Claims
- 1. A die attach adhesive composition comprising:
- (a) a functionally effective amount of an arylcyclobutene monomeric composition comprising an arylcyclobutene monomer of the formula: ##STR47## wherein B is a direct bond; a polyvalent inorganic moiety; a polyvalent organic moiety containing one or more heteroatoms comprising oxygen, sulfur, nitrogen, silicon, or phosphorous; or at least one aromatic moiety;
- Ar is a substituted or unsubstituted aromatic moiety;
- R is separately in each occurrence hydrogen, an electron-withdrawing substituent, or an electron-donating substituent; and
- m and n are integers of 1 or more, provided that when B is a direct bond, n is 2; and
- (b) a conductive amount of an electrical conductive metal composition.
- 2. The composition of claim 1, wherein said arylcyclobutene monomeric composition comprises a bisbenzocyclobutene monomer which corresponds to the formula ##STR48##
- 3. The composition of claim 2, wherein said metal composition comprises gold in the form of a powder.
- 4. The composition of claim 2, wherein said metal composition comprises silver in the form of a powder.
- 5. The composition of claim 2, wherein said metal composition comprises copper in the form of a powder.
Parent Case Info
This is a divisional of pending application Ser. No. 771,052, filed Aug. 30, 1985, which is a continuation-in-part of application Ser. No. 644,836, filed Aug. 27, 1984, now abandoned.
US Referenced Citations (6)
Divisions (1)
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Number |
Date |
Country |
Parent |
771052 |
Aug 1985 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
644836 |
Aug 1984 |
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