1. Technical Field
The present disclosure relates to air conduction devices, and particularly to an air conduction device used in a computer.
2. Description of Related Art
Electronic devices, such as computers, use heat dissipation assemblies for dissipating heat generated by components therein, thus preventing the components from becoming overheated. An air conduction device is often used in a computer with a fan to assist in heat dissipation. The air conduction device includes an airduct covering the heat generating components of the computer, and a fan installed at or near the inlet of the airduct to generate airflow to dissipate heat from the heat generating components covered by the airduct. However, airflow from the airduct is non-variant, if the heat generating components generate more heat, the components may still be overheated, which may harm the components.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
A first heat sink 13 and a second heat sink 14 are mounted to the circuit board 11. The first heat sink 13 is adjacent to the first heat generating member 10 and diagonal to the second heat sink 14, and aligns with the second heat generating member 20. The second heat sink 14 is adjacent to the second heat generating member 20, and aligns with the first heat generating member 10.
The main body 30 includes a top plate 31, and two side plates 32 extending downward from opposite sides of the top plate 31. A plurality of protrusions 322 extends from a bottom of each side plate 32. A clapboard 33 extends downward from the top plate 31, between the side plates 32, therefore, a first passage 35 and a second passage 34 are formed between the clapboard 33 and the side plates 32. A plurality of protrusions 332 extends from a bottom of the clapboard 33. The top plate 31 defines a substantially trapezoid-shaped cutout 36 communicating with the first passage 35. The cutout 36 includes two opposite slanted sidewalls 362 connected between the clapboard 33 and the corresponding side plate 32. Each slanted sidewall 362 defines a plurality of slots 364 aligned in a slanting line from an upper portion to a lower portion of the slanted sidewall 362. Two bar-shaped guide members 334 extend from the clapboard 33, facing the cutout 36. Each guide member 334 is adjacent and parallel to the corresponding slanted sidewall 362.
Each adjusting member 40 includes a substantially L-shaped connection portion 42 and a lock portion 44. The connection portion 42 includes a connection board 422 and a guide board 424 substantially extending down from a side of the connection board 422. A depressed portion 426 is defined in the connection potion 42, extending from a first side of the connection board 42 opposite to the lock portion 44 to the guide board 424. A gap 43 is defined between the connection board 422 and a side of the depressed potion 426 opposite to the guide board 424.
The lock portion 44 slantingly extends from a second side of the connection board 422 opposite to the first side, at an angle equaling to the slanting angle of the corresponding slanted sidewall 362. An elastic hook 442 extends from the lock portion 44.
Referring to
In use, the protrusions 322 and 332 are engaged in the circuit board 11, and the main body 30 of the air conduction device covers the first and second heat generating members 10 and 20, and the first and second heat sinks 13 and 14. The first heat generating member 10 and the second heat sink 14 are accommodated in the second passage 34. The second heat generating member 20 and the first heat sink 13 are accommodated in the first passage 35, and the cutout 36 of the main body 30 is located above the second heat generating member 20.
Referring to
It is believed that the present embodiments and theirs advantages will be understood from the foregoing description, and they will be apparent that various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of their material advantages, the examples hereinbefore described merely being exemplary embodiment.
Number | Date | Country | Kind |
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201010538844.3 | Nov 2010 | CN | national |