Patent Application
20070075824
Embodiments are generally related to potentiometer devices. Embodiments are also related to Advanced Thick-Film (ATF) materials and ATF devices.
Potentiometers are utilized in a variety of commercial, industrial and aerospace applications. A potentiometer is a device that provides an adjustable electric potential. Essentially, this instrument balances the unknown voltage against a known, adjustable voltage. Potentiometers are frequently utilized to convert rotary and linear motion into an electrical signal. A typical potentiometer can be implemented in the context of a voltage divider utilized for measuring, rotary angles or linear motion. Usually, a potentiometer or “pot” is utilized as an inexpensive position sensor or feedback device in motion control systems.
One type of potentiometer that has been implemented in various commercial, industrial and aerospace applications is the thick film potentiometer, which is based on “thick film” fabrication technology. A thick-film potentiometer typically includes a support substrate, particularly a plastic substrate, onto which there is applied at least one resistance path of resistance composition which is contacted via conductive lines on the support substrate at least at its ends and possibly at fixed tapping points arranged between its ends, and having a wiper path which extends along the resistance path and over which a wiper is swingable. In such known rotary resistors or potentiometers of thick-film type, the resistance path is provided also in the region of the wiper path above the contact paths. The wiper accordingly contacts on the resistance composition over the entire region of the wiper path.
Current thick film potentiometers are fabricated onto plastic or laminate substrates that limit the power dissipation, and the upper operating temperature as well as the form factors thereof. Such devices can also be costly to fabricate, particularly in low volumes. It is therefore believed that a solution to such limitations involves the design and implementation of an improved ATF potentiometer device that can be produced in low volumes and which provides for improved power, dissipation and high temperature performance. An ATF potentiometer can also be implemented on non-flat surfaces. Such an improved potentiometer is described in greater detail herein.
The following summary is provided to facilitate an understanding of some of the innovative features unique to the embodiments and is not intended to be a full description. A full appreciation of the various aspects of the embodiments disclosed can be gained by taking the entire specification, claims, drawings, and abstract as a whole.
It is, therefore, one aspect of the present invention to provide for an improved potentiometer.
It is another aspect of the present invention to provide for an advanced thick-film (ATF) potentiometer.
It is a further aspect of the present invention to provide for an advanced thick-film (ATF) potentiometer fabricated from an array of ATF components configured upon a substrate material, such as, for example, metal or alumina.
The aforementioned aspects of the invention and other objectives and advantages can now be achieved as described herein. A potentiometer apparatus and method are disclosed. In general, a plurality of potentiometer components can be etched onto a substrate. The substrate can be then electrically insulated by depositing and firing a thin layer of ceramic thereon. Next a conductor layer can be printed and fired upon the substrate and over the array of potentiometer components. Thereafter, a thick film layer can be configured upon the substrate. Each potentiometer component can then be trimmed from among the plurality of potentiometer components in order to obtain a proper resistance and linearity for each potentiometer component thereof, thereby forming a potentiometer apparatus from each potentiometer among the plurality of potentiometer component. The resulting potentiometer apparatus thus constitutes an advanced thick-film (ATF) potentiometer. The substrate can be provided as a metal substrate, such as, for example, a FeCr alloy. Alternatively an insulating substrate can also be used as, for example, an alumina substrate that would not require any additional insulation layer between the substrate & conductive or resistive layers.
The plurality of potentiometer components can be implemented as an array of potentiometer components, wherein the array of the potentiometer components is etched into a thin sheet of the substrate. Each potentiometer component of the array of potentiometer components may include disc and/or rectangular shapes. Such an array of potentiometer components may be provided the form of a rotary array or a linear array, depending upon design considerations.
A plurality of potentiometers can also be fabricated onto a non-flat surface, such as a long shaft. The processing and materials for such a configuration are similar to the processes described above. Leveraging the insulating and conductive layering of the ATF potentiometer construction, electronic components can be placed onto the resulting ATF potentiometer device. Such electronic components can perform functions such as signal conditioning or output digitization, while also allowing for all linearity corrections to be accomplished electronically.
The accompanying figures, in which like reference numerals refer to identical or functionally-similar elements throughout the separate views and which are incorporated in and form a part of the specification, further illustrate the embodiments and, together with the detailed description, serve to explain the principles of the disclosed embodiments.
The particular values and configurations discussed in these non-limiting examples can be varied and are cited merely to illustrate at least one embodiment and are not intended to limit the scope of the invention.
The ATF potentiometer component 102 includes a substrate 108 and an insulating layer 110. A thick film trace 106 can be configured on the insulating layer 110 and surrounding a circular conductive path 104. The substrate 108 can be provided as a metal substrate, such as, for example, an FeCr alloy. Substrate 108 may also be provided as an alumina substrate, depending upon design considerations. Dual concentric traces 106 and 104 can be printed on insulator 110 in order to create a potentiometer apparatus thereof. The outer trace 106 can function as, for example, a thick film resistor, while the inner trace 104 can be implemented from a conductive material such as, for example, gold or thick film as well.
The array 100 of potentiometer components 102, 112, 114, 116, 118, 120, 122, 124, 126, 128, and 130 can be etched onto substrate 108. Next a conductor layer (e.g., to form layer or trace 104) can be printed and fired upon the substrate 108 and over the array 100 of potentiometer components 102, 112, 114, 116, 118, 120, 122, 124, 126, 128, and 130. Thereafter, a thick film layer (e.g., to form thick film trace 106) can be configured upon the substrate 108.
Each potentiometer component 102, 112, 114, 116, 118, 120, 122, 124, 126, 128, and 130 can then be trimmed from among array 100 of potentiometer components 102, 112, 114, 116, 118, 120, 122, 124, 126, 128, and 130 in order to obtain the proper resistance and linearity for each potentiometer component 102, 112, 114, 116, 118, 120, 122, 124, 126, 128, and 130 thereof, thereby forming a potentiometer apparatus from each potentiometer component of the array 100. The resulting potentiometer apparatus (e.g., such as ATF potentiometer apparatus or component 102) thus constitutes an advanced thick-film (ATF) potentiometer.
The resulting ATF potentiometer apparatus 102, for example, can be fabricated by etching the array 100 of round disks 102, 112, 114, 116, 118, 120, 122, 124, 126, 128, and 130 into a thin sheet of the substrate 108 material. If necessary, an insulating ceramic layer 110 can be coated and fired onto substrate 108. Then, a conductive layer can be printed and fired, followed by a thick film layer. The elements 102, 112, 114, 116, 118, 120, 122, 124, 126, 128, and 130 are then trimmed while still in the array 100 in order to obtain the proper resistance and linearity. Alternatively, the elements 102, 112, 114, 116, 118, 120, 122, 124, 126, 128, and 130 can be formed into linear array configurations instead of rotary arrays. Linearity trimming thus can be accomplished while in the array 100 using printed I/O pads 134, 136, 138, 140, 142, 144, 146, 148, 150, 152, 154, and 156 on the array 100.
Note that in
Circuit 300 can function in the context of a potentiometer encoder. In such a configuration, alumina may be utilized for the backing material or substrate 108 described earlier. Circuit 300 can be provided as a circuit layout fabricated onto the reverse side of a potentiometer, such as, for example, any one of the resulting potentiometers 102, 112, 114, 116, 118, 120, 122, 124, 126, 128, and 130. The microcontroller 308 can be incorporated into circuit 300 to enable the creation of a high accuracy potentiometer (e.g., approximately 0.05%). A signal-conditioning Application Specific Integrated Circuit (ASIC) can also be utilized in place of or in addition to microcontroller 308 in the context of circuit 300 in order to result in a high accuracy potentiometer. Another option involves the incorporation of an electrical bus system to create a low cost digital position sensor.
It will be appreciated that variations of the above-disclosed and other features and functions, or alternatives thereof, may be desirably combined into many other different systems or applications. Also that various presently unforeseen or unanticipated alternatives, modifications, variations or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.
