Patent Application
20090229766
The present disclosure relates to adhesive, and, more particularly, to removal of adhesive from a substrate to which the adhesive is bonded.
Some adhesives comprise stretch release properties that enable the adhesive to be detached from a substrate to which it is bonded by stretching the adhesive. In some cases, the stretch release adhesive may be stretched at an angle relative to the bond surface of the substrate in order to release the adhesive from the surface. Many stretch release adhesives, once bonded to a substrate, are relatively cleanly removable from the substrate, such that there is no visible residue remaining on the substrate and no visible damage to the substrate. Stretch release adhesives tapes are useful in a variety of applications including, but not limited to, assembling, joining or attaching elements of a component or mounting a component to a surface.
In general, the present disclosure is directed toward systems and methods of removing an adhesive from a component (also referred to as a “substrate”), where the adhesive exhibits stretch release properties. An adhesive removal system may include a first member that engages with the component, where a layer of stretch release adhesive is bonded to at least one surface of the component, and an adhesive removal member that moves the adhesive and component relative to each other in order to stretch the adhesive and release the adhesive from a bond surface of the component. At least a portion of the adhesive layer, such as a tab defined by the adhesive or otherwise coupled to the adhesive layer, may be coupled to the adhesive removal member, e.g., with the aid of an attachment mechanism (e.g., a clamp) or by adhering the portion of the adhesive layer to the adhesive removal member. The adhesive removal member may apply a pulling force to one portion of the adhesive layer in order to stretch the layer of adhesive, where the portion may be a side of the adhesive layer portion that defines a dimension between a first side and a second side. In some embodiments, the adhesive removal member applies a substantially uniform pulling force along the dimension (e.g., a length or width) between the first side and the second side of the adhesive layer. The adhesive removal member may be manually actuated by a user or by an automated device, such as a motor coupled to a control device. The automated device may be used alone or in combination with user interaction to actuate the adhesive removal member.
In some embodiments, the adhesive removal member comprises a rotatable portion that helps stretch the adhesive of the adhesive layer and release the adhesive layer from the component. For example, the adhesive removal member may comprise a mandrel or friction rollers that are coupled to a base at a fixed position or a mandrel that is movable relative to the base, e.g., along a gear track or movable relative to the first member that holds the component. After mechanically coupling at least a portion of the adhesive to the adhesive removal member, the rotatable portion of the adhesive removal member may be rotated, thereby applying a pulling force to the adhesive to stretch the adhesive and draw the adhesive away from the bond surface of the component. In some embodiments, the first member and rotatable portion of the adhesive removal member may be held in relatively fixed positions relative to each other or may be movable relative to each other.
In other embodiments, the adhesive removal member may comprise a second member that couples to at least a portion of the adhesive, and features that moves the first member and second member relative to each other. For example, the features may include a track on which the first member and/or second member are mounted, where the track enables the first and second members to move relative to each other, or enable the first and second members to move in substantially opposite directions. As another example, the second member may include a weight that is gravity fed away from the first member.
An adhesive removal system may include a cutting member in some embodiments in order to help remove the stretched and released adhesive from the rotatable portion, as well as features for collecting the adhesive that is removed from a component. The systems and methods described herein may be useful for removing an adhesive layer that is positioned between a glass substrate (or plate) and a liquid crystal display (LCD) without substantially damaging the glass substrate or the LCD. After removing the adhesive from the component, a user may determine whether the component has been damaged, e.g., as a result of the adhesive removal process.
In one embodiment, the present disclosure is directed to a system comprising a first member that holds a component comprising an adhesive layer, and an adhesive removal member that comprises a rotatable portion that moves the adhesive layer relative to the component.
In another embodiment, the present disclosure is directed to a system comprising a base, a first member that holds a component comprising an adhesive layer, and a second member that couples to at least a portion of the adhesive layer, wherein at least one of the first or second members are movably mounted to the base, the first and second members being movable relative to each other.
In another embodiment, the present disclosure is directed to a system comprising means for holding a component comprising an adhesive layer, and means for moving the adhesive layer and component relative to each other, wherein the means for moving couples to at least a portion of the adhesive layer.
In another embodiment, the present disclosure is directed to a system comprising introducing a component into a first member of an adhesive removal system, wherein the component comprises an adhesive layer, coupling at least a portion of the adhesive layer to an adhesive removal member, and actuating the adhesive removal member to stretch the adhesive.
In another embodiment, the present disclosure is directed to a system comprising securing a component to first member of an adhesive removal system, where the component comprises an adhesive layer, coupling at least a portion of the adhesive layer to a second member of the an adhesive removal member, and moving at least one of the first or second members along a track to stretch the adhesive.
In another embodiment, the present disclosure is directed to a computer-readable medium containing instructions. The instructions cause a programmable processor to actuate an adhesive removal member of an adhesive removal system. In one embodiment, the instructions cause a programmable processor to rotate an adhesive removal member at a speed sufficient to stretch an adhesive that is bonded to a component, and draw the adhesive away from a component.
In one aspect, the present disclosure provides for a device for removing a stretch release adhesive from at least one substrate, the device comprising: (a) a base having a top surface and opposing first and second edges; (b) a first side wall disposed on the top surface and along the first edge of the base; (c) a second side wall disposed on the top surface and along the second edge of the base; (d) a platform having means for attaching to the first and second side walls and having opposing, front and back edges; and (e) a support plate disposed proximate to the front edge of the platform. The combination of the base, the first side wall, the second side wall, and the platform forms a cavity comprising means for supplying a carrier tape to the support plate thereby allowing the stretch release tape to engage with the carrier tape.
The details of one or more embodiments of the present disclosure are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the present disclosure will be apparent from the description and drawings, and from the claims.
These figures are idealized, are not drawn to scale, and are intended only for illustrative purposes.
In the embodiment shown in
In some examples, glass plate 22 and LCD module 24 are separated by a about 175 micrometers, i.e., adhesive layer 20 is about 175 micrometers thick. Component 21 may be, for example, a display of a mobile handheld device (e.g., a mobile telephone, a personal digital assistant, a portable music player, and the like), a display of a computing device (e.g., a laptop computer or a desktop computer) or another display, such as a display of a television. In other embodiments, adhesive removal device 10 may be used to remove an adhesive layer 20 from another component. In general, adhesive removal system 10 may be configured to accommodate substrates having various sizes and configurations. Accordingly, while adhesive removal system 10 is primarily described with respect to component 21 including glass plate 22 and LCD module 24, the invention is not so limiting.
In some cases, it may be desirable to remove adhesive layer 20 from component 21 in order to rework the arrangement between glass plate 22 and LCD module 24, in order to replace at least one of glass plate 22 or LCD module 24 or to remove contaminants (e.g., dust) that may be trapped between adhesive layer 20 and glass plate 22 or between adhesive layer 20 and LCD module 24. Other reasons for removing adhesive layer 20 from component 21 are also possible. It may be desirable to remove adhesive layer 20 to separate the parts of component 21 rather than disposing of the entire component 21 for part-conservation reasons, as well as for waste minimization. If glass plate 22 and LCD module 24 are separated from each other, as well as adhesive layer 20, without substantial damage, glass plate 22 and/or LCD module 24 may be recycled, e.g., reused in another component. Stretch release adhesive 20 enables glass plate 22 and LCD module 24 to be separated from each other without substantially damage to glass plate 22 or LCD module 24. Adhesive removal system 10 helps remove adhesive layer 20 from component 21.
After removing the adhesive from the component, a user may determine whether the component has been damaged, e.g., as a result of the adhesive removal process. For example, in the case of LCD module 24 (or LCD panel), the user may plug LCD module 24 into a handheld device (e.g., a mobile phone)or another device that includes a similar LCD display. The backlight of the handheld device may be activated and damaged pixels of the LCD module may become visible to the user. In this way, the user may visually inspect component 21 for damage after adhesive layer 20 is removed therefrom.
In order to remove stretch release adhesive layer 20 from component 21, it may be desirable to exert a pulling force to stretch adhesive layer 20 that is substantially evenly distributed along the entire side from which adhesive layer 20 is pulled. For example, if adhesive layer 20 is pulled along width W1, it may be desirable to exert a substantially even pulling force along the entire width W1, rather than concentrating the force at one portion of width W1. Similarly, if adhesive layer 20 is pulled along length L1, it may be desirable to exert a substantially even pulling force along the entire length L1, rather than concentrating the force at one portion of length L1. Pulling at one portion of width W1 or length L1 may cause adhesive layer 20 to rip, tear or otherwise break. Adhesive removal system 10 may help exert a substantially even pulling force along the pull-side of adhesive layer 20. In addition, as described in further detail below, adhesive removal system 10 may help pull adhesive layer 20 from component 21 within a particular range of angles.
Base 12 of adhesive removal system 10 supports component 21 relative to the adhesive removal portion of system 10, and, in particular, mandrel 14. Base 12 defines openings 26A, 26B configured to receive arms 28A, 28B, respectively, of mandrel 14. At least one of the arms 28A, 28B may be spring-loaded, and the spring-loaded arm may be depressed toward the opposing arm in order to size mandrel 14 for fitting into base 12 and allow arms 28A, 28B to be introduced through openings 26A, 26B. In the embodiment shown in
Platform 18 is secured within base 12 with the use of any suitable coupling technique, such as, but not limited to, interlocking parts (e.g., a snap fit), an adhesive, welding (e.g., ultrasonic welding), screws, nails or the like. In particular, platform 18 and mandrel 14 are coupled to base 12 such that mandrel 14 and platform 18 are held at a relatively constant distance relative to each other. In some embodiments, platform 18 may be removably mounted to base 12, which may enable different platforms to be interchangeably coupled to base 12. The different platforms may help customize adhesive removal system 10 to different sized components. In addition, a removable platform 18 may be useful for adhesive removal system 10, which may inadvertently acquire a build-up of adhesive or other contaminants over time.
Platform 18 defines a compartment 32 sized and configured to engage with LCD module 24 of component 21. In other embodiments, compartment 32 may be sized and configured to receive glass plate 22 of component 21 instead of or in addition to LCD module 24. Walls 32A-32D of compartment 32 are sized based on walls 24A-24D, respectively, of LCD module 24. In one embodiment, walls 32A-32D are sized to engage with walls 24A-24D of LCD module 24 when component 21 is introduced into compartment 32. However, in some cases, a friction fit between walls 24A-24D and walls 32A-32D may be undesirable because ease of removal of LCD module 24 after adhesive layer 20 is removed from component 21 may be desirable. A depth of compartment 32 (measured substantially along the z-axis direction, where orthogonal x-y-z axes are shown in
Although
In some cases, cover member 16 may be used to help secure component 21 within compartment 32 defined by platform 18. In the embodiment shown in
Adhesive layer 20 may be pulled from component 21 with the aid of rotatably mounted mandrel 14. Adhesive layer 20 defines tab 20A (shown in
Prior to bonding tab 20A to mandrel 14 or another adhesive removal member, tab 20A may be at least partially covered with a release liner in order to help prevent tab 20A from inadvertently bonding to another surface prior to the adhesive removal process. The release liner may be, for example, a polymer film or another material that may easily be removed from adhesive layer 20. In some embodiments, the release liner or tape may remain on tab 20A during the adhesive removal process. For example, a clamp may attach tab 20A of adhesive 20 to mandrel 14, and the release liner or tape may help tab 20A from adhering to the mandrel 14. As another example, if adhesive 20 is pulled from component 21 with the aid of nip rollers, as described with respect to
In other embodiments, tab 20A, which may or may not be covered with a release liner, may be coupled to mandrel 14 using any suitable technique. For example, in some embodiments, mandrel 14 may include a mechanism that clamps or otherwise engages with and holds tab 20A. Thus, while a technique including bonding tab 20A to mandrel 14 is primarily referred to in the description of
As shown in
In the embodiment of adhesive removal system 10 shown in
As mandrel 14 is rotated in the counterclockwise direction 36, adhesive layer 20 is pulled from component 21 and wraps around mandrel 14. In some embodiments, adhesive removal system 10 includes a rotation-limiting member that discourages mandrel 14 from rotating in a direction toward component 21 (i.e., in a clockwise direction in
In some cases, such as if rotation of mandrel 14 in a direction substantially opposite to direction 36 is limited with a ratcheting mechanism, some rotation of mandrel 14 toward component 21 may be permitted. For example, system 10 includes one or more ratchets with a gearwheel or another member forming teeth, the teeth may only prevent movement in a direction substantially opposite to direction 36 at discrete points (e.g., when a pawl or another finger is positioned between the teeth of the gearwheel).
In embodiments in which an electromechanical device or another automated device is used to rotate mandrel 14, the device may include a self-regulating motor or another system that helps prevent turning mandrel 14 at a speed that stresses adhesive 20. It may be undesirable to pull adhesive layer 20 from component 21 too fast in order to help prevent overstressing adhesive layer 20. If adhesive layer 20 is overstressed, adhesive layer 20 may break or tear. Examples of self-regulating motors include motors utilizing planetary gears. In some embodiments, the speed at which a device automatically rotates mandrel 14 (e.g., the revolutions per minute of mandrel 14) may be regulated by a controller, which may be programmed to control rotation of mandrel 14 at or below a particular speed threshold. The desirable speed at which the device may rotate mandrel 14 may be selected based on the properties of the adhesive 20, as well as other factors, such as the dimensions of mandrel 14 and the distance between mandrel 14 and component 21.
As previously indicated, with some stretch release adhesives, adhesive layer 20 is pulled from component 21 at a particular angle, e.g., less than about 35° relative to bond surfaces 22A, 24E of component 21 in order to effectively use the stretch release properties of adhesive layer 20 to remove adhesive layer 20 from component 21. As adhesive layer 20 wraps around mandrel 14, the angle A (shown in
Adhesive 20 may re-adhere to glass plate 22 as it is pulled from component 21 if the angle A between the bond surfaces of component 21 and the surface of mandrel 14 or the outer surface of removed adhesive collected on mandrel 14 is such that portions of adhesive layer 20 contact bond surfaces 22A of glass plate 22. The possibility that portions of adhesive 20 that have been pulled from component 21 will re-adhere to glass plate 22 may be increased if glass plate 22 has a greater dimension along the x-axis direction than LCD module 24, as shown with glass plate 22′ in
In order to help minimize or even eliminate the consequences of increasing angle A beyond a desirable range of angles (e.g., about 35° or less), adhesive removal device 10 may include features that enable angle A between adhesive layer 20 and mandrel 14 to remain at or below the threshold angle. In some embodiments, mandrel 14 may be movable relative to base 12, such that mandrel 14 may move in the negative z-axis direction as the thickness of adhesive layer 20 on mandrel 14 increases. In this way, the angle A between adhesive layer 20 and the bond surfaces 22A, 24E of component 21 may be maintained at or below a threshold angle.
A user may manually move mandrel 14 or mandrel 14 may be moved automatically as sensors within base 12 or on mandrel 14 detect a thickness of adhesive layer 20 on mandrel 14 and/or the angle A between the portion of adhesive layer 20 being stretched onto mandrel 14 and the bond surfaces 22A, 24E of component 21. For example, base 12 may define a plurality of sets of openings 26A, 26B that each have a different z-axis position. The plurality sets of openings 26A, 26B may be connected, such that arms 28A, 28B of mandrel 14 may be slid or otherwise moved between adjacent openings 26A, 26B without removing mandrel 14 from base 12. As another example, mandrel 14 may be rotatably mounted to base 12 by a lever mechanism that enables the z-axis position of mandrel 14 to be adjusted. Other arrangements for adjusting the z-axis position of mandrel 14 are contemplated. For example, the z-axis position of component 21 may be adjusted as the thickness of adhesive collected on mandrel 14 increases.
In addition to or instead of moving mandrel 14 in order to maintain the angle A between bond surfaces 22A, 24E of component 21 and the portion of adhesive layer 20 being removed from component 21 within a desirable range, the portions of adhesive layer 20 wrapped around mandrel 14 may be removed as adhesive layer 20 is pulled from component 21. An example of a system that includes a cutting device to remove adhesive layer 20 from mandrel 14 is described below with reference to
Mandrel 14 may define a structured (e.g., a microstructured) surface on which the adhesive 20 removed from component 21 may collect.
While the embodiment of adhesive removal system 10 shown in
Adhesive layer 20 may define a tab 20B, which is similar to tab 20A, along the length LI instead of or in addition to tab 20A that extends along the width W1 of adhesive layer 20. Tab 20B along the length L1 of adhesive layer 20 may be bonded to mandrel 14 or otherwise attached to mandrel 14, and adhesive layer 20 may be removed from component 21 using the techniques described above with respect to
In the embodiment shown in
Platform 60 may be coupled to base 12 and components may be introduced into any of the compartments 62, 64, 66, 67. The user may select the compartment 62, 64, 66, 67 that best accommodates the component. For example, in
Adhesive removal device 10 removes a stretch release adhesive 69 from display 68 by applying a tension force that is substantially evenly distributed along an edge of the adhesive 69. The substantially even force may be exerted along the edge of the adhesive, regardless of whether the edge of the adhesive is centered relative to mandrel 14. For example,
In other embodiments, a plurality of platforms may be attached to base 12, where at least two of the platforms define a different sized compartment.
Neither compartment 32 of platform 18 (
Platform 70 defines a substantially planar top surface 72 and a front wall 74 protruding from the top surface 72 in the z-axis direction (substantially perpendicular to the plane of the image of
Platform 70 also includes movable sidewalls 73A, 73B, which are movable along the y-axis direction. For example, side walls 73A, 73B may be movably mounted to tracks that extend along the y-axis direction. Sidewalls 73A, 73B may be locked in place. The y-axis position of sidewalls 73A, 73B be adjusted based on the configuration of component 21. For example, sidewalls 73A, 73B may be moved to engage with side surfaces of component 21 in order to help more securely hold component 21 on platform 18. Adjustable sidewalls 73A, 73B (and adjustable front wall 74) may enable platform 70 to be customizable for use with various types and sizes of substrates. In other embodiments, platform 70 may also include an adjustable or nonadjustable rear wall that is parallel to front wall 74.
After adhesive layer 20 is coupled to mandrel 14 (e.g., by directly bonding adhesive layer 20 to an outer surface of mandrel 14, as shown in
Cutting member 84 may help remove adhesive 20 from mandrel 14. A width of cutting member 84, which is measured substantially along the y-axis direction) substantially matches a width of mandrel 14. For example, a width of cutting member 84 may be about 80% to about 100% the length of mandrel 14. However, cutting member 84 may have any suitable width. In the embodiment shown in
If adhesive 20 is wrapped around mandrel 14 or otherwise attached to mandrel 14, a user may position cutting member 84 proximate to mandrel 14. Cutting member 84 may be positioned to penetrate all or some of the adhesive 20 on mandrel 14 in order to help detach at least a portion of the adhesive 20 from mandrel 14. Because cutting member 84 has a width that substantially matches a width of mandrel 14, the y-axis position of cutting member 84 does not need to be adjusted in order to remove a large portion of adhesive 20 from mandrel 14. In some embodiments, a user or automatic device may align groove 15 with cutting member 84 and advance cutting member 84 toward mandrel 14 such that cutting member 84 extends into groove 15. This arrangement between cutting member 84 and groove 15 allows cutting member 84 to penetrate through substantially the entire thickness of adhesive 20 collected on the outer surface of mandrel 14.
A user or automated device may engage or disengage cutting member 84 with adhesive 20 as desired. For example, in some embodiments, a sensor may be mounted to base 12 to determine when a particular thickness T of adhesive 20 on mandrel 14 has exceeded a threshold value. Upon detecting that the threshold thickness has been exceeded, a control device may actuate threaded mechanism 92 or another mechanism to advance cutting member 84 toward mandrel 14 to scrape adhesive 20 from mandrel 14. Alternatively, the user may visually gauge the thickness of adhesive 20 on mandrel 14, and may manually engage cutting member 14 with the adhesive 20 on mandrel 14 when desired.
In other embodiments, inclined surface 84A and surface 84B of cutting member 84 may be reversed, as shown in
In contrast to cutting member 84 of system 80 of
Although the adhesive removal systems 10 (
Nip rollers 112, 114 are rotatably mounted to base 12 such that rollers 112, 114 rotate in substantially opposite directions. In particular, nip roller 112 is mechanically coupled to gear 120, which is configured to rotate in direction 37 and nip roller 114 is mechanically coupled to gear 122, which is configured to rotate in a substantially opposite direction 36. In general, “mechanically coupled” indicates that two elements are directly or indirectly attached or connected to each other, which may be accomplished with the use of mechanical mechanisms (screws, nails, clamps, and the like), adhesives, welding (e.g., ultrasonic welding), and any other suitable technique. Gears 120, 122, which may be toothed gears, are engaged with each other, such that rotation of one gear causes rotation of the other gear in a substantially opposite direction. In some embodiments, one of the gears 120, 122 may be a drive gear, and the other gear may be an idle gear that is rotated by the drive gear. Knob 124 is coupled to the drive gear 120 or 122, and a single knob 124 may be rotated in order to rotate both rollers 112, 114 in their respective directions.
In some embodiments, nip rollers 112, 114 are biased toward each other. For example, one roller may be stationary and the other roller may be spring-biased toward the stationary roller. In other embodiments, nip rollers 112, 114 are mounted such that there is a predetermined spacing between outer surfaces of rollers 112, 114. The spacing between rollers 112, 114 may be selected based, for example, the compressive pressure to be applied to adhesive 20 when the adhesive is positioned between rollers 112, 114. For example, the spacing between rollers 112, 114 should be sufficient to engage adhesive 20 in order to pull adhesive 20 through nip rollers 112, 114 and from component 21. On the other hand, the spacing between rollers 112, 114, should be insufficient to bond adhesive 20 to one or both of the rollers 112, 114. The spacing between rollers 112, 114 is relatively consistent in order to help pull adhesive layer 20 through rollers 112, 114 in a substantially even manner, i.e., to apply a relatively uniform pull force to adhesive layer 20 along the side of adhesive layer 20 closest to rollers 112, 114.
As rollers 112, 114 rotate in their respective directions, any material position between rollers 112, 114 is advanced toward collection roller 116. In order to remove adhesive layer 20 from component 21, a user may initially place tab 20A of adhesive layer 20 between nip rollers 112, 114 or on at least one of nip rollers 112, 114. As the user (alone or with the aid of an automated device) rotates knob 124, and, therefore the drive gear 120 or 122, nip rollers 112, 114, which may be compressed toward each other, e.g., via a spring force, pull adhesive layer 20 from component 21. Adhesive 20 that is removed from component 21 by nip rollers 112, 114 may be collected on collection roller 116. Roller 116 is spring-loaded and biased in direction 36. The bias of roller 116 applies tension to adhesive 20 as it leaves nip rollers 112, 114, which enables adhesive 20 to wrap around collection roller 116. In other embodiments, roller 116 may not apply any tension to adhesive 20 and may instead be a passive roller, or adhesive 20 may be collected onto or into device other than a collection roller 116.
Insert 132 may help customize the size of groove 134 of collection roller 116 to a particular type of adhesive 20 or a particular adhesive thickness. That is, insert 132 defines an indexing clamp for coupling to different amounts of adhesive. For example, tab 20A of adhesive 20 may be introduced into the channel groove 136 of insert 132, and insert 132 may be subsequently introduced into groove 134 of roller 116. As the relatively rigid groove 134 of the roller 116 exerts a compressive force on insert 116, the insert channel 136 decreases in size. This enables insert 132 to clamp onto adhesive tab 20A. Insert 132 may also be used with groove 15 of mandrel 14.
Collection roller 116 is rotatably mounted to bracket 142, which is slidably mounted within channels 144A, 144B defined by base 12. The x-axis position of collection roller 116 may be modified by adjusting the position of bracket 142 along channels 144A, 144B. In the embodiment shown in
It may be desirable to adjust the relative position between collection roller 116 and nip rollers 112, 114 in some situations. For example, collection roller 116 may be moved away from nip rollers 112, 114 if the thickness of adhesive 20 that collects on roller 116 impedes rotation of roller 116 due to interference with nip rollers 112, 114, or if the thickness of adhesive 20 on collection roller 116 impedes rotation of nip rollers 112, 114.
Adhesive 20 that is removed from component 21 may be collected on a mandrel or a collection roller, as described above. In other embodiments, adhesive 20 that is removed from component 21 may be collected using other suitable techniques.
In the embodiment shown in
As rollers 152, 154 rotate in their respective directions, any material position between rollers 152, 154 is advanced away from rollers 152, 154 and away from nip rollers 112, 114. The structure of outer surfaces of rollers 152, 154 define the arrangement of adhesive 20 in the aggregation 156 of removed adhesive by imparting a shape to the adhesive 20 as the removed adhesive 20 passes between rollers 152, 154. Rollers 152, 154 may be biased toward each other or may be mounted such that there is a predetermined spacing between outer surfaces of rollers 152, 154. The spacing between rollers 152, 154 may be selected based on, for example, the compressive pressure to be applied to adhesive 20 in order to arrange removed adhesive 20 into the accordion-like arrangement 156.
Although rollers 152, 154 are shown with respect to an adhesive removal system that includes nip rollers 112, 114 for drawing the adhesive 20 from component 21, in other embodiments, rollers 152, 154 may be incorporated into other adhesive removal systems described herein.
In the embodiment shown in
Gears 178A, 178B are mounted to arms 28A, 28B, respectively, of mandrel 14, such that the position between gears 178A, 178B and arms 28A, 28B are substantially fixed. Mandrel 14 may be movably coupled to base 172 by engaging gears 178A, 178B with gear train 174. The teeth of gears 178A, 178B are configured to interlock with teeth of gear train 174. As gears 178A, 178B are rolled along track, mandrel 14 is rotated in direction 36. In this way, gears 178A, 178B drive the movement of mandrel 14. Gears 178A, 178B may each include a rotation limiting member to discourage movement of mandrel 14 in direction substantially opposite to direction 36.
Tab 20A of adhesive layer 20 may be initially bonded, clamped or otherwise coupled to mandrel 14. If component 21 is not placed on platform 18, the user may place component 21 on platform 18. Similarly, if gears 178A, 178B are not on gear train 174, the user may place gears 178A, 178B, along with mandrel 14, on gear train 174 such that the teeth of gears 178A, 178B are interlocked with teeth of gear train 174. Cover member 182 may then be placed over the assembly of the platform 18, mandrel 14, component 21, and gears 178A, 178B.
In order to remove stretch release adhesive 20 from component 21, the user (alone or with the aid of an automated device) may push cover member 182 along gear train 174 and toward an end of gear train 174 that is furthest from component 21, i.e., toward end 172A of base 172. Pushing cover member 182 while gears 178A, 178B are engaged with gear train 174 causes mandrel 14 to rotate, which, in turn, applies a pulling force to adhesive 20 to stretch adhesive 20 and draw adhesive 20 away from component 21. In this way, gears 178A, 178B and gear train 174 support the removal of adhesive 20 from component 21. In addition, pushing cover member 182 from end 172A to end 172B of gear train 174 also pushes platform 18 and component 21 along the length of gear train 174. While gears 178A, 178B and mandrel 14 may be pushed along gear train 174 without the aid of cover member 182, cover member 182 helps to push platform 18, and, therefore, component 21, and mandrel 14 and substantially the same pace. This helps maintain a relatively constant distance between component 21 and mandrel 14.
In some embodiments, the length of gear train 174 (measured substantially along the x-axis direction) may be selected based on the amount of adhesive 20 within component 21. For example, gear train 174 length may be selected such that one traversal across gear train 174 is sufficient to remove substantially all of adhesive 20 from component 21. As another example, the gear train length may be selected such that two or more traversals across gear train 174 are sufficient to remove substantially all of adhesive 20 from component 21. If cover member 182 reaches an end 172A of base 172 before substantially all of adhesive 20 is removed from component 21, the user (alone or with the aid of an automated device) may remove platform 18, mandrel 14, and gears 178A, 178B from gear train 174 and reassemble the platform 18, mandrel 14, and gears 178A, 178B with gear train 174 at the opposite end 172B of base 172 and push the platform 18, mandrel 14, and gears 178A, 178B along gear train 174 from end 172A to end 172B of base 172. This process may be repeated until substantially all or the desired amount of adhesive 20 is removed from component 21.
Beam 192 includes a clamping mechanism 196 that mechanically couples adhesive 20 to beam 192. For example, tab 20A (not shown in
Rather than holding component 21 in a relatively fixed position relative to mandrel 14 with the aid of a platform (e.g., platform 18 of
The vacuum force applied by arms 206, 208 is relatively gentle, which helps preserve glass plate 22 and LCD module 24 of component 21 for reuse. Arms 206, 208 are biased in a direction substantially away from each other, e.g., with the aid of spring 212. After adhesive 20 is removed from component 21, arms 206, 208 may spring away from each other, thereby separating glass plate 22, which is coupled to arm 206, and LCD module 24, which is coupled to arm 208. In this way, spring biased arms 206, 208 may help glass plate 22 and LCD module 24 from contacting each other. Contact between glass plate 22 and LCD module 24 which may damage or at least adversely impact the performance of glass plate 22 and/or LCD module 24.
Although spring 212 is not necessary, spring 212 helps to minimize any compressive forces that may be exerted on component 21, which may push glass plate 22 and LCD module 24 and increase the adhesion between adhesive 20 and bond surfaces of component 21. In some cases, the removal of adhesive 20 may be aided by the biased arms 206, 208 because arms 206, 208 help to pry glass plate 22 and LCD module 24 apart, which may help release adhesive 20 from glass plate 22 and LCD module 24. In addition, applying a force that encourages movement of glass plate 22 away from LCD module 24 may help prevent adhesive 20 from re-adhereing to either glass plate 22 or LCD module 24 by maximizing the space between glass plate 22 and LCD module 24.
Arms 206, 208 are not rigidly held in place relative to base 202, which allows component 21 to generally pivot about spring 212, in a direction indicated by arrow 214 when held in place by arms 206, 208. In one embodiment, arms 206, 208 are configured to permit component 21 to pivot angle J1 in a first direction relative to a baseline position of component 21 when arms 206, 208 are in a baseline position, and angle J2 in a second direction relative to a baseline position of component 21. The baseline position of component 21 may be achieved when no external forces are applied to arms 206, 208 in order to change the position of arms 206, 208, which is shown in
As the thickness of removed adhesive 20 on mandrel 14 increases, component 21 may pivot to maintain a tangential alignment with the outer surface of the adhesive collected on mandrel 14. In this way, adhesive removal system 200 may readily adapt to changes in the angle at which adhesive 20 is pulled from component 21. As discussed above, it may be undesirable for adhesive 20 to be withdrawn from component 21 at particular angles because it may increase the possibility of adhesive 20 re-adhering to a surface of component 21 or the possibility of adhesive 20 breaking.
Clamping members 244A, 244B may be fixed in place, while clamping member 246 is movable along the x-axis direction with the aid of threaded member 250. In particular, clamping member 246 and knob 248 may be mechanically coupled to opposing ends of threaded member 250, which extends through an opening in base 242. As knob 248 is rotated in a first direction, clamping member 246 advances toward clamping members 244A, 244B and as knob 248 is rotated in a second direction, clamping member retreats from clamping members 244A, 244B. Threaded member 250 may be threaded along its entire length, or may be partially threaded. In other embodiments, a different mechanism for moving clamping member 246 may be used in adhesive removal system 240. However, the configuration of threaded member 250 inherently helps secure a position of clamping member 246.
It may be desirable to maintain alignment between component 21 and mandrel 14 in order to help prevent adhesive of adhesive layer 20 from tearing or otherwise breaking as it is stretched and drawn away from component 21. That is, it may be desirable for adhesive layer 20 to be aligned with an outer surface of mandrel 14 (or an outer surface defined by removed adhesive collected on mandrel 14) such that adhesive layer 20 does not re-adhere to either glass plate 22 or LCD module 24 as adhesive layer 20 is pulled from component 21 or so that adhesive layer 20 does not contact an edge of component 21 that may break adhesive layer 20. In order to help maintain a particular alignment between mandrel 14 and component 21, mandrel 14 may be adjustably mounted to base 242 such that mandrel 14 is movable along the x-axis. A user or automated device may position mandrel 14 based on the location of adhesive layer 20 between clamping members 244A, 244B and 246. The location of adhesive layer 20 may change, depending on the thickness of the other elements of component 21, which may vary depending on the component type. Accordingly, an adjustable mandrel 14 may help customize adhesive removal system 240 to different types of components.
In other embodiments, clamping members 244A, 244B may be movable along the x-axis direction in addition to clamping member 246. Clamping members 244A, 244B, 246 may be self-centering. That is, in some embodiments, as threaded member 250 is rotated in the first direction, clamping members 244A, 244B and clamping member 246 may move toward each other while maintaining a common center point, which is selected based on the desired alignment between adhesive layer 20 and mandrel 14.
First support member 258 supports glass plate 22 and LCD module 24 of component 21 such that adhesive layer 20 is aligned with opening 260 of first support member 258. Opening 260 is sized to receive adhesive layer 20, such that adhesive layer 20 may extend through opening 260 while glass plate 22 and LCD module 24 of component 21 remain engaged with support member 258. In this way, adhesive layer 20 may be removed from component 21 while a position of component 21 remains substantially fixed. Second support member 262 helps support a different portion of component 21, e.g., to maintain the z-axis orientation of component 21. Opening 264 defined by second support member 262 is sized to receive component 21.
In order to remove adhesive 20 from component 21, a user may introduce component 21 into support members 258, 260 such that tab 20A defined by adhesive layer 20 extends through opening 260 in first support member 258. The user may stretch adhesive layer 20 to feed tab 20A through nip rollers 112, 114. For example, the user may stretch adhesive layer 20 to engage tab 20A with at least one of nip rollers 112, 114, and rotate knob 224 to rotate gear 120, and, therefore, nip roller 112 in a first direction, indicated by arrow 268, which drives gear 122 to rotate nip roller 114 in a second direction, indicated by arrow 269, which is substantially opposite direction 268. As nip rollers 112, 114 rotate in their respective directions, adhesive layer 20 may be advanced through nip rollers 112, 114 and stretched and pulled from component 21. Adhesive that is removed from component 21 and advanced through nip rollers 112, 114 may collect in collection bin 266. As shown in
Glass plate 22 and LCD module 24, which remain engaged by support members 258, 260 after adhesive 20 is removed from component 21, may be recycled or discarded.
Rollers 278A, 278B may be similar to nip rollers 112, 114 and help apply a pulling force to adhesive 20 in addition to weight 282. In other embodiments, rollers 278A, 278B may be passive rollers that help guide adhesive 20 in the negative z-axis direction as weight 282 applies a pulling force to adhesive layer 20.
Instead of or in addition to rollers 278A, 278B and/or weight 282 to apply a pulling force to adhesive layer 20, support member 274 may be moved in a positive z-axis direction in order to apply a pulling force to adhesive 20. For example, while tab 20A of adhesive layer 20 is attached to weight 282 or is substantially fixed (e.g., with the aid of clamping members), support member 274 may be advanced in the positive z-axis direction, thereby separating component 21 from adhesive layer 20, which is substantially fixed in place or is moving in the negative z-axis direction. In other embodiments, other suitable techniques for moving component 21 relative to tab 20A of adhesive layer 20 may be implemented. For example, component 21 may be fed through nip rollers that advance component 21 in a direction substantially away from the end of adhesive layer 20 comprising tab 20A, while tab 20A is fixed in place or coupled to a weight 282.
To compensate for the thickness of removed adhesive that accumulates on collection roller 288, collection roller 288 is fixed to surface 292 with spring 294. Surface 292 may be any suitable surface, such as a surface of an adhesive removal system base. Spring 294 may compress to allow center rotational axis 291 of collection roller 288 to move toward surface 292 as the thickness of any adhesive accumulated on collection roller 288 increases. Movement of collection roller 288 toward surface 294 increases the distance S between center axis of rotation 290 of mandrel 14 and center axis of rotation 291 of collection roller 288.
The platform and the support plate straddle between and, once assembled, become attached to the first and second side walls. The platform 360 has a top surface 360c with a recess 362 for holding a substrate and stretch release adhesive (not shown). Optionally, the platform includes first and second pairs of pins 363, 364 disposed along its side edges 360d. Once assembled, these pairs of pins mate with features on the first and second side walls. For example, first set of pins 363 couples with first groove 313d on the first side wall and second groove 314d on the second side wall, both the grooves being located on the respective back edges of the side walls 313b and 314b. Second pair of pins 364 couples with first notch 313c on the top edge 313a of the first side wall 313 and with second notch 314c on the top edge 314a of the second side wall 314. With this design, a user can easily interchange platform with different sized recesses. For example, the recess may be configured to receive at least a portion of a liquid crystal display (LCD) display from various mobile hand held devices, such as mobile phones, portable digital music player, personal digital assistant or a portion of an LCD from a laptop computer. The depth of the recesses would be adjusted for the appropriate application. Although the recesses are shown in rectangular shapes, other shaped configurations may be used. In this particular embodiment, the platform also includes a lip 360a that lies distal to a back edge 360b and proximate to support plate 328. There is a gap between the lip 360a of the platform and the support plate 328 to allow for the carrier tape to be threaded through.
The first roller 321 includes two cylindrical sleeves 329 that can vary in height to accommodate different size of carrier tape. For example, cylindrical sleeves for a 1 inch tape would have a larger height than that used for a 2 inch tape. Typically the sleeves are equal in height to allow the carrier tape to be aligned with the centerline of the device. On both side of the first roller 321, there are mechanical features that facilitate its installation to the first and second side wall 313, 314. For example, the first roller 321 includes a pair of arms, first (not shown) and second 321a arm that slideably engages with first slot 313f and second slot (not shown). Because the first roller sits in the vicinity of the back edge of the two side walls 313, 314, as shown in
The fifth roller 325 includes first and second arms 325a, 325b that couples with first aperture 313f on the first side wall 313 and second aperture 314f on the second side wall 314. The crank handle 352 attaches to the second arm 325b.
The device optionally includes a cover 316 having pins located near first and second side edges 316a and 316b that couple with holes on the top surface 313a, 314a of the first and second side walls. The cover can include a bar 318 that lies nearly on top of the support plate 328 towards the gap 340 once the cover is placed on the side walls. The cover optionally includes a handle 317 to facilitate easy lifting and attaching to the side walls.
Now turning to
While
The carrier tape can be any tape containing an adhesive that adheres to the tab 20a. Illustrate carrier tapes include, e.g., product number 355 and 375, which are packaging tape that are commercially available from 3M Company, St. Paul, Minn.
In one exemplary embodiment, the device has dimensions of 12 inch in length, 6.5 inch in height and 6 inch in width. The platform is generally rectangular in shape having dimensions of 6.125 inch in length and 5 inch in width. Each of the five rollers is cylindrical in shape having a height of about 5 inch. The diameter of each of the roller varies. The surface 328a of the support plate 328 (
Various embodiments of the invention have been described. These and other embodiments are within the scope of the following claims. For example, although many of the figures illustrate adhesive removal devices that hold component 21 such that a major surface of component 21 extends along the x-y plane (orthogonal x-y-z axes are shown, e.g., in
This application claims the benefit of U.S. Provisional Patent Application No. 61/036,683, filed Mar. 14, 2008, the disclosure of which is incorporated by reference herein in its entirety and U.S. Provisional Patent Application No. 61/100,428, filed Sep. 26, 2008, the disclosure of which is incorporated by reference herein in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| 61036683 | Mar 2008 | US | |
| 61100428 | Sep 2008 | US |
