The invention relates to bodies of metal, hard metal, cermet, ceramic or semiconductor material, which are coated with an Al2O3 layer or a multi-layered coating system that contains at least one Al2O3 layer, and to methods for the coating of such bodies. The inventive layer is eminently suitable as an anti-wearing layer, for example for the coating of Si3N4 and WC/Co indexable inserts. However, the layer may also be applied as an electrically insulating layer on various structural elements, such as, for example, electrical penetrations.
Aluminum oxide (Al2O3) exists not only as the thermodynamically stable α-Al2O3 phase but ,also as a series of metastable polymorphs, such as, for example, κ-, θ-, γ-, δ-, η- and χ-Al2O3.
For the production of aluminum oxide layers, chemical vapor-phase deposition (CVD) and physical vapor-phase deposition (PVD) among other techniques are used. In this connection, the occurrence of the α-, κ-, θ- or γ-Al2O3 phases is reported, depending on the process conditions.
In the case of the thermal CVD process, which is widely used industrially and which works conventionally with CO2 as an oxygen precursor, the κ-Al2O3 phase predominates in addition to the stable α-Al2O3 phase. Both modifications can be deposited in controlled manner by modern CVD technology, as shown, for example, in U.S. Pat. Nos. 5,137,774 and 5,700,569. Furthermore, according to EP 1 122 334 B1, the production of pure γ-Al2O3 layers by use of H2S dopant and selective temperature control of the thermal CVD process is also known. If the plasma-assisted CVD (PACVD) or PVD variants are used as the coating process for the production of Al2O3 layers, as described in the patents EP 1 034 319 B1 and EP 1 253 215 B1, γ- or α-Al2O3 layers as well as mixtures of the two modifications are formed. The same is also true for the Al2O3 layers described in the literature that were produced by means of metalloorganic CVD (MOCVD) (see S. Blittersdorf, N. Bahlawane, K. Kohse-Höinghaus, B. Atakan, J. Müller, Chem. Vap. Deposition 9 (2003) 194-198).
If the layers consisting of various aluminum oxide modifications are compared with one another, it is found that the thermodynamically stable α-Al2O3 phase produced by means of thermal CVD at temperatures >1000° C. has the highest hardness of around 27 GPa. The κ-Al2O3 layer produced by means of thermal CVD has a somewhat lower hardness with values of around 25 GPa. High hardness values and good wearing properties are also reported for γ-Al2O3 produced by means of PVD or plasma-assisted CVD (see WO 99/24634 and U.S. Pat. No. 5,879,823). For the γ-Al2O3 layers produced by means of thermal CVD according to EP 1 122 334 B1, a high hardness of around 27 GPa is also reported. According Larsson and Ruppi (A. Larsson, S. Ruppi; Int. J. Refr. Metals & Hard Materials 19 (2001) 515-522), however, these layers exhibit, in the wear test, insufficient adhesion, which may possibly be attributed to too much inclusion of sulfur in the layer. Nevertheless, a high concentration of the H2S dopant is a prerequisite for the achievement of the γ-Al2O3 modification by means of thermal CVD.
The θ-Al2O3 modification seldom occurs in CVD and PVC) layers, and then only as a small proportion in phase mixtures with α-Al2O3 (see I. Nasution, A. Velasco, H. Kim; J. of Crystal Growth 311 (2009) 429-434). As investigations of Chatfield, Lindström and Sjöstrand (C. Chatfield, J. N. Lindström, M. E. Sjöstrand, J. Phys. C5 (5) (1989) 377-387) show, the θ-Al2O3 modification in phase mixture with α-Al2O3 is then formed mainly at interfaces with the substrate.
According to the state of the art, exclusively the precursor system AlCl3-CO2-H2 is used for the industrial deposition of aluminum oxide layers by means of CVD. This system offers the possibility of producing aluminum oxide modifications selectively by addition of dopants such as H2S and by selection of the CVD temperature window. The formation of water necessary for the formation of aluminum oxide takes place in situ from CO2 and H2. However, this process yields the reactant H2O in sufficient quantities only at temperatures above 900° C., from which the high CVD temperatures result.
The use of N2O as the oxygen precursor instead of the conventionally used CO2 is also known from some literature sources (B. Aspar, B. Armas, C. Combescure, D. Thenegal; J. de Phys. IV 1991, 1 (Coll.C2), 665-670 and C. Labatut, C. Combescure, B. Armas; J. de Phys. II 1993, 3 (Coll.C3), 589-596). The layers produced in this way consist of a mixture of α- and θ-Al2O3 at a deposition temperature of 1000° C. and exclusively of the stable α-Al2O3 phase at higher deposition temperatures. A disadvantage for industrial production is the very low deposition pressure of only 133 Pa in this process.
Heretofore it has been assumed that γ-Al2O3 can be obtained only by the low-temperature coating processes of PACVD, MOCVD and PVD as well as, in the case of thermal CVD, by addition of higher dopant concentrations of H2S.
The task of the invention is to coat bodies of metal, cermet, ceramic or semiconductor material with one or more Al2O3 layers, which are characterized by a high hardness >27 GPa and a better wear resistance in comparison with conventional Al2O3 layers and which can be produced inexpensively.
This task is accomplished with the features of the patent claims, wherein the invention also includes even combinations of the individual independent claims within the meaning of an AND operator.
The inventively coated bodies are characterized in that the Al2O3 layer consists completely or predominantly of a phase mixture of θ (theta) aluminum oxide and γ (gamma) aluminum oxide.
If the Al2O3 layer does not consist completely of the phase mixture of θ (theta) aluminum oxide and γ (gamma) aluminum oxide, the layer may also contain, according to the invention, α (alpha)-Al2O3 or κ (kappa)-Al2O3.
According to an expedient configuration of the invention, the Al2O3 layer contains 5 to 30% by mass of θ aluminum oxide.
The inventive Al2O3 layer may also have a gradient with respect to the θ aluminum oxide content.
In the case of a multi-layered coating system of several Al2O3 layers with the phase mixture of θ aluminum oxide and γ aluminum oxide, the individual Al2O3 layers may, according to the invention, have different mass ratios of θ aluminum oxide to γ aluminum oxide.
Multi-layered coating systems of one or more Al2O3 layers with the phase mixture of θ aluminum oxide and γ aluminum oxide may, according to the invention, contain one or more further layers. The additional layers may be chosen from the group of materials α (alpha) Al2O3, γ-Al2O3, κ (kappa)-Al2O3, TiN, TiCN, TiC, TiAlN, TiAlCN, SiC and Si3N4.
The inventive Al2O3 layers with the phase mixture of θ aluminum oxide and γ aluminum oxide are characterized in that they have a fine crystalline structure with a crystallite size <200 nm. Layer thicknesses between 0.1 μm and 30 μm are advantageous.
By virtue of the fine crystalline structure, the inventive Al2O3 layer has small roughness and thus permits a high surface quality in chip-removing machining. Because of the fine-grained surface morphology, the post-treatment otherwise necessary according to the state of the art, meaning subsequent smoothing of the coarse crystalline aluminum oxide layers, can be dispensed with. The grain size of the inventive Al2O3 layer in the nanometer range additionally permits a higher coating quality of tools or bodies with sharp edges. Multi-layered structures permit a higher crack resistance under mechanical load. The inventive layer, which consists completely or predominantly of the nanocrystalline phase mixture of γ- and θ-Al2O3, has a surprisingly high hardness of up to 28 GPa. Higher hardnesses for Al2O3 have not been known heretofore. Because of the high electrical resistance, the layer also has a high application potential for components with thin insulating layers, such as, for example, penetrations.
For the production of bodies coated in this way, the invention includes a process in which the bodies are coated by means of a thermal CVD process without plasma excitation at temperatures between 700° C. and 1050° C. and pressures >0.2 kPa, wherein N2O is used as oxygen precursor and one or more aluminum halides are used as Al precursor.
The CVD process is advantageously carried out at temperatures between 850° C. and 1050° C. and pressures between 0.5 kPa and 2.0 kPa.
The inventive process surprisingly permits the production of novel metastable phase mixtures, consisting of θ- and γ-Al2O3, by means of thermal CVD. Codeposition of these phases has been made possible by use of a precursor system, which uses N2O as the oxygen precursor instead of the conventionally used CO2. It has been found to be advantageous that fine-grained layers can be produced with high deposition rates at deposition temperatures as low as 850° C. Higher deposition rates than according to the state of the art are achieved with this layer system, especially in the industrially interesting medium temperature range of 850° C. to 950° C. These lower deposition temperatures also permit the coating of more temperature-sensitive substrates.
The invention will be explained in more detail in the following by means of exemplary embodiments and the associated figures. The figures show:
Firstly a 1 μm thick TiN bonding layer and then the inventive layer is applied by means of a CVD process on Si3N4 ceramic indexable inserts.
The coating process is carried out in a hot-wall CVD reactor with an inside diameter of 75 mm. A gas mixture consisting of 66% by volume H2, 3.0% by volume N2O, 1.5% by volume AlCl3, 1.5% by volume H2S, 12% by volume N2 and 16.5% by volume Ar is used at a temperature of 1030° C. and a pressure of 0.5 kPa. After a coating time of 180 minutes, a 4.5 μm thick layer is obtained.
This layer was investigated by means of x-ray thin-film analysis at grazing incidence (see x-ray diffractogram in
The determination of the chemical composition by means of EDX (see
Microhardness measurements with a Vickers indenter yielded a high hardness of 26.7±0.6 GPa.
The inventive layer consists of a phase mixture of γ- and θ-Al2O3. It is characterized by a smooth, homogeneous surface, by a fine-grained structure with a crystallite size smaller than 60 nm, and by the high hardness.
The inventive layer is applied by means of a CVD process on WC/Co hard metal indexable inserts with a precoating consisting of 1 μm TiN and 2 μm TiCN.
The coating process is carried out in a hot-wall CVD reactor with an inside diameter of 75 mm. With the use of a gas mixture consisting of 66% by volume H2, 2.5% by volume N2O, 2.5% by volume AlCl3, 12% by volume N2 and 17% by volume Ar, a layer of γ- and θ-Al2O3 is obtained with a deposition rate of 0.9 μm/h at a temperature of 920° C. and a pressure of 1 kPa.
The composition of the layer was investigated by means of x-ray thin-film analysis at grazing incidence (see x-ray diffractogram in
In the transverse ground section of the sample (see
The chemical composition was determined by means of EDX (see
Microhardness measurements with a Vickers indenter yielded a high hardness of 27.8±0.7 GPa.
The inventive layer consists of a phase mixture of γ- and θ-Al2O3 and is characterized by a smooth, homogeneous surface, by a fine-grained structure with a crystallite size smaller than 200 nm and by the high hardness.
The inventive layer is applied by means of a CVD process as an insulating layer for electrical penetrations on a bar of steel 1.4541 with a 1 μm thick TiN precoating.
The coating process is carried out in a hot-wall CVD reactor with an inside diameter of 75 mm. A gas mixture consisting of 66% by volume H2, 3.0% by volume N2O, 1.5% by volume AlCl3, 13.5% by volume N2 and 16.5% by volume Ar is used at a temperature of 850° C. and a pressure of 0.5 kPa. After a coating time of 10 h, a 10 μm thick layer is obtained.
The composition of the layer was determined by means of x-ray thin-film analysis at grazing incidence (see x-ray diffractogram in
The measurement of the specific electrical resistance yielded a value >1014 Ωcm.
The inventive layer consists of a phase mixture of γ- and θ-Al2O3. It is electrically insulating and is characterized by a high specific resistance, by a smooth, homogeneous surface and by a fine-grained structure with a crystallite size smaller than 150 nm.
Number | Date | Country | Kind |
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10 2009 028 577.6 | Aug 2009 | DE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP2010/061605 | 8/10/2010 | WO | 00 | 2/6/2012 |