ALBUMIN SOLDER FOR WOUND CLOSURE

Information

  • Research Project
  • 2643509
  • ApplicationId
    2643509
  • Core Project Number
    R43GM057698
  • Full Project Number
    1R43GM057698-01
  • Serial Number
    57698
  • FOA Number
  • Sub Project Id
  • Project Start Date
    9/30/1998 - 25 years ago
  • Project End Date
    2/28/1999 - 25 years ago
  • Program Officer Name
  • Budget Start Date
    9/30/1998 - 25 years ago
  • Budget End Date
    2/28/1999 - 25 years ago
  • Fiscal Year
    1998
  • Support Year
    1
  • Suffix
  • Award Notice Date
    9/25/1998 - 25 years ago

ALBUMIN SOLDER FOR WOUND CLOSURE

Our objective is to develop an albumin solder as a complete or partial substitute for sutures or staples during surgery. The solder is applied on the wound and welding is achieved by laser irradiation. The welding requires heat that may cause tissue necrosis. The investigators propose to produce a "low temperature" solder by removing heat stabilizers from albumin. To obtain a product suitable for clinical use, they plan to introduce an additional viral inactivation step based on UVC irradiation, to explore chromatographic techniques appropriate for the removal of heat stabilizers (to reduce denaturation temperature), and to explore a suitable bacterial sterilization technique based on either gamma irradiation or sterile filtration. The methods of evaluation of the solder quality and performance include: (i) quantitative determination of heat stabilizers, (ii) determination of denaturation temperature, (iii) in vitro determination of bonding strength using hairless guinea pig skin, (iv) monitoring wound healing in vivo in a dermal incision model in hairless guinea pigs, and (v) effect on cell cultures relevant to wound healing. The significance of an albumin solder for wound closure stems from limitations of the conventional techniques, such as stapling and suturing, which in certain surgical procedures are difficult and time consuming and may leak or bleed at the suture line. PROPOSED COMMERCIAL APPLICATION: "Low temperature" albumin solder will provide a replacement for sutures and staples. The clinical applications range from micro- to macro- surgery. The albumin solder proposed here will be particularly useful in minimally invasive surgery when sutures and staples are either inappropriate, cumbersome, or time consuming. Albumin solder has a market potential of at least $100 million.

IC Name
NATIONAL INSTITUTE OF GENERAL MEDICAL SCIENCES
  • Activity
    R43
  • Administering IC
    GM
  • Application Type
    1
  • Direct Cost Amount
  • Indirect Cost Amount
  • Total Cost
  • Sub Project Total Cost
  • ARRA Funded
  • CFDA Code
    821
  • Ed Inst. Type
  • Funding ICs
  • Funding Mechanism
  • Study Section
    ZRG7
  • Study Section Name
  • Organization Name
    PANACOS PHARMACEUTICALS, INC.
  • Organization Department
  • Organization DUNS
    879184489
  • Organization City
    WATERTOWN
  • Organization State
    MA
  • Organization Country
    UNITED STATES
  • Organization Zip Code
    024722815
  • Organization District
    UNITED STATES