Claims
- 1. A novel adhesive composition effective in bonding low-energy plastic surfaces to each other which provides a tensile lap shear strength in excess of about 520 pounds per square inch gauge which comprises (1) one ethylene-vinyl ester copolymer having from about four to about 30 wieght percent of a vinyl ester and a melt index of about 0.5 to about 75; (2) a tackifier selected from the group consisting of (a) a rosin, (b) a rosin ester, (c) a terpene resin, (d) a terpene-phenolic resin and (e) a rosin-modified phenolic resin; and (3) a polyethylene wax having a molecular weight of about 750 to about 3000, a penetration of about 0.25 to about 1.5, a density of about 0.93 to about 0.97, a melting point of at least about 110.degree. C. and a linearity of at least about 70 percent, said novel adhesive composition having a Ring and Ball softening point of at least about 110.degree. C.
- 2. An adhesive composition according to claim 1 wherein said ethylene-vinyl ester copolymer is selected from the group consisting of ethylene-vinyl acetate, ethylene-vinyl formate, ethylene-vinyl propionate, ethylene-vinyl butyrate, and mixtures thereof.
- 3. An adhesive composition according to claim 1 wherein said copolymer contains from about six to about 25 weight percent of a vinyl ester.
- 4. An adhesive composition according to claim 1 wherein said copolymer has a melt index of about 2.0 to about 25.
- 5. An adhesive composition according to claim 1 wherein said tackifier has a softening point of about 40.degree. to about 150.degree. C.
- 6. An adhesive composition according to claim 1 wherein said tackifier has a softening point of about 65.degree. to about 135.degree. C.
- 7. An adhesive composition according to claim 1 wherein said rosin is selected from the group consisting of gum rosin, wood rosin, tall oil rosin, distilled rosin, hydrogenated rosin, dimerized rosin, and polymerized rosin.
- 8. An adhesive composition according to claim 1 wherein said rosin ester is selected from the group consisting of glycerine and pentaerythritol esters of stabilized, hydrogenated, polymerized, disproportionated, dimerized and unmodified rosin.
- 9. An adhesive composition according to claim 1 wherein said terpene resin is selected from the group consisting of polyterpene and polymerized beta-pinene resins.
- 10. An adhesive composition according to claim 1 wherein said terpene-phenolic resin is the condensation product of phenol with terpene alcohol or alpha-terpinene.
- 11. An adhesive composition according to claim 1 wherein said tackifier is a rosin-modified phenolic resin.
- 12. An adhesive composition according to claim 1 wherein said polyethylene wax has a molecular weight of about 800 to about 2000.
- 13. An adhesive composition according to claim 1 wherein said polyethylene wax is composed of at least about 90 percent linear molecules.
- 14. An adhesive composition according to claim 1 wherein said polyethylene wax is composed of about 90 to about 95 percent linear molecules.
- 15. An adhesive composition according to claim 1 wherein said polyethylene wax has a penetration of about 0.75 to about 1.00.
- 16. An adhesive composition according to claim 1 wherein said polyethylene wax has a density of about 0.94 to about 0.96.
- 17. An adhesive composition according to claim 1 wherein said polyethylene wax has a melting point of about 110.degree. to about 130.degree. C.
- 18. An adhesive composition according to claim 1 having a Ring and Ball softening point of about 115.degree. to about 130.degree. C.
- 19. An adhesive composition according to claim 1 wherein said ethylene-vinyl ester copolymer is about 15 to about 55 weight percent; said tackifier is about 25 to about 45 weight percent; and said polyethylene wax is about five to about 55 weight percent of the total composition.
- 20. An adhesive composition according to claim 1 wherein said ethylene-vinyl ester copolymer is about 25 to about 55 weight percent; said tackifier is about 25 to about 40 weight percent; and said polyethylene wax is about five to about 50 weight percent of the total composition.
Parent Case Info
This application is a continuation-in-part application of my U.S. patent application Ser. No. 848,258, entitled Adhesive Composition And Process for Bonding, filed Nov. 3, 1977, now abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (1)
Number |
Date |
Country |
47928 |
Apr 1976 |
JPX |
Non-Patent Literature Citations (1)
Entry |
"Waxes", Encyclopedia of Polymer Science and Technology, vol. 14, p. 777, .COPYRGT.1971. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
848285 |
Nov 1977 |
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