Patent Application
20170276149
Contemporary high-power-dissipating electronics produce heat that requires thermal management to maintain the electronics at a designed working temperature range. Heat must be removed from the electronic device to improve reliability and prevent premature failure of the electronics. Cooling techniques may be used to minimize hot spots.
In one aspect, an embodiment relates to an airflow generator for use with an object, having a flexible structure having a first side and a second side where the first side of the flexible structure is spaced from a portion of the object to define an air space therebetween and at least one piezoelectric structure located on the flexible structure and wherein the flexible structure forms the air space therebetween without an opposing flexible structure and actuation of the at least one piezoelectric structure results in movement of the flexible structure to increase the volume of the air space therebetween to draw air in and then decrease the volume of the air space therebetween to push out the drawn in air such that the object is cooled by the airflow created by the airflow generator.
In another aspect, an embodiment relates to an array of airflow generators for cooling an object, having multiple airflow generators with each airflow generator, having a flexible structure having a first side and a second side where the first side of the flexible structure is spaced from a portion of the object to define an air space therebetween and at least one piezoelectric structure located on the flexible structure wherein actuation of the piezoelectric structures of the multiple airflow generators results in movement of the flexible structures to increase the volume of the air space therebetween to draw air in and then decrease the volume of the air space therebetween to push out the drawn in air such that the object is cooled by the airflow created by each of the multiple airflow generators.
In the drawings:
A piezoelectric structure 24, for example a piezoelectric crystal, may be located on the flexible structure 20. In the illustrated example, the piezoelectric structure 24 is located at the center of the flexible structure 20 although this need not be the case. While the piezoelectric structure 24 may be located, elsewhere locating it at the center of the flexible structure 20 is believed to increase the deflection of the flexible structure 20. The piezoelectric structure 24 may be operably coupled to a suitable power source through connections (not shown). While at least one single piezoelectric structure 24 may be included on the flexible structure 20, it will be understood that multiple piezoelectric structures may be located on the flexible structure and additional piezoelectric structures 24 have been illustrated in phantom to illustrate this. It will be understood that any number of piezoelectric structures 24 may be included on the flexible structure 20 including a single piezoelectric structure 24. If multiple piezoelectric structures 24 are included, they may be configured to be actuated simultaneously.
During operation, the actuation of the piezoelectric structure 24 results in movement of the flexible structure 20 to increase the volume of the air space therebetween 15 to draw air in and then decrease the volume of the air space therebetween 15 to push out the drawn in air such that the object is cooled by the airflow created by the airflow generator 10. More specifically, when a voltage is applied to the piezoelectric structure 24 the flexible structure 20 is caused to bend such that it is convex as illustrated in
By way of further non-limiting example,
One difference is that in the illustrated example, the object 112 has been illustrated as a heat-exchanging element in the form of a heat sink having several fins 116. Surfaces 114 are located between the fins 116 of the object 112. Another difference is that an array of airflow generators 110 for cooling the object 112 has been illustrated. More specifically, multiple airflow generators 110 with each airflow generator 110 having a flexible structure 120 and at least one piezoelectric structure 124 located on the flexible structure 120. The multiple airflow generators 110 are spaced from the object 112 to form a number of air space therebetween 115.
While the flexible structure has been illustrated as extending over only a portion of the length of the object 112 it will be understood that the flexible structure 120 may be any suitable size including that it may extend the entire length of the object 112. Further, it will be understood that any number of piezoelectric structures 124 may be included on such flexible structure 120. Further still, the multiple airflow generators 110 may be located end-to-end between fins 116 of the object 112.
The operation of the airflow generators 110 is similar to that of the airflow generator 10 previously described such that actuation of the piezoelectric structures 124 results in movement of the flexible structures 120 to increase the volume of the multiple air space therebetween 115 to draw air in (
By way of further non-limiting example,
One similarity is that an array of airflow generators 210 has been illustrated. One difference is that additional airflow generators 210 have been illustrated between the fins 216 of the object 212. Further, the flexible structures 220 are oriented in a different manner between surfaces 214 created by the fins 216 such that the illustrated multiple airflow generators 210 are spaced from multiple surfaces of the object 212 to define multiple air space therebetween along the multiple surfaces of the object 212. More specifically, two portions of air therebetween are created 215A and 215B. The first side 222 is spaced from a surface 214 to define a first air space therebetween 215A and a second side 223 is spaced from another surface 214 to define a second air space therebetween 215B. While, the multiple airflow generators 210 are illustrated as being located end-to-end between fins 216 of the object 212, this need not be the case.
Instead, a single airflow generator could be used along all or a portion of the object or the airflow generators may be spaced along the length of the object, etc.
During operation, actuation of the piezoelectric structure 224 results in movement of the flexible structure 220 to increase and decrease the volume of the first and second air space therebetween 215A, 215B to draw air in and push out the drawn in air. More specifically, when a first voltage is applied to the piezoelectric structure 224 the flexible structure 220 may flex towards the air space therebetween 215A this may cause air to enter the air space therebetween 215B, as shown by arrows 240, and leave the air space therebetween 215A as shown by arrows 242. When an alternating voltage is applied to the piezoelectric structure 224 the flexible structure 220 may flex towards the air space therebetween 215B and this may cause air to enter the air space therebetween 215A, as shown by arrows 240, and leave the air space therebetween 215B, as shown by arrows 242. The motion of the flexible structure 220 creates a flow of air that may be utilized in cooling multiple surfaces of the object 212. While the multiple airflow generators 210 are illustrated as flexing in the same directions at the same time, it is also contemplated that the airflow generators 210 may be actuated to flex in opposite directions and/or may be actuated at different times including that the airflow generators 210 may be actuated in series or sequentially down a length of the object 212 to move air along the object 212.
In the above embodiments, the airflow generator(s) may be mounted to the object in any suitable manner. By way of non-limiting example, multiple brackets may be used for mounting the flexible structures to the object or a structure near the object. It will be understood that the airflow generators described above may be oriented in any suitable manner with respect to the object such that the airflow generator may produce one or more flows of air that aids in cooling the object. The airflow generators may be utilized with any device that requires thermal management for heat dissipation such as electronic components that require a uniform temperature distribution due to thermal sensitivity. For example, the airflow generators may be used with both airborne, shipboard, and ground based electronics. Further, the above-described embodiments may be spaced from multiple surfaces and portions of an object to cool the multiple surfaces and portions of the object.
The embodiments described above provide a variety of benefits including that such airflow generators solve the thermal management problem of cooling electronic devices with high power dissipations, with local hot spots, or electronic components that require a uniform temperature distribution. The airflow generators described above are easy to manufacture, have low electrical draw, are lightweight, and increase component reliability. The above-described embodiments are also lighter and less expensive than contemporary airflow generators.
To the extent not already described, the different features and structures of the various embodiments may be used in combination with each other as desired. Some features may not be illustrated in all of the embodiments, but may be implemented if desired. Thus, the various features of the different embodiments may be mixed and matched as desired to form new embodiments, whether or not the new embodiments are expressly described. All combinations or permutations of features described herein are covered by this disclosure.
This written description uses examples to disclose the embodiments, including the best implementation, to enable any person skilled in the art to practice the embodiments, including making and using the devices or systems described and performing any incorporated methods presented. The patentable scope of the application is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US2014/052547 | 8/25/2014 | WO | 00 |
