Claims
- 1. An adhesive construction comprising:
(a) a flexible substrate defining a having a first side; (b) a first adhesive field comprising pressure sensitive adhesive;
(i) the first adhesive field being a discontinuous pattern of adhesive with adhesive covering no more than 80% of an area of a portion of the first side of the flexible substrate defined by the first adhesive field; the area of a portion of the first side of the flexible substrate defined by the first adhesive field being at least 10 sq. mm. and, (c) a second adhesive field comprising pressure sensitive adhesive;
(ii) the second adhesive field covering at least 90% of an area of a portion of the first side of the flexible substrate defined by the second adhesive field; the area of a portion of the first side of the flexible substrate defined by the second adhesive field being at least 10 sq. mm.
- 2. An adhesive construction according to claim 1 wherein:
(a) the flexible substrate defines an outer perimeter edge; (b) the first adhesive field comprises an outer perimeter adhesive field positioned on the flexible substrate first side and adjacent the outer perimeter edge;
(i) the outer perimeter adhesive field having a width, in direction inwardly from the perimeter edge, of at least 0.8 mm.; and, (c) the second adhesive field comprises an inner adhesive field spaced from the outer perimeter edge and completely surrounded by the outer perimeter adhesive field;
(i) the inner adhesive field comprising adhesive covering at least 95% of an area of the portion of the first side of the flexible substrate defined by the inner adhesive field.
- 3. An adhesive construction according to claim 2 wherein:
(a) the inner adhesive field comprises a continuous adhesive field over the area of the portion of the first side of the flexible substrate defined by the inner adhesive field.
- 4. An adhesive construction according to claim 3 including:
(a) an adhesive-free region on the first side of the flexible substrate;
(i) the adhesive-free region being completely surrounded by the inner adhesive field.
- 5. An adhesive construction according to claim 4 wherein:
(a) the adhesive-free region comprises at least 40% of a perimeter area defined by the flexible substrate outer perimeter edge.
- 6. An adhesive construction according to claim 5 wherein:
(a) the outer perimeter edge defines a rectangular pattern.
- 7. An adhesive construction according to claim 6 wherein:
(a) the adhesive-free region of the flexible substrate is transparent.
- 8. An adhesive construction according to claim 7 wherein:
(a) the outer perimeter adhesive field defines a rectangular frame.
- 9. An adhesive construction according to claim 8 wherein:
(a) the inner adhesive field defines a rectangular frame.
- 10. An adhesive construction according to claim 2 wherein:
(a) the outer perimeter edge has no segment of extension of greater than 8 mm., at which there is not adhesive on the substrate first side and immediately adjacent the outer perimeter edge.
- 11. An adhesive construction according to claim 11 wherein:
(a) the outer perimeter edge has no segment of extension of greater than 5 mm., at which there is not adhesive on the substrate first side and immediately adjacent the outer perimeter edge.
- 12. An adhesive construction according to claim 1 including:
(a) a release liner to which the flexible substrate is secured by the first adhesive field and the second adhesive field.
- 13. A roll of adhesive constructions; the roll comprising:
(a) an extension of release liner; (b) at least 10 spaced adhesive constructions secured to the extension of release liner; each adhesive construction comprising:
(i) a flexible substrate having a first side; (ii) a first adhesive field comprising pressure sensitive adhesive;
(A) the first adhesive field being a discontinuous pattern of adhesive with adhesive covering no more than 80% of an area of a portion of the first site of the flexible substrate defined by the first adhesive field; the area of a portion of the first side of the flexible substrate defined by the first adhesive field being at least 10 sq. mm.; and, (iii) a second adhesive field comprising pressure sensitive adhesive;
(A) the second adhesive field covering at least 90% of an area of a portion of the first side of the flexible substrate defined by the second adhesive field; the area of a portion of the first side of the flexible substrate defined by the second adhesive field being at least 10 sq. mm.
- 14. A roll of adhesive constructions according to claim 13 wherein:
(a) the flexible substrate of each adhesive construction defines an outer perimeter edge; (b) the first adhesive field of each adhesive construction comprises an outer perimeter adhesive field positioned on the associated flexible substrate first side and adjacent the outer perimeter edge;
(i) each outer perimeter adhesive field having a width, in direction inwardly from an associated perimeter edge, of at least 0.8 mm.; and, (c) the second adhesive field of each adhesive construction comprises an inner adhesive field spaced from an associated outer perimeter edge and completely surrounded by an associated outer perimeter adhesive field;
(i) each inner adhesive field comprising adhesive covering at least 95% of an area of the portion of the first side of an associated flexible substrate defined by the inner adhesive field.
- 15. A roll of adhesive constructions according to claim 14 wherein:
(a) each inner adhesive field comprises a continuous adhesive covering over the area of an associated portion of the first side of the flexible substrate defined by that inner adhesive field.
- 16. A method of preparing an adhesive construction; said method including the steps of:
(a) preparing a laminate stock comprising a release liner layer secured to a flexible substrate layer, with an adhesive pattern of pressure sensitive adhesive therebetween;
(i) the adhesive pattern defining:
(A) a first adhesive field comprising a discontinuous pattern of adhesive with the adhesive covering no more than 80% of an area of a portion of a side of the flexible substrate layer defined by the first adhesive field; and, (B) a second adhesive field comprising adhesive covering at least 90% of an area of a portion of a side of the flexible substrate layer defined by the second adhesive field; (b) die cutting the laminate stock by cutting a die cut perimeter pattern completely through the flexible substrate layer but not completely through the release liner layer;
(i) the perimeter pattern being die cut through a region in overlap with adhesive in the first adhesive field and surrounding adhesive in the second adhesive field, (ii) the step of die cutting defining:
(A) waste flexible substrate layer outside of the die cut perimeter pattern; and, (B) a die cut adhesive construction within the die cut perimeter pattern; and, (c) stripping the waste flexible substrate from the laminate stock, while leaving at least one die cut adhesive construction on the release liner layer.
- 17. A method according to claim 16 wherein:
(a) the second adhesive field is an inner adhesive field comprising adhesive covering at least 95% of the area of the portion of the flexible substrate layer defined by the second adhesive field; and, (b) the first adhesive field is an outer perimeter adhesive field completely surrounding the first inner adhesive field.
- 18. A method according to claim 17 wherein:
(a) the adhesive pattern defines a first adhesive-free region completely surrounded by the second adhesive field.
- 19. A method according to claim 18 wherein:
(a) said step of die cutting comprises cutting to form a die cut perimeter pattern spaced at least 0.8 mm. from the inner adhesive field completely around the first inner adhesive field.
- 20. A method according to claim 19 wherein:
(a) said method comprises a process of generating a series of spaced adhesive constructions adhered to the release liner;
(i) each one of the series of spaced adhesive constructions comprising:
(A) a flexible substrate defining an outer perimeter edge; the flexible substrate having a first side; (B) an outer perimeter adhesive field adjacent the outer perimeter edge;
(I) the outer perimeter adhesive field having a width, in direction inwardly from the perimeter edge, of at least 0.8 mm.; (II) the outer perimeter adhesive field being a discontinuous pattern of adhesive with adhesive covering no more than 80% of an area of a portion of the first side of the flexible substrate defined by the outer perimeter adhesive field; and, (C) an inner adhesive field spaced from the outer perimeter edge and completely surrounded by the outer perimeter adhesive field;
(I) the inner adhesive field comprising adhesive covering at least 95% of an area of a portion of the first side of the flexible substrate defined by the inner adhesive field; and, (ii) each one of the series of spaced adhesive constructions being formed in a die cutting operation which involves cutting die cut perimeter patterns each of which is:
(A) completely through the flexible substrate layer but not completely through the release lines layer; and, (B) cut through a region in overlap with adhesive in an outer perimeter adhesive field and surrounding and not in overlap with adhesive in an inner adhesive field.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent application Ser. No. 09/822,623, filed Mar. 30, 2001, issued as U.S. Pat. No. 6,730,396 on May 4, 2004, which application is incorporated herein by reference.
Continuations (1)
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Number |
Date |
Country |
Parent |
09822623 |
Mar 2001 |
US |
Child |
10839542 |
May 2004 |
US |