1. Technical Field
The disclosure generally relates to air conducting covers, particularly to an air conducting cover which can effectively prevent air from flowing back into the electronic devices.
2. Description of Related Art
Many electronic components in an electronic device generate heat when operating. In designing an electronic device, cooling systems are used to dissipate heat generated by the electronic components to prevent the electronic components from overheating.
Many cooling systems include a group of fans and an air conducting cover. The air conducting cover is positioned above the electronic components most likely to become hot. The fans are positioned on corresponding air entrances of the air conducting cover to force airflow to enter the air conducting cover and pass through the electronic components for heat dissipation. However, when one of the fans stops working, the airflow in the air conducting cover will usually generate a return/back airflow, and go out of the air entrance corresponding to the stopping fan. Thus, the airflow of the fans is easily lost, and decreases the dissipating effects.
Therefore, there is room for improvement within the art.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the exemplary air conducting cover for electronic device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment.
Referring to
The chassis 10 includes a base plate 11, two opposite sidewalls 12, and two opposite end walls 13 connecting the sidewalls 12. The sidewalls 12 and the ends walls 13 are substantially perpendicularly connected to edges of the base plate 11. The motherboard 20 is mounted on the base plate 11. In the exemplary embodiment, the first electronic component 27 and the second electronic component 28 are central processing units (CPUs) mounted on the motherboard 20.
The first group of fans 30 is made of three fans 31, 32, 33, and the second group of fans 35 is made of three fans 36, 37, 38. The fans 31 to 38 are arranged along a line.
The air conducting cover 40 is positioned above the motherboard 20 for covering the first electronic component 27 and the second electronic component 28. The air conducting cover 40 includes a middle partition 41 and an end plate 42. The middle partition 41 divides the air conducting cover 40 to a first space 410 and a second space. 420. The first group of fans 30 is configured for dissipating heat in the first space 410, and the second group of fans 35 is configured for dissipating heat in the second space 420.
The end plate 42 is substantially parallel to one of the sidewalls 12. The end plate 42 defines six air entrances 43. The fans 31 to 38 are positioned between the end wall 42 and the sidewall 12. Each fan faces a corresponding air entrance 43. Each air entrance 43 has two opposite flaps 44 formed on the end plate 42. The flaps 44 are integrally formed with the air conducting cover 40. Two adjacent air entrances 43 have a common flap 44. In the exemplary embodiment, there are seven flaps 44. Each flap 44 is made of metal or plastics, and is flexibly connected to the air conducting cover 40 for swing/rotating toward left sides or right side relative to the end plate. In the exemplary embodiment, when airflow returns in one air entrance 43, the return airflow can swing/rotate the corresponding flaps 42 to close the corresponding air entrance 43. A width of each flap 44 is substantially half of the diameter of the air entrance 43. In the exemplary embodiment, the flaps 44 positioned at a brim are angled toward the corresponding air entrance 43 relative to the end plate 42. The other flaps 44 are substantially perpendicular to the end plate 42.
In use, referring to
It is to be understood, however, that even through numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the system and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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101104146 | Feb 2012 | TW | national |