Claims
- 1. An adhesive composition for bonding unprimed substrates together which comprises substantially linear organopolysiloxanes having SiC-bonded vinyl groups and Si-bonded hydrogen atoms, and a catalyst which promotes the addition of Si-bonded hydrogen to vinyl groups, in which all the organopolysiloxanes are free of Si-bonded hydroxyl and alkoxy groups and contain an average of from 2 to 1,000 silicon atoms per molecule in which at least 99.5 percent of the number of Si-bonded hydrogen atoms are bonded to organopolysiloxanes having one Si-bonded hydrogen atom and one SiC-bonded vinyl group per molecule and at least 99.5 percent of the number of SiC-bonded vinyl groups are bonded to organopolysiloxanes having one Si-bonded hydrogen atom and one SiC-bonded vinyl group per molecule.
- 2. The composition of claim 1, wherein at least 99.9 percent of the number of Si-bonded hydrogen atoms are bonded to organopolysiloxanes having one Si-bonded hydrogen atom and one SiC-bonded vinyl group per molecule.
- 3. The composition of claim 1, wherein at least 99.9 percent of the number of SiC-bonded vinyl groups are bonded to organopolysiloxanes having one Si-bonded hydrogen atom and one SiC-bonded vinyl group per molecule.
- 4. The composition of claim 1, wherein the organopolysiloxanes are represented by the formula
- CH.sub.2 =CH(CH.sub.3).sub.2 SiO[Si(CH.sub.3).sub.2 O].sub.n Si(CH.sub.3).sub.2 H
- where n is 0 or an integer of from 1 to 998.
- 5. The composition of claim 1, wherein the catalyst is selected from the group consisting of platinum, ruthenium, rhodium, palladium, irridium and compounds and complexes thereof.
- 6. The process for bonding two substrates together which comprises coating one surface of a substrate with the composition of claim 1 and then contacting the coated surface of one substrate with the other substrate.
- 7. The process of claim 6, wherein the two substrates are glass.
- 8. The process of claim 6, wherein the two substrates are transparent plastic materials.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2940917 |
Oct 1979 |
DEX |
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Parent Case Info
This is a continuation of application Ser. No. 184,555, filed Sept. 5, 1980, now abandoned.
US Referenced Citations (9)
Continuations (1)
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Number |
Date |
Country |
Parent |
184555 |
Sep 1980 |
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