Claims
- 1. An adhesive composition which comprises 1 part by weight of (a) a compound of the general formula: ##STR27## wherein R.sub.1 represents H, a hydrocarbon group of 1-6 carbon atoms, a hydrocarbon group of 1-6 carbon atoms containing halogen, COOR', wherein R' represents a hydrocarbon group of 1-20 carbon atoms, a hydrocarbon group of 1-20 carbon atoms containing halogen or halogen;
- R.sub.2 is as defined for R.sub.1 ;
- R.sub.3 represents H, a hydrocarbon group of 1-6 carbon atoms, a hydrocarbon group of 1-6 carbon atoms containing halogen, halogen or CN;
- H.sub.4 represents (COX.sub.2).sub.ml (CO).sub.m2 (ZCO).sub.m3 (Z).sub.m4 Ra wherein Ra represents an organic residue of 6-60 carbon atoms and a valency of m+n; m1, m2, m3 and m4 each represents an integer of 0-4 and satisfies m1+m2+m3+m4.ltoreq.m; X.sub.2 represents O, S or NRb, wherein Rb represents H or alkyl of 1-4 carbon atoms and Z represents O or S;
- X.sub.1 is as defined for X.sub.2 ;
- m is an integer of 1-4;
- n is an integer of 2-6; and
- k is 0 or 1,
- and 0-199 parts by weight of (b) a vinyl monomer copolymerizable with the aforesaid compound.
- 2. The adhesive composition according to claim 1 wherein the aforesaid compound (a) is a vinyl compound of the general formula: ##STR28## wherein R.sub.5 represents hydrogen or methyl, and Ra, X.sub.1, X.sub.2, k, m and n are as defined in claim 1.
- 3. The adhesive composition according to claim 2 wherein n is 2.
- 4. The adhesive composition according to claim 3 wherein the aforesaid vinyl compound is a compound of the general formula: ##STR29## wherein R.sub.5 represents hydrogen or methyl, and Rc represents a divalent organic residue of 2-54 carbon atoms.
- 5. The adhesive composition according to claim 3 wherein the aforesaid vinyl compound is a compound of the general formula: ##STR30## wherein R.sub.5 and R.sub.5 ' each represents hydrogen or methyl, X.sub.2 is as defined in claim 1, and Rd represents a divalent organic residue of 4-57 carbon atoms.
- 6. The adhesive composition according to claim 3 wherein the aforesaid vinyl compound is a compound of the general formula: ##STR31## wherein R.sub.5 represents hydrogen or methyl, X.sub.2 is as defined in claim 1, and Rd' represents a divalent organic residue of 3-57 carbon atoms.
- 7. The adhesive composition according to claim 1 which further contains 0.01-20 parts by weight of a curing agent per 100 parts by weight of the aforesaid polymerizable monomers.
- 8. The adhesive composition according to claim 1 which further contains a volatile organic solvent having a boiling point of 150.degree. C. or below at 760 Torr in an amount in the range of up to 300 times by weight that of said polymerizable monomers.
- 9. The adhesive composition according to claim 1 which further contains 20-500 parts by weight of a filler per 100 parts by weight of said polymerizable monomers.
- 10. The adhesive composition according to claim 1 wherein said vinyl monomer (b) is a (meth)acrylate type monomer, a styrene type monomer or vinyl acetate.
- 11. The adhesive composition according to claim 7 wherein said curing agent is a redox type polymerization initiator.
- 12. The adhesive composition according to claim 7 wherein said curing agent is a photosensitizer.
Priority Claims (1)
Number |
Date |
Country |
Kind |
58-9170 |
Jan 1983 |
JPX |
|
Parent Case Info
This is a continuation, of application Ser. No. 570,292, filed Jan. 13, 1984 , now U.S. Pat. No. 4,499,251, issued Feb. 12, 1985.
US Referenced Citations (9)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1543758 |
Apr 1979 |
GBX |
2089807 |
Jun 1982 |
GBX |
Continuations (1)
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Number |
Date |
Country |
Parent |
570292 |
Jan 1984 |
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