Patent Application
20050254213
The present invention relates in general to an air conditioning heat dissipation system, and more particularly, to an air conditioning heat dissipation apparatus use in a host system such as a computer host. The air conditioning heat dissipation system is operative to generate cold air to reduce the temperature of the host system, so as to enhance the heat dissipation performance of the host system.
Passive devices or apparatus operative to generate heat during operation are installed in most of current host systems such as computer systems. The heat generating devices or apparatus include central processing units, power supplies, and hard drives, for example. Since the host system normally includes a housing enclosing all the heat generating devices therein, the temperature of the host system cannot hardly reduced. Therefore, heat dissipation apparatus is required to dissipate the temperature inside the host system, so as to avoid the normal operation of the passive devices and the apparatus to be affected by excessively high temperature. The heat apparatus normally includes a fan attached to a rear side of the housing to induce the ambient air into the housing, so as to reduce the temperature therein.
The above heat dissipation apparatus introduces external air into the housing of the host system, so as to reduce the temperature inside of the housing. When the room temperature (ambient temperature of the host system) is warm, the cooling effect by introducing the external air is very limited. Under such circumstance, the heat generated by the passive devices or various apparatus is accumulated within the housing. Even a plurality of fans is used for increasing the flow rate of the external air flowing into the housing, the heat dissipation effect is very limited.
To resolve the problems caused by the conventional heat dissipation apparatus as described above, with many years of experience in this field, an air conditioning heat dissipation system has been developed as described as follows.
The present invention provides an air conditioning heat dissipation system which effectively reduces the temperature inside of a host, so as to enhance the operation stability of the host.
The present invention further provides an air condition heat dissipation system which does not generate heat inside of the host system. Instead, the heat generated by the air condition heat dissipation system is located external to the host system, such that the temperature inside the host system can be greatly reduced.
The air conditioning heat dissipation system comprises a heat dissipation device and an enclosure. The heat dissipation device includes a top and a bottom heat sinks secured to each other and a cryogenic chip sandwiched between the top and bottom heat sinks. The enclosure comprises a box assembly and a planar assembly extending from one side of the box assembly. The box assembly is operative to receive the heat dissipation device therein, and the planar assembly includes a channel having one end in communication with the box assembly and the other end open to external.
In one embodiment, the cryogenic chip comprises a cryogenic face adjacent to the bottom heat sink and a heating face adjacent to the top heat sink. The heat dissipation device further comprise a top fan mounted on top of the top heat sink and a bottom fan mounted to a bottom of the bottom heat sink. Preferably, the box assembly includes a top surface and a bottom surface perforated with a plurality of venting holes. The planar assembly includes a pair of tracks formed on two external sidewalls thereof. A holder is used for receiving the planar assembly therein. The holder is installed in a host before the planar assembly is installed therein. The holder includes a pair of tracks formed on a pair of internal sidewalls thereof. The tracks of the planar assembly are engageable with the tracks formed in the holder. The system further comprises a control device to control operation of the top and bottom fans and the cryogenic chip. The control device comprises a circuit board and a switch and a plurality of connecting interfaces formed on the circuit board.
These and other objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of preferred embodiments.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the invention as claimed.
The above objects and advantages of the present invention will be become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
As shown in
The air conditioning heat dissipation apparatus 100 further comprises a cryogenic chip 5 sandwiched between the substrates of the first and second heat sinks 1 and 2. In operation, one face of the cryogenic chip 5 serves as the cryogenic face, while the other face of the cryogenic chip 5 serves as the heating face. The ambient temperature around the heating face thus becomes higher when the cryogenic chip 5 is operating. In this embodiment, the cryogenic face of the cryogenic chip 5 is abutting the substrate of the second heat sink 2 under the first heat sink 1. In contrast, the heating face of the cryogenic chip 5 is abutting the substrate of the first heat sink 1 over the second heat sink 2. Thus assembled, a mask 6 can be used to mask the first heat sink 1 (as shown in
Further referring to
A control device 86 is installed in the bottom lid 8 for controlling operation of the fans 3 and 4 and the cryogenic chip 5. The control device 86 includes a circuit board 861, and a switch 862 and a plurality of connecting interfaces 863 formed on the circuit board 861. The connecting interfaces 863 provide electric communication to the fans 3 and 4 and the cryogenic chip 5. The circuit board 862 is in electric communication with a power connector 865 via a plurality of wirings 864. The power connector 865 is to be connected to a power source. In addition, tracks 87 may be formed on two external sidewalls of the planar plate 83 of the bottom lid 8, such that the assembly 10 can be mounted to the holder 9 of the host 200.
As shown in
Referring to
Referring to
Referring to
Meanwhile, the heat generated by the cryogenic chip 5 is delivered upwardly through the heating face attached to the first heat sink 1 and the first heat sink 1. The heat is further guided out of the enclosure 20 through the venting holes 72 by the fan 3. Therefore, heat generated by the cryogenic chip 5 will not enter the host 200.
According to the above, the air-condtioning heat dissipation system 100 can efficiently reduces the temperature of the host, so as to enhance operation stability of thereof. As the heat source is disposed external to the host, and a heat dissipation mechanism is installed to effectively dissipate heat generated by the system, the heat dissipation performed is further improved.
The system 100 can also be inserted to the host from a rear panel as shown in
While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those of ordinary skill in the art the various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.
