Claims
- 1. A material for forming heat exchangers, the material consisting of: 0.1 to 0.8 wt % of Mg; 0.2 to 1.0 wt % of Si; 0.3 to 1.5 wt % of Mn; 0.01 to 0.3 wt % of Fe; and 0.01 to 0.3 wt % of Ni, wherein the balance of material consists essentially of aluminum of purity of 99.9% or higher and 0.1 wt % or less of unavoidable impurities contained therein, and the content of Cu as one of the impurities is 0.05 wt % or less, said material being further characterized by the fact that the pinhole corrosion of the material is less than or approximately equal to 0.1 mm when immersed in an ASTM solution comprising decuple water plus 10 ppm of Cu.sup.++ at 95.degree. C. or 50.degree. C. for 500 hours.
- 2. A material as defined in claim 1, wherein the material contains 0.2 to 0.5 wt % of Mg, more than 0.4 wt % but up to 0.7 wt % of Si, 0.5 to 1.2 wt % of Mn, 0.03 to 0.15 wt % of Fe and 0.03 to 0.15 wt % of Ni.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1-300132 |
Nov 1989 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 785,863, filed Oct. 28, 1991, which is a continuation of application Ser. No. 606,712, filed Oct. 31, 1990, both abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (16)
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239995 |
Oct 1987 |
EPX |
61-166939 |
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61-272341 |
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62-128746 |
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JPX |
63-250112 |
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63-312941 |
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1-79339 |
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1-198443 |
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WOX |
Continuations (2)
|
Number |
Date |
Country |
Parent |
785863 |
Oct 1991 |
|
Parent |
606712 |
Oct 1990 |
|