Patent Application
20100039012
The present disclosure relates generally to thermal management systems for LEDs, and more specifically to LED modules containing synthetic jet ejectors.
A variety of thermal management devices are known to the art, including conventional fan based systems, piezoelectric systems, and synthetic jet actuators. The latter type of system has emerged as a highly efficient and versatile solution where thermal management is required at the local level. In some applications, synthetic jet actuators are utilized in conjunction with a conventional fan based system to produce hybrid thermal management systems. In such hybrid systems, the fan based system provides a global flow of fluid through the device being cooled, and the synthetic jet ejectors provide localized cooling for hot spots and also augment the global flow of fluid through the device by perturbing boundary layers.
Various examples of synthetic jet actuators, and thermal management systems based on these devices, are known to the art. Some examples include those disclosed in U.S. 20070141453 (Mahalingam et al.) entitled “Thermal Management of Batteries using Synthetic Jets”; U.S. 20070127210 (Mahalingam et al.), entitled “Thermal Management System for Distributed Heat Sources”; 20070119575 (Glezer et al.), entitled “Synthetic Jet Heat Pipe Thermal Management System”; 20070119573 (Mahalingam et al.), entitled “Synthetic Jet Ejector for the Thermal Management of PCI Cards”; 20070096118 (Mahalingam et al.), entitled “Synthetic Jet Cooling System for LED Module”; 20070081027 (Beltran et al.), entitled “Acoustic Resonator for Synthetic Jet Generation for Thermal Management”; and 20070023169 (Mahalingam et al.), entitled “Synthetic Jet Ejector for Augmentation of Pumped Liquid Loop Cooling and Enhancement of Pool and Flow Boiling”.
In one aspect, an LED light source is provided which comprises (a) an LED module containing an LED; (b) a heat sink disposed about the periphery of the LED module; and (c) a tabular synthetic jet ejector disposed on said LED module and being adapted to direct a plurality of synthetic jets across surfaces of said heat sink.
In another aspect, a light source is provided which comprises (a) an LED module having first, second and third surfaces; (b) a synthetic jet ejector disposed upon, or adjacent to, said first surface; (c) a light-emitting region disposed on said second surface; and (d) a heat sink disposed on said third surface, said heat sink comprising a plurality of fins and having a plurality of channels formed by adjacent fins; wherein said synthetic jet ejector operates to direct each of a plurality of synthetic jets along the longitudinal axis of one of said channels.
Despite the foregoing advances, a need still exists in the art for new thermal management solutions. In the case of LED light sources in particular, the increasing power and compactness of LED semiconductor devices has strained existing thermal management technologies, even while specific lighting applications themselves impose significant design constraints that prevent previous thermal management solutions from being scaled up to meet those needs. Accordingly, a need exists in the art for new thermal management solutions which are suitable for use in conjunction with LED light sources.
It has now been found that the foregoing needs may be met with the devices and methodologies herein. These devices and methodologies leverage the flexibility of synthetic jet ejectors to create compact LED light sources with excellent thermal management capabilities.
In the particular embodiment depicted, the LED module 103 is essentially polyhedral in shape, and more specifically, is essentially prismatic in shape. The LED module 103 is equipped on one surface thereof with a port 111 (see
The synthetic jet ejector 105 in the particular embodiment depicted is generally tabular in shape. The central portion thereof houses a pair of synthetic jet actuators 115 (see
In some embodiments, both actuators are in fluidic communication with all of the apertures, preferably by way of a central plenum. In other embodiments, the interior of the actuators may be segregated or provided with partitions, flow control devices or features such that one actuator is in fluidic communication with a first set of apertures, while the other actuator is in fluidic communication with a second set of apertures. In such an embodiment, for example, the first actuator may be in fluidic communication with the apertures on a first side of the device and the second actuator may be in fluidic communication with the apertures on a second side of the device. In another such embodiment, the first actuator may be in fluidic communication with the apertures on one half of each side of the device, while the second actuator is in fluidic communication with the remainder of the apertures.
The synthetic jet actuators depicted in this particular embodiment are acoustic actuators having electromagnetically driven diaphragms. These actuators are described in detail in commonly assigned U.S. Ser. No. 12/156,846 (Heffington et al.)(see especially FIGS. 10 and 26-31 thereof), which is incorporated herein by reference in its entirety. Of course, it will be appreciated that, in other embodiments, piezoelectric actuators may be utilized instead. The actuators 115 may also be disposed in various orientations (e.g., upside down). In some embodiments, the actuators 115 and/or the LED light source 101 may be assembled into single or multiple stacked configurations as described, for example, in commonly assigned U.S. Ser. No. 12/288,144 (Booth et al.), which is incorporated herein by reference in its entirety.
The heat sink 107 in this particular embodiment consists of first 108 and second 110 sections (see
In use, the synthetic jet ejector 105 produces synthetic jets in the channels defined by adjacent fins 109 of the heat sink 107. The turbulence created by these jets disrupts the boundary layers formed along the surfaces of the fins 109, and hence facilitates heat exchange between the heat sink 107 and the external environment. This, in turn, provides efficient cooling of the LED module 103 which is in thermal contact with the heat sink 107.
Various modifications may be made to the particular embodiments of the devices and methodologies described above without departing from the scope of the teachings herein. For example, while the embodiments described herein feature a synthetic jet ejector having two actuators, it will be appreciated that other embodiments of the devices made in accordance with the teachings herein may feature a single actuator, or may be equipped with more than two actuators.
Moreover, while the specific embodiments of the LED light sources described herein are essentially polyhedral in shape, it will be appreciated that LED light sources may be made in accordance with the teachings herein which have various other shapes and geometries. By way of example, LED light sources may be constructed in accordance with the teachings herein which are conical, tubular, columnar, polygonal, or irregular in shape. It will further be appreciated that the synthetic jet ejector may also assume a variety of geometries.
It will further be appreciated that the number and type of LEDs used in the devices described herein may vary from one application to another. For example, in some applications, a plurality of LEDs, each of which emits essentially monochromatic radiation, may be utilized in combination with each other and with suitable color mixing within a single LED light source to produce a device having a desired spectral footprint, such as white light.
It is also to be noted that various types of heat spreaders and heat pipes may be utilized in the devices and methodologies described herein. For example, a heat spreader or heat pipe may be utilized to transfer heat from the vicinity of the LED(s) to the heat sink or the fins thereof, where the heat can be transferred to the ambient environment with the aid of the synthetic jet ejector. In some embodiments, a heat spreader or heat pipe may be utilized which extends into the fins of the heat sink.
The fins in the heat sinks described herein may be formed through the use of various processes including, for example, through extrusion, die casting, skiving or swaging. They may also be formed from various materials including, but not limited to, aluminum, copper and other metals.
The above description of the present invention is illustrative, and is not intended to be limiting. It will thus be appreciated that various additions, substitutions and modifications may be made to the above described embodiments without departing from the scope of the present invention. Accordingly, the scope of the present invention should be construed in reference to the appended claims.
This application claims the benefit of priority from U.S. Provisional Application No. 61/134,966 filed Jul. 15, 2008, having the same title, and having the same inventors, and which is incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| 61134966 | Jul 2008 | US |
