Claims
- 1. An adhesive resin composition comprising, based on the total weight of the composition:
about 5 to about 95 weight percent of a first resin component having one or more glass transition temperatures of about −15 to about 50° C.; about 5 to about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100° C.; and up to about 50 weight percent of a particulate inorganic filler; wherein a tan δ value of the adhesive resin composition is greater than about 0.2 over a temperature range of about −15 to about 50° C. when measured at a frequency of 1 Hz.
- 2. The composition of claim 1, wherein the first resin component comprises a combination of resins, each having a glass transition temperature of about −15 to about 50° C.
- 3. The composition of claim 2, wherein the combination of resins includes a first resin having a glass transition temperature of about −5° C. to about 0° C. at a frequency of about 1 Hz, and a second resin having a glass transition temperature of about 20° C. to about 50° C. at a frequency of about 1 Hz.
- 4. The composition of claim 1, wherein the first resin component comprises latex acrylic resin, solvent based acrylic resin, solvent based acrylic elastomer, natural rubber, synthetic rubber, or a combination comprising at least one of the foregoing.
- 5. The composition of claim 4, wherein the first resin component comprises an acrylic copolymer comprising a plurality of repeating units having a general formula:
- 6. The composition of claim 1, wherein the second resin component has one or more glass transition temperatures greater than about 150° C.
- 7. The composition of claim 1, wherein the second resin component is present in an amount of about 10 to about 25 weight percent, based on the total weight of the total adhesive resin composition.
- 8. The composition of claim 1, wherein the second resin component comprises phenolic resin, acrylic resin, polyphenylene ether resin, or a combination comprising at least one of the forgoing resins.
- 9. The composition of claim 8, wherein the phenolic resin comprises a plurality of structural units having the formula
- 10. The composition of claim 8, wherein the phenolic resin has a molecular weight of about 300 to about 1,000.
- 11. The composition of claim 1, wherein the composition has a storage modulus that changes by less than about 3 orders of magnitude in a log scale over a temperature range of about −10° C. to about 70° C.
- 12. The composition of claim 1, wherein the inorganic filler comprises silica, alumina, titania, zirconia, glass, or a combination comprising at least one of the foregoing fillers.
- 13. The composition of claim 1, wherein the inorganic filler is present in an amount up to about 25 weight percent, based on the total weight of the adhesive resin composition.
- 14. The composition of claim 13, wherein the inorganic filler is present in an amount up to about 10 weight percent, based on the total weight of the adhesive resin composition.
- 15. The composition of claim 1, further comprising about 0.2 to about 1.5 weight percent of a viscosity modifier, based on the total weight of the adhesive resin composition.
- 16. The composition of claim 15, wherein the viscosity modifier comprises a base activated acrylic polymer or copolymer.
- 17. The composition of claim 16, wherein the viscosity modifier comprises glycerol distearate, polyethylene glycol stearate, glyceryl stearate, polymethacrylates, polyalkylacrylates, polyalkylmethacrylates, methacrylate copolymers, interpolymers of styrene and acrylic esters, carboxamido containing polymers, polyvinyl pyrrolidone, salts of acrylic and methacrylic acid polymers, styrene-maleic anhydride copolymers, polyacrylic acid compounds, polyethylene oxide, and combinations comprising at least one of the foregoing.
- 18. The composition of claim 16, wherein the viscosity modifier comprises an acrylic copolymer of ethyl acrylate, methacrylic acid, and methyl methacrylate.
- 19. The composition of claim 15, wherein the adhesive resin composition comprises less than about 1 weight percent of the inorganic filler, based on the total weight of the adhesive resin composition.
- 20. A composite comprising:
an adhesive resin layer comprising:
a first resin component having one or more glass transition temperatures of about −15 to about 50° C.; about 5 to about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100° C., based on the total weight of the adhesive resin layer; and up to 50 weight percent of a particulate inorganic filler based on the total weight of the adhesive resin layer; wherein a tan δ value of the adhesive resin layer is greater than about 0.2 over a temperature range of about −15 to about 50° C. when measured at a frequency of 1 Hz; and
a metal layer disposed on the adhesive resin layer.
- 21. The composite of claim 20, wherein the first resin component comprises a combination of resins, each having a glass transition temperature of about −15 to about 50° C.
- 22. The composition of claim 21, wherein the combination of resins includes a first resin having a glass transition temperature of about −5° C. to about 0° C. at a frequency of about 1 Hz, and a second resin having a glass transition temperature of about 20° C. to about 50° C. at a frequency of about 1 Hz.
- 23. The composite of claim 20, wherein the first resin component comprises latex acrylic resin, solvent based acrylic resin, solvent based acrylic elastomer, natural rubber, synthetic rubber, or a combination comprising at least one of the foregoing.
- 24. The composition of claim 21, wherein the first resin component comprises an acrylic copolymer comprising a plurality of repeating units having a general formula:
- 25. The composite of claim 20, wherein the second resin component has one or more glass transition temperatures greater than about 150° C.
- 26. The composite of claim 20, wherein the second resin component is present in an amount of about 10 to about 25 weight percent, based on the total weight of the adhesive resin layer.
- 27. The composite of claim 20, wherein the second resin component comprises phenolic resin, acrylic resin, polyphenylene ether resin, or a combination comprising at least one of the forgoing resins.
- 28. The composition of claim 27, wherein the phenolic resin comprises a plurality of structural units having the formula
- 29. The composition of claim 27, wherein the phenolic resin comprises a molecular weight of about 300 to about 1,000.
- 30. The composite of claim 20, wherein the adhesive resin layer has a storage modulus that changes by about 2 to about 3 orders of magnitude on a log scale over a temperature range of about −10° C. to about 70° C.
- 31. The composite of claim 20, wherein the inorganic filler comprises silica, alumina, titania, zirconia, glass, or a combination comprising at least one of the foregoing fillers.
- 32. The composition of claim 20, wherein the adhesive resin layer further comprises about 0.2 to about 1.5 weight percent of a viscosity modifier, based on the total weight of the adhesive resin layer.
- 33. The composition of claim 32, wherein the viscosity modifier comprises a base activated acrylic polymer or copolymer.
- 34. The composition of claim 33, wherein the viscosity modifier comprises glycerol distearate, polyethylene glycol stearate, glyceryl stearate, polymethacrylates, polyalkylacrylates, polyalkylmethacrylates, methacrylate copolymers, interpolymers of styrene and acrylic esters, carboxamido containing polymers, polyvinyl pyrrolidone, salts of acrylic and methacrylic acid polymers, styrene-maleic anhydride copolymers, polyacrylic acid compounds, polyethylene oxide, and combinations comprising at least one of the foregoing.
- 35. The composition of claim 33, wherein the viscosity modifier comprises an acrylic copolymer of ethyl acrylate, methacrylic acid, and methyl methacrylate.
- 36. The composition of claim 32, wherein the adhesive resin layer comprises less than about 1 weight percent of the inorganic filler based on the total weight of the adhesive resin layer.
- 37. The composite of claim 20, wherein the metal layer comprises stainless steel, copper, aluminum, zinc, iron, transition metals, alloys comprising at least one of the foregoing metals, or stainless steel.
- 38. The composite of claim 20, further comprising a second metal layer disposed on a side of the adhesive resin layer opposite to the metal layer.
- 39. A suspension assembly comprising a structural element disposed between a mount plate and a circuit element, wherein the structural element comprises:
a first metal layer fixedly attached to a second metal layer by an adhesive resin layer, wherein the adhesive resin layer comprises, based on the total weight of the adhesive resin layer:
at least 50 weight percent of a first resin component having one or more glass transition temperatures of about −15 to about 50° C.; up to about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100° C.; and up to about 50 weight percent of an inorganic filler; wherein a tan δ value of the adhesive resin layer is greater than about 0.2 over a temperature range of about −15 to about 50° C. when measured at a frequency of 1 Hz.
- 40. The assembly of claim 39, wherein the adhesive resin layer further comprises about 0.2 to about 1.5 weight percent of a viscosity modifier, based on the total weight of the adhesive resin layer.
- 41. The assembly of claim 40, wherein the adhesive resin layer comprises less than about 1 weight percent of the inorganic filler, based on the total weight of the adhesive resin layer.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority pursuant to 35 U.S.C. 119(e) to U.S. application Ser. No. 60/342,878 filed Dec. 20, 2001, the above application being incorporated herein by reference in its entirety including incorporated material.
Provisional Applications (1)
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Number |
Date |
Country |
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60342878 |
Dec 2001 |
US |