1. Field of the Invention
The present invention relates to an electromagnetic compatibility (EMC) sealing apparatus and related method; and more particularly to a dynamic EMC sealing apparatus and method for an electrical enclosure used in computing system environments.
2. Description of Background
It is an industry goal to continuously increase the number of electronic components inside an electronic device. This goal is driven by several key and important reasons. The first and more obvious one is for the convenience of compactness. Compactness allows for selective fabrication of smaller and lighter devices that are more attractive to the consumer. Some of the reasons for such appeal stem from a desire for easier transportation, shipping, installation and storage of such devices. In other instances, when compactness per se is not a driving factor, providing the same number of devices in only a fraction of available footprint allows the remaining space to be filled with more components which will increase system performance and speed. In addition, compactness also allows many of the circuits to operate at higher frequencies and at higher speeds due to shorter electrical distances in these devices. Unfortunately, despite many of the advantages associated with this industry goal, there are several important challenges that have to be overcome by the designers of these systems.
One area where the challenges and advantages provided by such compact densities is increased is in the computer industry. The reliance of many businesses on computers and computer networks in recent years, demands an ever increasing need to provide fast and accurate systems in the smallest and lightest allowable footprint. In a computing environment, whether comprising of a simple personal computer, or a complex system comprising of a number of computers in processing communication with one another, a plurality of printed circuit boards and cards are provided that house many electronic components and even devices.
A particularly challenging area for the designers of these systems is the issue of resolving electromagnetic interference (EMI). As the number of components are increased, electromagnetic leakage concerns continue to grow. This is because every electronic device, emits some form of electromagnetic radiation. If unresolved, EMI can affect system performance, data integrity and speed. Obviously, in larger system environments, the increased number of components that are stored in close proximity to one another, greatly increases the EMI concerns. This is because while such effects can be tolerated when few devices and components exist, the increasing number of components and devices can seriously impact system integrity and performance. This problem is further exacerbated by the improvement in semiconductor devices which allow them to operate at higher speeds, generally causing emission in higher frequency bands where interference is more likely to occur.
Prior art attempts have been made to minimize the interference problem. Electromagnetic compatibility (EMC) requires that emissions from a given device be reduced by shielding or other similar means. Such shieldings are designed not only to reduce emissions from the device itself, but also to reduce sensitivity of the device to external fields such as fields from other devices. One type of such EMI shieldings are EMI gaskets.
In recent designs, it is necessary to use a metallic type of electromagnetic gaskets to provide better conduction with an electrical enclosure in which the printed circuit boards or cards are engaged. A common problem with such gaskets, however, are that they are easily damaged as a result of deflection of gasket during insertion or removal of printed circuit cards that reside in the computing system environment during mundane activities such as during servicing calls. Once the gasket has been damaged, not only does it no longer provides EMI protection for the device but it may even pose a threat for a potential short.
Related U.S. Pat. No. 6,794,571 by Barringer et al. (hereinafter Barringer patent), owned by the same assignee, International Business Machines Corporation, and coauthored by at least some of the inventors of this application, provided a method and apparatus for providing an electromagnetic conduction seal in a device disposed within an electrical enclosure including a metal EMC gasket.
Related patent solved the prior art problem of minimizing damages to such gaskets. This is especially true with EMC metal gaskets that have a spring design. In such gaskets, often one end of the gasket is only attached to a chassis with the other end left hanging without any retention. This other end is especially vulnerable to being damaged by being for example caught in some other object. The Barringer patent introduced a retention mechanism that provided for a lock strip to be fixed to the device. The gasket in that patent was secured to a device that provided limits of deflection of an intermediate portion to the gasket using an external part.
While the Barringer patent solves many of the prior art problems, it is desirable to introduce a mechanism that can be fabricated at the same time as the chassis itself. In addition, providing a mechanism that does not provide a lock strip can allow the gasket to be used in environments where the installation or later exposure to high temperatures (such as caused by heat dissipation issues) can cause the lock strip to come unhinged. An example would be where glue is used and heat or installation can cause the glue to come undone.
Consequently, it would be desirable to introduce an EMC gasket that can be secured to a device without the use of chemical bonding and adhesives. It would be even more beneficial to fabricate such a gasket during the same fabrication process steps as the device itself.
The shortcomings of the prior art are overcome and additional advantages are provided through the method and associated apparatus for providing an electromagnetic seal in electrical enclosure of a device. The apparatus comprising of an electromagnetic gasket formed of a thin conductive material, having a first end and an opposing end. The apparatus also includes a conductive chassis disposed in the electrical enclosure and having a first and second protrusions for securing at the ends of the gasket to the chassis.
Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. For a better understanding of the invention with advantages and features, refer to the description and to the drawings
The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
The embodiments provided in conjunction with the following figures provide for a preferred embodiment where the EMC gasket of present embodiment is disposed in a computing environment. It should be noted that this embodiment is only provided for ease of understanding and the teaching of the present invention can equally apply to other devices and in conjunction with other electrical disclosures.
Projections 28 and 29 extend from the carrier 13 within cassette 10 through respective slots 30 and 31 to align the carrier 13 with other features and mechanisms that is provided for the cassette 10 as will be discussed later.
The removal of the housing 14 in
The details of gasket 500 are illustrated in the embodiment of
The segmentation of the gasket is related to the amount of EMC control desired. By segmenting the gasket 500, the amount of EMC protection can be increased. In this regard, narrower or wider strips can be used for each segment 705 to selectively reduce or increase the amount of segments 705 that as a whole comprise gasket 500. It should also be noted that while in the illustration of
It should be noted that in a preferred embodiment, the gasket is made out of a single sheet transversally segmented, for example by creating slits selectively preferably such that the opposing ends of the gasket/material are not segmented (and still connected) and the gasket can be put in place as a single unit such as shown in
Referring now to
Referring now to 7 and
Gasket segment 705 is fabricated of a thin sheet of a conductive material. In a preferred embodiment the gasket 705 is fabricated out of a thin sheet of metal, such as copper. The thin sheet of material 705 has opposing ends respectively referenced as 801 and 802 and top and bottom surfaces 803 and 804 respectively.
The thin material of the gasket or gasket segment 705 is attached to the chassis assembly using the protrusions 610 and 620 in the manner illustrated in
In the illustrated embodiment of the invention, as visibly shown in
Referring now to
In the manner described above, each one of the ends 801 and 802 of the thin sheet of material forming the gasket 500 or gasket section 705 is disposed over the chassis assembly 540 through the clips or protrusions 610 and 620. The length of the strip 705 along with the percentage of strip 705 that is used to create the bulbous structure discussed determines the flexibility of the gasket 500 as a whole. In the illustration of
In reference to
The number of the protruding elements provided can also be selectively adjusted to provide more protection if desired. In a functional regard, it is not necessary to have more that a few protruding element for the entire gasket. In such a respect, it would only be necessary to provide a protruding element for every few strips or segments 705. The few protruding elements will hold the gasket 500 securely, but if more secure fastening is desired, the number of elements 610 and 620 as discussed above can be increased.
While the preferred embodiment to the invention has been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.
This application contains subject matter which is related to the subject matter of the following co-pending applications, filed on the same day, which is assigned to the same assignee as this application, International Business Machines Corporation of Armonk, N.Y. The following applications and patents listed below is hereby incorporated herein by reference in its entirety: U.S. Pat. No. 6,816,390 and U.S. patent application Ser. No. 11/284,744—filed Nov. 22, 2005 (Docket POU920050160US1 and assigned to the same assignee as this application.