic C.sub.6 -C.sub.22 dicarboxylic acid,
- (c) from 0 to about 30 mole percent of an aminocarboxylic acid, its lactam, or a mixture thereof, containing from 8 to 22 carbon atoms,
- (d) from about 20 to about 55 mole percent of at least one diamine selected from the group consisting of aliphatic, and cyclic C.sub.2 -C.sub.40 diamine, and
- (e) from 0 to 30 mole percent of a polyether diamine;
- (C) from 0 to about 20% by weight of polyethylene having a number average molecular weight in the range of from about 250 to about 8000; and
- (D) from 0 to about 20% by weight of standard hot-melt auxiliary materials.
- 2. The hot-melt adhesive composition of claim 1 comprising the following quantities of components:
- (A) from about 40 to about 60 percent;
- (B) from about 40 to about 60 percent;
- (C) from about 5 to about 20 percent; and
- (D) from 1 to about 10 percent.
- 3. The hotmelt adhesive composition of claim 1 wherein component (A) is a carboxylic acid-terminated resin having an acid excess of up to 10 equivalent percent of all functional groups, said carboxylic acid-terminated resin having an acid number of up to 20.
- 4. The hotmelt adhesive composition of claim 3 wherein the acid number of the resin is in the range of from about 2 to about 10.
- 5. The hotmelt adhesive composition of claim 1 wherein component (A) is an amine-terminated resin having an amine excess of up to 10 equivalent percent of all functional group, said amine-terminated resin having an amine number of up to 50.
- 6. The hotmelt adhesive composition of claim 5 wherein the amine number of component (A) resin is in the range of from about 2 to about 15.
- 7. The hotmelt adhesive composition of claim 1 wherein the number average molecular weight of component (A) is in the range of from about 5,000 to about 15,000.
- 8. The hotmelt adhesive composition of claim 7 wherein the number average molecular weight of component (A) is in the range of from about 8,000 to about 12,000.
- 9. The hotmelt adhesive composition of claim 1 wherein component (A) (a) additionally contains a small quantity of a monofunctional fatty acid.
- 10. The hotmelt adhesive composition of claim 1 wherein component (A) (d) is a saturated aliphatic dicarboxylic acid containing from 6 to about 12 carbon atoms.
- 11. The hotmelt adhesive composition of claim 1 wherein the at least one diamine of component (A) (b) has a carbon chain length of from 2 to 20 carbon atoms.
- 12. The hotmelt adhesive composition of claim 11 wherein the said at least one diamine is a lower straight- or branched-chain aliphatic or monocyclic diprimary diamine or a monocyclic heterocyclic diamine.
- 13. The hotmelt adhesive composition of claim 1 wherein components (B) (a) and (B) (b) are the same as components (A) (a) and (A) (b) respectively.
- 14. The hotmelt adhesive of claim 1 wherein component (B) (e) contains terminal primary amino groups on a C.sub.2 -C.sub.6 alkyl group, and a polyether chain having a molecular weight of from about 100 to about 5000.
- 15. The hotmelt adhesive of claim 1 wherein component (B) has a number average molecular weight of from about 5,000 to about 15,000.
- 16. The hotmelt adhesive of claim 15 wherein component (B) has a number average molecular weight of from about 8,000 to about 12,000.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3535732 |
Oct 1985 |
DEX |
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Parent Case Info
This appklication is a division of application Ser. No. 033,429, filed Apr. 1, 1987, now U.S. Pat. No. 4,810,772, which is a continuation-in-part of Ser. No. 905,728, filed Sept. 8, 1986, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4399258 |
Hinze et al. |
Aug 1983 |
|
4810772 |
Leoni et al. |
Mar 1989 |
|
Non-Patent Literature Citations (1)
Entry |
Wiley, John & Sons, Encyclopedia of Polymer Science and Engineering, vol. 10, Molecular Weight Determination to Pentadiene Polymers, New York, 1987, p. 4. |
Divisions (1)
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Number |
Date |
Country |
Parent |
33429 |
Apr 1987 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
905728 |
Sep 1986 |
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