Claims
- 1. A metal cleaning solution comprising an alkyldione peroxide.
- 2. The metal cleaning solution according to claim 1 wherein said solution further comprises one or more alcohols.
- 3. The metal cleaning solution according to claim 1 wherein said solution further comprises dimethyl phthalate or other stabilizing agent.
- 4. The metal cleaning solution according to claim 1 wherein said alkyldione peroxide is chosen from the group containing: 2,4-pentanedione peroxide, 2,2,6,6-tetramethyl-3,5-heptanedione peroxide, 2,5-hexanedione peroxide, 2,4-hexanedione peroxide and 3,5-heptanedione peroxide.
- 5. The metal cleaning solution according to claim 1 wherein said alkyldione peroxide comprises 0.1-100% weight or volume percentage of said solution.
- 6. The metal cleaning solution according to claim 1 wherein said metal comprises copper.
- 7. The metal cleaning solution according to claim 1 wherein said metal comprises one of the group containing copper, cobalt, nickel, titanium, and titanium nitride.
Parent Case Info
This is a division of patent application Ser. No. 09/467,132, filing date Dec. 20, 1990, U.S. Pat. No. 6,132,521 Alkyldione Peroxides As Cleaning Solutions For Wafer Fabs, assigned to the same assignee as the present invention.
US Referenced Citations (6)