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1. Field of the Invention
This invention relates to assembly of electronic components, and particularly to alignment of a microprocessor board to a server chassis.
2. Description of Background
Components of electronic assemblies are often located for assembly with a peg-and-hole method. A first component is provided with two or more locating pegs and a second component is provided with two holes that correspond to the peg locations. When the holes are aligned with the pegs, the pegs are passed into the holes thus aligning the second component with the first component.
A first hole of the two holes is often of a diameter just large enough for the peg to enter and thus acts as a datum hole. A second hole is of a larger diameter to accommodate tolerances in the manufacture of the first and second components among other tolerances. Because the second hole is oversized, it allows for angular movement of the second component once it is located relative to the first component, which may not be beneficial when attempting to precisely align the two components. In some instances, the components may be aligned by using a datum hole and replacing the oversized hole with a slot, but in many cases a slot is not desired (due to manufacturing cost or other concerns).
The shortcomings of the prior art, that can only use two holes for alignment, are overcome and additional advantages are provided through the provision of an alignment tool for assembly of a microprocessor board to a server chassis including a peg hole portion receptive of a first peg of the server chassis, an orientation hole portion receptive of a second peg of the server chassis and at least one filler tab insertable between the first peg and a secondary hole of the microprocessor board.
A method of aligning a server chassis to a microprocessor board includes placing the microprocessor board, which includes a datum hole and the secondary hole, over the server chassis that a first peg extends through the secondary hole. The alignment tool is placed over the chassis pegs, and when the board is then placed on the chassis, the filler tabs are inserted into a gap between the first peg and the secondary hole.
As a result of the summarized invention, technically we have achieved a solution which is capable of precisely locating components a microprocessor board relative to a server chassis utilizing a peg and hole method without variation in relative angular position between the two components. This method is especially beneficial when alternative means for locating, such as a slotted hole or a diamond pin is not practical or feasible.
The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
The detailed description explains the preferred embodiments of the invention, together with advantages and features, by way of example with reference to the drawings.
Turning now to the drawings in greater detail, it will be seen that in
To ensure proper alignment between the server chassis 10 and the microprocessor board 14 during assembly, an alignment tool 20, as shown in
An assembly process utilizing the alignment tool 20 is shown in
As shown in
While the preferred embodiment to the invention has been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.