Claims
- 1. A process for minimizing the formation of metal particles in a polyamic acid layer applied to a metal substrate comprising interposing an adhesive barrier between said polyamic acid and said metal substrate, said adhesive barrier comprising a polyimide having the structure: ##STR6## wherein I is selected from the group consisting of an imide, isoimide, amic acid, and an ester of said amic acid with an organo hydroxy compound having from one to about six carbon atoms, and wherein I is based on a condensation product of a cyclic tetracarboxylic acid anhydride and a cyclic diamine wherein the cyclic diamine is substituted completely or partially with an unsaturated heterocyclic diamine, a diamino organo phosphine or a mixture thereof;
- n is from about one to about 100;
- R.sub.2 is selected from the group consisting of an imido of an amino organo phosphine, an imide of an unsaturated heterocyclic amine, and an imide of an unsaturated heterocyclic dicarboxylic acid; and
- R.sub.2 is R an imide of an acetylene amine or an imide of a vinyl amine.
- 2. The process of claim 1 where R.sub.1 comprises an azaadeninyl group.
- 3. The process of claim 1 where R.sub.1 comprises a benzyltriazole group.
- 4. The process of claim 1 where R.sub.1 comprises a purinyl group.
- 5. The process of claim 1 where R.sub.1 comprises a pyrazolylpyrimidine group.
- 6. The process of claim 1 where said polymer is based on the condensation product of 4,4'-oxydiphthalic anhydride (ODPA)-1,3-bis(aminophenoxy)benzene (APB) and aminophenylacetylene (APA).
- 7. The process of claim 1 where said polymer is based on the condensation product of ODPA-APB and having end groups based on an imide of APA.
- 8. The process of claim 1 where said polymer is based on the condensation product of benzophenone tetracarboxylic acid dianhydride (BTDA) and 3,5-diamino-1,2,4-triazole (TADA).
- 9. The process of claim 1 wherein said metal substrate is applied as a coating on said polyimide adhesive barrier.
- 10. The process of claim 1 wherein said adhesive barrier is applied as a coating on said metal substrate.
Parent Case Info
This is a divisional of application Ser. NO. 08/197,941, filed on Feb. 17, 1994, which is a divisional of prior application Ser. No. 07/771,929, filed on Oct. 7, 1991, now U. S. Pat. No. 5,326,643.
US Referenced Citations (21)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0273207 |
Jul 1988 |
EPX |
0344504 |
Dec 1989 |
EPX |
Non-Patent Literature Citations (3)
Entry |
Higuchi, et al. (1991) "Photo-Cross-Linking Reaction of Benzophenone-Containing Polyimide and its Model Compounds", Chem. Mater. 3, 188-194. 1991. |
Kim, et al. (1987) "Adhesion and Interface Studies Between Copper and Polyimide", J. Adhesion Sci. Tech. 1(4), 331-339. 1987. |
Kim, et al. (1988) "Adhesion and Interface Investigation of Polyimide on Metals", J. Adhesion Sci. Tech. 2(2), 95-105. 1988. |
Divisions (2)
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Number |
Date |
Country |
Parent |
197941 |
Feb 1994 |
|
Parent |
771929 |
Oct 1991 |
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