The invention is related to an optical and electrical connector assembly used in a coupling system, and particularly to the connector equipped with the magnet structures for precise alignment therebetween. The instant application relates to the copending application having the same applicant, the same filing date and a title of “LENS SURROUNDED BY MAGNET”.
The existing high frequency microwave chip may perform high speed signal transmission. Anyhow, it is required to have the two corresponding chips coupled precisely for eliminating the transmission loss. At the same time, it is also required to have the lens associated with the chip for optical signal transmission. The traditional connection is to use a pair of connectors, of which one has a protruding structure and the other has a recessed structure receiving such a protruding structure therein for aligning and retaining the coupled connector together. Anyhow, such arrangement may fit for the traditional heavy duty style while not for the modern type requiring the smooth interface and gentle treatment.
It is desired to provide a connector assembly for both electrical and optical transmission thereof with an easy and precise coupling device thereof.
To achieve the above desire, a new coupling system is provided with two mutually perpendicular interfaces wherein a first interface equipped with magnets is the active one to actuate the second one aligned precisely for efficient signal transmission. The coupling system includes a first connecting unit and a second connecting unit adapted to be connected to each other either directly or indirectly through an adaptor. Each of the first connecting unit and a second connecting unit includes an enclosure with a first mating surface and a second mating face perpendicular to each other, a pair of chip modules and an electrical connector. The electrical connector is exposed on the first mating surface while the chip module is protectively hidden behind the second mating surface. A printed circuit board assembly is disposed in the enclosure, on which both the electrical connector and the chip modules are mounted. The electrical connector is equipped with magnets for activating mating with a counterpart electrical connector. An absorption device is located between the pair of chip modules. The second mating surface of the first connecting unit and that of the second connecting unit are configured to be intimately and smoothly moveable with each other along a horizontal interfacial plane until the mating between the first mating surfaces is complete.
Reference will now be made in detail to the embodiments of the present disclosure. Referring to
The first connecting unit 1 includes an insulative enclosure 10 and a printed circuit board 11 received within the enclosure 10. The enclosure forms a first mating surface 101 and an even/smooth mating surface 102 perpendicular to each other. A pair of chip modules 12, an electrical connector 13 and an absorption device 14 are mounted upon the printed circuit board 11. The chip module 12 is directed to the second mating surface 102 in a hidden manner for the high speed signal transmission as mentioned in U.S. Pat. No. 8,909,135. The chip modules 12 function for transmission and receiving, respectively. An absorption device 14 is located between the pair of chip modules 12 for filtering noises derived from the chip modules 12.
The electrical connector 13 is located upon an edge of the printed circuit board 11 and exposed upon the first mating surface 101. The electrical connector 13 is of a magnetic attraction type for electrical transmission, and includes an insulative housing 130 with a plurality of contacts 131 and a pair of magnetic elements 132 therein. In this embodiment, the contact 131 are not resilient or moveable, and the pair of magnetic elements 132 located on two opposite sides are magnets. Anyhow, in other embodiments, the magnetic element 132 may be magnetic attraction element or electromagnet etc., alone or in combination.
The second connecting unit 2 includes an insulative enclosure 20 and a printed circuit board assembly 21 disposed in the insulative enclosure 20. The insulative enclosure 20 includes a first mating face 201 and the second mating face 202 perpendicular to each other. The printed circuit board assembly 21 includes a first printed circuit board 211 and the second printed circuit board 212 electrically connected with each other. An electrical connector 23 is located upon an edge of the first printed circuit board 211 and exposed upon the first mating face 201 while a pair of chip modules 22 and an absorption device 24 therebetween are located upon the second printed circuit board 212 and are located within the enclosure 20 and hidden under the second mating face 202. The functions of the pair of chip modules 22 are same with those of the pair of chip modules 12. The function of the absorption device 24 is same with the absorption device 14. Notably, the enclosure 20 of the second connecting unit 2 forms a recessed structure in which the first connecting unit 1 is disposed.
Similar to the electrical connector 13, the electrical connector 23 is of a magnetic attraction type for electrical transmission, and includes an insulative housing 230, and a plurality of contacts 231 and the pair of magnetic elements 232 commonly located therein, wherein the pair of magnetic elements 232 are located by two sides of the contacts 231. The contacts 231 are of the pogo pin type, Similar to the magnetic elements 132, the pair of magnetic elements 232 may be the magnets, the magnetic attraction elements or the electromagnets, etc., alone or in combination.
When the first connecting unit 1 and the second connecting unit 2 are coupled with each other, the first mating surface 101 of the first connecting unit 1 and the first mating face 201 of the second connecting unit 2 are mated with each other while the second mating surface 102 of the first connecting unit 1 and the second mating face 202 of the second mating face 202 of the second connecting unit 2 are intimately contacting and sliding with each other. Once the electrical connector 13 of the first connecting unit land the electrical connector 23 of the second connecting unit 2 are fully mated with each other via magnetic attraction derived from the pair of magnetic elements 132 and the pair of magnetic elements 232, the first mating surface 101 of the first connecting unit 1 and the first mating face 201 of the second connecting unit 2 are correctly positioned with each other, and the second mating surface 102 of the first connecting unit 1 and the second mating face 202 of the second connecting unit 2 are also correspondingly positioned with each other in an intimate sliding manner. Therefore, the chip modules 12 of the first connecting unit 1 and the chip modules 22 of the second connecting unit 2 are aligned with each other precisely, thus assuring the perfect transmission/receiving between the chip modules 12 of the first connecting unit 1 and the chip modules 22 of the second connecting unit 2.
Referring to
As shown in
As shown in
While a preferred embodiment according to the present disclosure has been shown and described, equivalent modifications and changes known to persons skilled in the art according to the spirit of the present disclosure are considered within the scope of the present disclosure as described in the appended claims.
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Number | Date | Country | |
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20180175548 A1 | Jun 2018 | US |